Abstract: A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.

Abstract: A circuit substrate which is capable of decreasing the possibility that the amount of solder in the overall mounting land is uneven and reducing formation of a solder void even when a mounting terminal has a large soldering area. An electronic component having the mounting terminal is mounted on the circuit substrate. A mounting land is connected to the mounting terminal of the electronic component by soldering, and the mounting land has a protruding portion of an insulating material formed so as to protrude from an outer side of the mounting land toward an inner side of the mounting land, and the protruding portion does not divide the mounting land into a plurality of areas.

Abstract: A circuit board assembly includes a first shield positioned over a top surface of a printed circuit board and a second shield positioned over a bottom surface. The first and second shields include conductive tabs which are coupled to a first side surface of the circuit board, wherein the tabs of the first shield are generally interposed or staggered with the tabs of the second shield.

Abstract: This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.

Abstract: A mounting block is provided that has a multi-level upper surface that is used to mount one or more IC chips and the printed circuit board (PCB) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the PCB and/or with the other IC chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the PCB and the known height of at least one of the IC chips such that when the chip and the PCB are mounted on the mounting block, the distance between the contact pads of the PCB and the contact pads of the IC chip is very small, thereby allowing the lengths of the bond wires to be kept very short.

Abstract: A vibration damping circuit card assembly includes a populated circuit card having a mass M. A closed metal container is coupled to a surface of the populated circuit card at approximately a geometric center of the populated circuit card. Tungsten balls fill approximately 90% of the metal container with a collective mass of the tungsten balls being approximately (0.07) M.

Abstract: An electrical bushing is disclosed for use in high voltage cryogenic applications. The bushing including first and second bushing portions and an electrical conductor disposed longitudinally within the portions. The electrical conductor has a first terminal extending from the first bushing portion and a second terminal extending from the second bushing portion. The first terminal is configured to couple to a first electrical element at ambient temperature, and the second terminal is configured to couple to a second electrical element at cryogenic temperature. The first and second bushing portions comprise a base insulator material, while the first bushing portion further comprises an environmental protection layer disposed over the base insulator portion.

Abstract: A cable backplane system includes a plurality of cable connectors interconnected by cables, each cable connector having a header holding signal contacts at a mating end of the header configured for mating with a card connector. A cable tray having side walls surrounds a cavity defining a raceway for the cables. The cable tray has a front edge and holds header frames between the side walls. The header frames hold headers of corresponding cable connectors. An organizer plate is coupled to the cable tray at the front edge. The organizer plate has a plurality of connector channels receiving mating ends of corresponding headers. The connector channels hold the headers in position relative to one another.

Abstract: A cable backplane system includes cable connectors having cables extending therefrom. Each cable connector has a header holding signal contacts at a mating end of the header configured for mating with a card connector. The cable backplane system includes a cable tray having side walls surrounding a cavity defining a raceway for the cables. The cable tray has a front edge. A plurality of connector bricks are received in the cable tray. The connector bricks each having a header frame comprising end spacers and side spacers defining a header opening receiving a plurality of the cable connectors. The end walls hold the headers of corresponding cable connectors. The side spacers have guide paddles extending from a front of the side spacers forward of the cable connectors.

Abstract: An illustrative electronic assembly includes a housing and a wall plate, where the wall plate is releasably connectable to the housing. The housing and the wall plate may be configured such that the housing and the wall plate may be able to initially engage each other with the wall plate misaligned relative to the housing. The housing and the wall plate may be configured to guide one another into alignment as the housing and the wall plate are moved together.

Abstract: A printed circuit has a creep suppressor and a stack of metallization layers separated by electrically insulating layers. A metallization layer arranged above the insulating layer at least partially covers a cavity formed in the latter's top face. Prepreg arranged directly on the insulating layer below the metallization layer bonds the layers together. A magnetic core is housed in the cavity leaves at least a five micrometer gap between the cavity's vertical walls and roof and the core's facing vertical and top faces. During stack assembly, the creep suppressor prevents prepreg from flowing, by creep, into the cavity until it contacts more than 20% of the core's top face.

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

Abstract: The present invention provides a system and a method which enable an increase in signal transmission speed and stable operation, without incurring the likes of restrictions on the manufacturing of circuit boards. A transmission system includes an AC terminal connector, having an AC termination circuit including a resistor and a capacitor, at the open ends of through hole stubs provided in a circuit board.

Abstract: A docking station for an electronic device includes a station body to which the electronic device is detachably docked, at least one locking unit comprising a hook member to move between a first position in which the station body and the electronic device are connected and a second position in which the station body is separated from the electronic device, and a lock maintaining unit to maintain the hook member in the first position.

Abstract: A through-hole stub AC termination circuit including a resistor and a capacitor, is connected to an open end of a stub of a through-hole provided in a circuit board.

Abstract: A server system includes an array of server cells. Some or all of the server cells include a set of at least three side panels forming an enclosure and a compute component comprising a processor core. At least one side panel of each server cell is removably mechanically coupled and removably electrically coupled to a facing side panel of an adjacent server cell. The enclosure may form a triangular prism enclosure, a cuboid enclosure, a hexagonal prism enclosure, etc. The enclosure can be formed from a rigid flex printed circuit board (PCB) assembly, whereby the side panels are implemented as rigid PCB sections that are interconnected via flexible PCB sections, with the flexible PCB sections forming corners between the rigid PCB sections when the rigid-flex PCB assembly is folded into the enclosure shape. The compute component and other circuit components are disposed at the interior surfaces of the rigid PCB sections.

Abstract: An aggregator for interconnecting a hydra with an breakout box, said aggregator comprising: (a) a bottom wall, two sides walls, and at least one faceplate; (b) adapters for multi-conductor connectors arranged in at least one column on said faceplate; and (c) wherein at least two adapters of each column are secure adapters.

Abstract: The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

Abstract: An electronic device including a first body, an input module and a second body is provided. The first body has a positioning structure. The input module is slidably disposed on the first body and positioned at a first position by the positioning structure. The second body is pivoted with the first body. When the second body is expanded relative to the first body to obtain a first included angle between the first body and the second body, the second body drives the positioning structure to release the input module, such that the input module is capable of sliding from the first position to a second position relative to the first body and separating from the positioning structure.

Abstract: Provided are a display device and a method of manufacturing the same. The display device includes a display panel having one surface and the other surface, a main drive board formed on the other surface of the display panel, a flexible circuit board having one end electrically connected to the one surface of the display panel and the other end electrically connected to the main drive board and having a bent portion formed at a lateral surface of the display panel, and a board support portion formed on an inner surface of the flexible circuit board.