Abstract: An electronic display which can be mounted above a paved surface in an outdoor environment. A surface or plate is placed behind the electronic display to define a gap where cooling air can be drawn through said gap in order to cool the electronic display. A plurality of ribs may be placed within the gap and in thermal communication with the electronic display. The density of the ribs may be varied according to the inlet and exhaust openings for the cooling air. The ribs may be placed at a higher density near the exhaust to account for the increase in temperature of the cooling air as it travels through the gap.

Abstract: An electronic apparatus includes a body frame, a rear frame which is pivotably attached to the body frame, a hole which is formed in a front wall of the body frame, a first heat dissipating member which is placed on the front wall to cover the hole, a thermal conductive member which contacts a portion of the first heat dissipating member at a storage space side and is placed in the hole, a semiconductor chip which is placed on the rear frame, and a second heat dissipating member which is placed on the rear frame to be in contact with the semiconductor chip and receive heat from the semiconductor chip. The second heat dissipating member being in contact with the thermal conductive member in the storage space when the rear frame closes an opening at the rear side of the body frame.

Abstract: A loadcenter is equipped with a unitary neutral bus bar capable of receiving AFI and GFI circuit breakers having either a plug-on-neutral connection or a wire-neutral connection. The neutral bus bar is connected to line neutral and has a rolled rail that is formed by rolling an end of a conductive plate and bending the plate at a transition portion to position the rolled rail above and at an angle of a major flat surface of an extension of the neutral bus bar. Wire-capture apparatuses secured along an edge of an extension of the neutral bus bar can capture wires from circuit breakers that lack an internal connection to a neutral plug-on mounting jaw or that lack a neutral plug-on mounting jaw altogether.

Abstract: Apparatuses for compressing a thermal interface material between a heat generating electrical component and a cooling electrical component are provided. Embodiments include a draw rod coupled at one end to the cooling electrical component, the draw rod passing through the heat generating electrical component; wherein the draw rod includes a pin on the end opposite the end coupled to the cooling electrical component; and a rotatable latch coupled to the heat generating electrical component, the rotatable latch including a hook at one end; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages the pin of the draw rod such that the thermal interface material adhered to the heat generating component is coupled to the cooling electrical component.

Abstract: Various embodiments provide safety disconnect systems for a power system. In one aspect, a safety disconnect system includes an enclosure operative to receive a plurality of input power lines into the enclosure and provide a plurality of output power lines out of the enclosure. Each input power line is coupled to and paired with a corresponding one of the output power lines, where each input power line and output power line is operative to provide power from a power source. A plurality of switches are provided in the enclosure, each of these switches coupled between an associated one of the pairs of input power line and output power line, and each switch operative to disconnect the associated input power line from the corresponding output power line.

Abstract: A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

Abstract: A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point.

Abstract: A board coolant jacket jig system includes a main frame that includes a board installation stand on which a board is installed, and a coolant jacket separation unit that is coupled to the main frame and selectively coupled to the coolant jacket coupled to the board, to separate the coolant jacket.

Abstract: A cover plate assembly and an electrical box are provided for mounting one or more electrical wiring devices. The cover plate assembly can be modified to provide a single gang, double gang or triple gang assembly for mounting the wiring devices. The cover plate assembly includes a collar forming a mud ring having at least one removable portion which can be removed to form an open side of the collar. An adapter is attached to the cover plate assembly at the open side of the collar to enlarge the dimensions of the collar to receiving a plurality of electrical wiring devices.

Abstract: A module board has a configuration in which a first circuit board, a first composite sheet, a second circuit board, a second composite sheet, and a third circuit board are laminated in this order. Inspection terminals are arranged in a matrix shape in a predetermined region on an upper surface of the third circuit board. Electronic components are mounted on the first and second circuit boards. The inspection terminals are electrically connected to the electronic components mounted on the first and second circuit boards through vias and wiring patterns.

Abstract: In a power conversion apparatus including a rectifying module mounted with a power conversion device, an inverter module, and a direct-current reactor, a rectifying module and an inverter module 5B are mounted on a base section of a cooling fin, a direct-current reactor (DCL) is arranged in a lower layer of a vane section attached to the lower surface of the base section of the cooling fin 3A, an air gap section is provided in the cooling fin 3A, and a terminal block for obtaining electrical connection between the rectifying module and the inverter module and the direct-current reactor (DCL) is arranged making use of a space of the air gap section.

Abstract: A heat-release configuration includes a printed board on which a semiconductor component is mounted, a heat-release plate which is mounted on the semiconductor component, and configured to diffuse heat generated by the semiconductor component; and a supporting clamp which is mounted on the heat-release plate, and configured to fix the heat-release plate to the printed board via a hole provided in the printed board, the supporting clamp including a sectional L-shape in a horizontal direction having two flat surfaces substantially orthogonal to each other, the supporting clamp having on a lower side of each of the flat surfaces a leading end portion which is inserted into the hole of the printed board and a locking claw which is formed in the leading end portion and projects outside the L-shape.

Abstract: An apparatus includes a thermally conductive section with a side facing approximately parallel to an axis and adapted to be thermally coupled to a circuit component, and includes a fluid supply section which directs a fluid flow along the axis toward an opposite side of the thermally conductive section. The thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.

Abstract: A heat transfer apparatus and method are provided for transferring heat between integrated circuits. In use, a heat transfer medium is provided with a first end in thermal communication with a first integrated circuit and a second end in thermal communication with a second integrated circuit. Furthermore, a single casting formed about the heat transfer medium and defining at least one heat sink is provided for thermal communication with the first integrated circuit or the second integrated circuit.

Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.

Abstract: A cooling module applicable in an electronic device is provided. The electronic device includes a plurality of first heat sources and a plurality of second heat sources. The cooling module includes a cooling loop and a plurality of heat pipes. The cooling loop includes a plurality of cooling units. The cooling units are connected in series through a plurality of connection tube and each cooling unit is thermally coupled to one of the first heat source. The heat pipes are thermally coupled to the second heat sources and the cooling units. When the cooling unit is in failure, the cooling units can be directly removed and replaced. Also, the second heat sources of the electronic device are capable of exchanging heat with the cooling unit through the heat pipe.

Abstract: An internal device arrangement for a passenger cabin, for example of an aircraft, is provided. The device has an internal device element which is selected from a group including wall paneling, window panel, side panel, ceiling paneling and luggage compartment. The device has an electrical apparatus fitted in or on the internal device element; and at least one line for supplying power to the electrical apparatus. Furthermore, a heat dissipation device in the form of an integral component part of the internal device element, the electrical apparatus and/or the at least one line is provided. Such a heat dissipation device makes it possible to dispense with an additional heat sink for temperature management and thus save installation space and weight.

Abstract: An electronic device includes a housing. A motherboard is arranged in a first end of the housing. A hard disk drive area is arranged at a second end of the housing. A cooling module is arranged at the housing between the motherboard and the hard disk drive area. The cooling module includes a chassis and a semiconductor chilling plate received in the chassis. An outside airflow flows through the hard disk drive area, and then flows through the semiconductor chilling plate to be cooled. The cooled airflow is driven to flow through the motherboard.

Abstract: A data center includes one or more racks, one or more computing devices coupled to at least one of the racks, and one or more air moving devices. The computing devices include heat producing components. The computing devices may be inclined in the rack such that the lower ends of the computing devices are at a lower elevation than the higher ends of the computing devices. The air moving devices can move air from the lower end of the inclined computing devices to the higher end of the inclined computing devices such that heat is removed from heat producing components in the inclined computing devices.

Abstract: A pad includes a first mating section and a second mating section. The first mating section includes a first horizontal plane and a first inclined plane. The second mating section includes a second horizontal plane and a second inclined plane. The first mating section is a copper foil capable of being connected to a wire. The second mating section is made of insulating material. The first inclined plane and the second inclined plane are bonded together.