Abstract: An electronic device may have circuitry mounted on a printed circuit board. The circuitry may include electronic components such as integrated circuits, sensors, and switches that are sensitive to bending-induced stress in the printed circuit board. An overmolded plastic stress concentrator may be overmolded over the printed circuit board and the circuitry on the printed circuit board. A flexible plastic body may be used to enclose the stress concentrator and printed circuit board. The plastic body, stress concentrator, and printed circuit board may be elongated along a longitudinal axis. The stress concentrator may have unbent regions in which the printed circuit board is prevented from flexing and enhanced flexibility regions. Sensitive circuitry may be located in the unbent regions to prevent the sensitive circuitry from being exposed to bending stress.

Abstract: The present invention relates to an array substrate assembly and a display device. The array substrate assembly comprises a substrate; a first metal line formed at one side of the substrate; an insulating layer formed on the first metal line; a second metal line formed on the insulating layer, wherein one end of the second metal line connected with a driving circuit is formed with a second terminal, wherein in a thickness direction of the substrate, a distance between a surface of the second terminal away from the one side of the substrate and the substrate is less than a distance between a surface of the second metal line away from the one side of the substrate and the substrate. The display device includes the array substrate assembly.

Abstract: A dynamically flexible article or device, such as an armband, includes a flexible electronic component, such as a flexible electronic display, and a flexible support structure coupled to the flexible electronic component, wherein the flexible support and the flexible electronic component are flexible along two dimensions to thereby be able to conform to a complex curved surface. The flexible support includes bending limiting structure that constrains bending of the flexible electronic component to prevent undesirable bending.

Abstract: Provided is an electronic apparatus having the waterproof structure. The electronic apparatus includes: a housing; a transparent panel which has an image display area; and a plurality of strip-shaped waterproof spacers fixed adherently between the housing and the transparent panel, and fixed adherently to an outer periphery of the image display area at the transparent panel side. A clearance between the waterproof spacers adjacent to each other is filled with a filler. In the electronic apparatus, a hole is formed in the housing such that the hole overlaps with the clearance and a portion of the waterproof spacer, and the hole is filled with the filler.

Abstract: First electrode pads formed on one semiconductor package surface include a first reinforcing electrode pad having a surface area larger than that of other first electrode pads. Second electrode pads formed on a printed wiring board on which the semiconductor package is mounted include at least one second reinforcing electrode pad. The second reinforcing electrode pad opposes the first reinforcing electrode pad, and has a surface area greater than that of the other second electrode pads. The first and second electrode pads are connected by solder connection parts. A cylindrical enclosing member encloses an outer perimeter of a solder connection part connecting the first and second reinforcing electrode pads. Increases in the amount of warping of semiconductor devices such as the package substrate and the printed wiring board are suppressed, and the development of solder bridges with respect to adjacent solder connecting parts or adjacent components is reduced.

Abstract: An electrical connector (100) for positioning a heat sink assembled on the electrical connector and for soldering to a substrate includes an insulating housing (1) with a plurality of electrical contacts (4) received therein and a position member assembled to the insulating housing (1), the position member includes an interlock member (2) and a soldering member (3) assembled together, the interlock member (2) includes an assembling portion (21) and an extending portion (22) extending upwardly from the assembling portion (21) for hooking with the heat sink, the soldering member (3) includes a body portion (31) and a pair of soldering portions (32) extending downwardly from the body portion (31) for soldering to the substrate.

Abstract: A cabinet frame enclosure is provided having a first side wall, a second side wall, a first opening and a second opening each in combination defining an interior space for accommodating a plurality of equipment, the equipment being removable through the first opening.

Abstract: A multi-layered film includes: a plate-like flexible base member; first inorganic members that are each plate-like and arranged on the base member in separation from each other in a direction parallel to a main surface of the base member; a first organic member provided on the base member so as to be positioned between each adjacent two first inorganic members and surround each first inorganic member; a second inorganic member that covers an upper surface and lateral surfaces of the first organic member; and a second organic member that is provided on or above the first inorganic members, and is surrounded by the second inorganic member. Each lateral surface portion of the second inorganic member covering a corresponding lateral surface of the first organic member is thinner than each first inorganic member and each upper surface portion of the second inorganic member covering a corresponding portion of the upper surface.

Abstract: A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, a pair of first external electrodes and a pair of second external electrodes formed on both side surfaces of the ceramic body and extended to portions of a mounting surface of the ceramic body, and first and second internal electrodes alternately stacked, having the dielectric layer therebetween, exposed through at least one side surface of the ceramic body, and connected to the first and second external electrodes, respectively; and an interposer substrate including an insulation substrate bonded to the mounting surface of the multilayer ceramic capacitor, and first and second connection terminals formed on the insulation substrate and connected to the first and second external electrodes, respectively.

Abstract: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.

Abstract: Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.

Abstract: The present invention relates to an electric and/or electronic circuit including a printed circuit board (20), at least one separate circuit board (10) and at least one power connector (12) for said printed circuit board (20). The at least one power connector (12) is connected or connectable to a corresponding counterpart. A number of electric and/or electronic components (22) is sold at the separate circuit board (10). The at least one separate circuit board (10) is connected to the printed circuit board (20) by a number of solder joints (16). The solder joints (16) are connected to the separate circuit board (10) by a through-hole-technology. The solder joints (16) are connected to the printed circuit board (20) by SMD (surface mount device) technology. At least one power connector (12) is fastened at the separate circuit board (10) by the through-hole-technology.

Abstract: An electronic assembly includes an electronic module, a rigid board, a first flexible board, a second flexible board and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connection end and a first pad arrangement at the first connection end. The first pad arrangement has a plurality of first pads. The second flexible board is connected to the rigid board and has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement has a plurality of second pads. The first pads are structurally and electrically connected to the second pads through the conductive adhesive layer.

Abstract: This frame for a touch-sensitive control interface comprises a peripheral border designed to surround all or some of the touch-sensitive interface and a central zone by which the interface can be activated by touch. It comprises at least one hollow zone delimiting a surface for receiving a finger of a user.

Abstract: An electronic component includes: a laminate busbar structure comprising at least two busbar layers separated by an insulating layer; a transistor connected to the laminate busbar structure on a first side thereof; and a capacitor that is mounted on the first side of the laminate busbar structure and is positioned further away from the laminate busbar structure than the transistor, the capacitor having respective planar terminals parallel to each other and perpendicular to the laminate busbar structure, each of the planar terminals comprising a rectangular member with one side thereof connected to the capacitor and an opposite end connected to a corresponding one of the busbar layers.

Abstract: An improved power distribution network for an integrated circuit package that reduces the number of power supply pins that are used in the pin array and achieves better operating performance. In a preferred embodiment, the ratio of power supply pins to input/output (I/O) pins is in the range of approximately 1 to 24 to approximately 1 to 52. In this embodiment, the integrated circuit package comprises a substrate, an integrated circuit mounted on the substrate, a first decoupling capacitor mounted on the substrate, and a second decoupling capacitor formed in the integrated circuit. The package is formed by coupling a power supply pin to both the first and second capacitors by a low frequency path and a DC path, respectively, and the first and second capacitors are coupled by a high frequency path.

Abstract: A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body, a plurality of first and second internal electrodes formed to be alternately exposed to both side surfaces of the ceramic body, having a dielectric layer therebetween, and first and second external electrodes connected to the first and second internal electrodes, respectively; and an interposer board including an insulation board coupled to the mounting surface of the multilayer ceramic capacitor and first and second connection terminals formed on the insulation board and connected to the first and second external electrodes, respectively.

Abstract: An air conditioner includes a control box assembly capable of efficiently utilizing a space inside a control box and easily performing inspection and repair of a circuit unit disposed in the control box. The air conditioner includes a case that constitutes an exterior and a control box assembly mounted in the case, wherein the control box assembly includes a control box in which an accommodation portion is formed, a sliding panel having one side on which a circuit unit is mounted and being accommodated in the accommodation portion so as to be taken out of the control box, and a rotation panel having one side on which the circuit unit is mounted and being rotatably mounted at one side of the control box.

Abstract: A display device is provided and includes: a display portion; a storage member configured to house the display portion and including an opening through which the display portion passes; a plurality of cover members configured to cover the opening and to travel from the opening to a region of the storage member adjacent to the opening so as to be folded up and overlapped with each other at the region; and travel control means configured to cause the plurality of cover members to transfer to a first condition in which the opening is closed by the plurality of cover members and also to a second condition in which the plurality of cover members are folded up and overlapped with each other.