Abstract: According to one embodiment, a substrate unit includes an electronic circuit substrate which includes a first width dimension portion, and a second width dimension portion continuous with the front direction side of the first width dimension portion. A first concave portion is formed on the first direction side of the first width dimension portion and a second concave portion is formed on the second direction side of the first width dimension portion in the electronic circuit substrate. The substrate unit includes a heat sink which includes a first side frame portion fixed to the first width dimension portion from the first concave portion, a second side frame portion fixed to the first width dimension portion from the second concave portion, and a sink main body portion continuous from the first side frame portion to the second side frame portion.

Abstract: An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.

Abstract: An electronic apparatus includes a first chamber in which a heat generator is arranged and a second chamber separated with a partition from the first chamber. The electronic apparatus is provided with a first cabinet having the partition and an isolation wall that encloses to seal the first chamber, a second cabinet enclosing the second chamber and having an intake port and an exhaust port, a thermoconductive member arranged in the first chamber and connected thermally to the heat generator and to the partition, a heat collecting-radiating member arranged in the second chamber and connected thermally to the partition, and an air blower arranged in the second chamber so as to circulate the air in the second chamber.

Abstract: A cooling structure of a capacitor includes a snubber capacitor in which lead terminals are joined to external electrodes of a laminated ceramic electronic component; a circuit board which is for mounting the snubber capacitor and semiconductor switching elements; and a heat dissipation plate which is made of metal that dissipates the heat generated in the circuit board. The cooling structure of the capacitor is configured such that an insulating member having a high coefficient of thermal conductivity intervenes between the snubber capacitor and the heat dissipation plate.

Abstract: An electronic device is disclosed for coupling to a target platform, which includes a multitude of pad contacts. The electronic device includes a substrate, a multitude of pad contacts on the substrate, and a multitude of contact regions in one of the of pad contacts on the substrate. Each of the multitude of pad contacts on the substrate electrically couples to a corresponding one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled. The multitude of contact regions corresponds to one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled.

Abstract: In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.

Abstract: The semiconductor device includes a plurality of semiconductor packages stacked on one another. Each semiconductor package includes a main current electrode terminal disposed in a case section of the semiconductor package, the main current electrode terminal being exposed outside the case section to be electrically connected to an external power supply. The main current electrode terminal extends in the stack direction of the semiconductor packages, and embedded in the case section at a surface portion thereof facing an external surface of the case section. Both end surface portions of the main current electrode terminal in the stack direction respectively reach end surface portions of the case section in the stack direction so that the main current electrode terminals of each adjacent two of the semiconductor packages are in contact with each other when the semiconductor packages are stacked on one another in the stack direction.

Abstract: A power outlet box for housing electronics and powering electronic displays suspended in a retail environment may include a first housing portion including a first set of vertical support features and a second set of vertical support features. A second housing portion may include a third set of vertical support features and a fourth set of vertical support features. The power outlet box may have (i) a closed configuration when the first and third sets of vertical support features are aligned and (ii) an open configuration when the second and fourth set of vertical support features are in contact with one another. The second set of vertical support features may be adapted to support the fourth set of vertical support features when the power outlet box is in the open configuration. A power supply device may be fixedly positioned within the power outlet box when in the closed configuration.

Abstract: A cable management system is provided that includes a cable management rack for accommodating a heat generating device, a first baffle mounted with respect to a first upright of the rack and for redirecting a rearward flow of cool air sideways from a space adjacent a front side of the rack, and/or a second baffle mounted with respect to a second upright of the rack and for redirecting a sideways flow of exhaust air from the rack and through the second upright into a space adjacent a rear side of the rack. A method of cooling a heat-generating device mounted in or on a cable management rack includes providing a sideways flow of cooling air into the rack and into the device.

Abstract: A weatherproof box enclosure adapted to be secured on one of an outside wall and roof location of a multi-tenant building structure supporting roof-mounted solar panel or wind turbine generators including a multiple pole control unit receiving and distributing received alternating current voltages from the generators, which is disengagable by a normally open override switch when supplied voltages fall below a predetermined level, when servicing of the components of the safety box enclosure is to be had, and automatically in the event of an emergency as representative of a closing of the override switch by a ground level control.

Abstract: A power converter module has a first liquid-cooled heat sink, a busbar arrangement having at least two busbars which are electrically insulated from one another and at least one power semiconductor module which is mechanically connected to the first liquid-cooled heat sink for thermal conduction and electrically connected to connections of the power converter module by the busbar arrangement. A second liquid-cooled heat sink is positively or non-positively connected to the busbar arrangement. A thermally conductive and electrically insulating layer is disposed between an upper busbar of the busbar arrangement and the second liquid-cooled heat sink. Additional power loss arising in the busbar is dissipated by the second liquid-cooled heat sink, which is pressed with a clamping elements on a surface of the upper busbar.

Abstract: An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.

Abstract: Disclosed is a docking station mountable in an environment such as a vehicle. The docking station is configured to accept a computerized tablet and to provide to such tablet a power source for operation and recharging of the tablet. Also disclosed is a docking station configured for communicating with the tablet for disseminating the data, video and/or audio content of the tablet to other receivers, such as headphones or vehicle audio system. Similarly, other appliances, such as a channel controller, gaming controller, mouse of a keyboard, may be configured to control the tablet while it is docked. The docking station is configured to allow the user to position the tablet for optimal viewing.

Abstract: A rack housing that accommodates a plurality of fanless, plug-in components includes a plurality of plug-in positions that accommodate the plurality of fanless, plug-in components in a first region of the rack housing bordering a first housing side, at least one installation chamber that accommodates at least one add-on component with at least one fan, and at least one low-pressure chamber in a second region of the rack housing bordering the first region, wherein 1) first openings are provided between the low-pressure chamber and the plug-in positions, which openings allow a discharge of air heated by the plug-in components into the low-pressure chamber, 2) the at least one installation chamber and the at least one low-pressure chamber are essentially decoupled from each other with respect to cooling air, and 3) the installation chamber is connected to the low-pressure chamber via at least one connector for forced ventilation.

Abstract: An electronic device includes an enclosure. The enclosure includes a motherboard area and a power supply area adjacent to the motherboard area, which are both located at a first end of the enclosure, a hard disk drive area for mounting hard disk drives at a second end of the enclosure, and a fan area arranged between the motherboard area and the hard disk drive area.

Abstract: A switching module is for connecting a Pulse Width Modulation (PWM) device to a plurality of fans under test. The switching module includes a print circuit board (PCB), and a plurality of groups of signal connectors arranged on the PCB. Each group of signal connectors includes a first port, a second port, and a third port interconnected with each other. The first port is for connecting to a testing port of an external PWM device. The second port is for connecting one corresponding fan of the plurality of fans. The third port is for connecting an interface of a server motherboard.

Abstract: The present invention relates generally to a heat sink comprising a plurality of fins, each fin having two or more prongs extending from a root section of the fin. In certain embodiments, the heat sink may be assembled by aligning the plurality of fins within slots between protrusions extending from a base of the heat sink. However, in other embodiments, the plurality of fins may have connector ends having female sides and opposite male sides, wherein the plurality of fins may be attached to each other via the interlocking female and male sides, thereby forming at least part of the base of the heat sink, and fortified with reinforcing members.

Abstract: A lap cushion, for supporting an electronic device on a users lap, provides thermal insulation and cooling airflow between the electronic device and the user. The cushion further includes a shield positioned between the top surface and the electronic device where the shield is electrically-conductive and electrically-grounded so as to provide radiation absorption of RF electromagnetic radiation emanating from the electronic device.

Abstract: A circuit breaker panel includes a number of circuit breaker modules each having a number of connectors, a plurality of circuit breakers and a circuit structure supporting the circuit breakers and electrically interconnecting the circuit breakers with the number of connectors. The panel also includes a monitoring module having a connector and a monitoring circuit to monitor at least one line voltage and, for each of the circuit breakers, at least one load voltage. The panel further includes a frame having a first connector for the monitoring module connector, a number of second connectors for the circuit breaker module connectors, and a number of third connectors for outputs from the circuit breaker modules. Conductors are connected to the connectors. Any of the monitoring module and the number of circuit breaker modules can be installed into or removed from the frame without change to the conductors.

Abstract: A modularly constructed power converter arrangement has two end-side elements and at least one power converter module arranged therebetween. One end-side element has, a fan of an air cooling device, while the other end-side element has, aligned with the fan, cutouts acting as air passages. At least one end-side element has an electrical connection device. The at least one power converter module has, as part of the cooling device, a heat sink, through which air can flow from one end-side element to the other and on which is arranged at least one power semiconductor module connected to a control device and to a capacitor device. For this purpose, the at least one power converter module has a housing, which is open at the end sides and which can be connected in each case at the end sides to an end-side element or a further power converter module.