Patents Examined by Boris Chervinsky
  • Patent number: 8817455
    Abstract: A sealed electrical enclosure used in hazardous locations for enclosing electrical components having a bottom housing and a top housing with a serrated joint formed therebetween, the bottom housing adapted to receive one or more electrical components, a first metal bus extending from a point internal to the bottom housing through a first end wall to a point external thereto, and a second metal bus extending from a point internal to the bottom housing through a second end wall to a point external to thereto, where the first and second metal buses are adapted to contact first and second electrical terminals of an electrical component when placed within the bottom housing, wherein the top housing is removably secured to the bottom housing to allow for removal and replacement of an electrical component within the housing.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: August 26, 2014
    Assignee: EGS Electrical Group, LLC
    Inventors: Neil Baird, Ian Jenkins, Nabil L. Mina, Yogesh D. Kanole
  • Patent number: 8817468
    Abstract: A switching power supply has electronic parts that configure a switching circuit. The electronic parts are accommodated in a casing. A seat member is formed unitarily with the casing on which the electronic parts are mounted. A coolant channel is formed through the seat member so as to be open at least at two positions of an outer wall surface of the casing. Coolant that flows through the coolant channel cools the electronic parts mounted on the seat member.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: August 26, 2014
    Assignee: Denso Corporation
    Inventor: Shigeo Hirashima
  • Patent number: 8811014
    Abstract: A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: August 19, 2014
    Assignee: General Electric Company
    Inventors: Shakti Singh Chauhan, Stanton Earl Weaver, Jr., Tao Deng, Christopher Michael Eastman, Wenwu Zhang
  • Patent number: 8811015
    Abstract: A motor controller comprising an inverter module including an inverter circuit coupled to a baseplate, wherein the baseplate includes cooling features; a cooling channel configured to receive a cooling fluid, wherein the cooling features extend into the cooling channel; a capacitor; and a laminated bus electrically coupling the capacitor to the inverter circuit and thermally coupling the capacitor to the cooling channel.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: August 19, 2014
    Assignee: Mission Motor Company
    Inventors: Jon Wagner, Trevor James Edmonds, Derek Bruce Young
  • Patent number: 8811016
    Abstract: A power converter device is disclosed herein. The power converter device includes a printed wiring board assembly, a cold plate base and a shell plate assembly. The cold plate base is fastened under the printed wiring board assembly for dissipating heat generated by the printed wiring board assembly. The shell plate assembly having a top shell plate, a bottom shell plate, at least two side plates respectively mounted on the cold plate base in different orientations. The printed wiring board assembly and the cold plate base are enclosed with the shell plate assembly.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: August 19, 2014
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Pei-Ai You, Gang Liu, Jin-Fa Zhang
  • Patent number: 8804337
    Abstract: A device including a structural member having a heat spreader and an electronic device mounted directly to a first surface of the heat spreader of the structural member. The device also includes a cold plate mounted directly to the first surface of the heat spreader of the structural member.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: August 12, 2014
    Assignee: Hamilton Sundstrand Space Systems International, Inc.
    Inventors: Mark A. Zaffetti, Edmund P. Taddey
  • Patent number: 8797737
    Abstract: A display unit and a vending machine having the same. The display unit includes a display panel to display an image, a circuit board to control the display panel, a board bracket installed at a rear of the display panel and formed with a receiving section to receive the circuit board, and a plurality of inlet holes and a plurality of outlet holes formed in opposite surfaces of the board bracket to allow external air to flow through the receiving section. The air travels through the inlet and outlet holes and passes through the receiving section in one direction to cool the display panel and the circuit board. Thus, the display unit is prevented from malfunctioning and the display panel is prevented from being degraded by heat even if tempered glass is installed at a front of the display panel.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: August 5, 2014
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventors: Joon Kang, Sung Ki Kim, Hyun Yong Choi, Tae Sung Kim
  • Patent number: 8792239
    Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: July 29, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Suk Son, Kwang Soo Kim, Young Ki Lee, Sun Woo Yun, Sung Keun Park
  • Patent number: 8791367
    Abstract: A fitting system for sealing an opening in a top cap of a network cabinet includes a grommet and at least one of a fitting assembly and a cover. The grommet is secured to the opening in the top cap of the network cabinet. The fitting assembly and the cover are secured to the grommet and may include at least one finger lift. A sleeve or a tube may be secured to the fitting assembly.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: July 29, 2014
    Assignee: Panduit Corp.
    Inventors: Scott R. Hartman, Dale A. Block, Edward G. Blomquist, Scott M. Lesniak
  • Patent number: 8780562
    Abstract: The present invention relates that a part of the outer bottom is combined with an intermediate heat conductor (102) the flow guide holes (300) are not totally shielded after combined, the interior of the heat dissipater (100) is installed with the heat conductive rib structure (310) for being combined with the inner periphery of the heat dissipater (100), the intermediate heat conductor is installed with the electric luminous body (200) and formed as the heat source, so the heat can be conducted to the surface of the heat conductive rib structure (310) and the heat dissipater (101), and with the fluid effect of hot ascent/cold descent, the airflow is enabled to upwardly flow from one side of the electric luminous body (200) through the flow guide holes (300) then flow out from the other side thereof.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: July 15, 2014
    Inventor: Tai-Her Yang
  • Patent number: 8779290
    Abstract: An integrated conduit and molding mounting system for use at the intersection of a wall and ceiling is disclosed. The system comprises a conduit receiver and a conduit cover bonded to a molding piece. After installation of the conduit receiver at the wall and ceiling joint, the conduit cover and molding is snapped into place over the conduit receiver. The system also comprises a corner piece to eliminate mitering the joints at a corner and a seam cover to be mounted at the intersection of two straight runs.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: July 15, 2014
    Assignee: Crownduit Systems, LLC
    Inventor: Robert DePaul
  • Patent number: 8773859
    Abstract: A driver assembly with an efficient mechanism for transferring heat away from an integrated circuit (IC) chip via a heat transfer member and conductive pattern lines formed on a substrate. The IC chip is mounted on connectors and is placed above the substrate. The IC chip operatively communicates with the display panel via at least a subset of the conductive pattern lines and a subset of the connectors. A heat transfer member is formed on the substrate and is configured to transfer heat generated by the integrated circuit to a component having a lower temperature than the IC chip. A heat transfer element is placed between the IC chip and the heat transfer member to transfer the heat generated by the IC chip to the heat transfer member.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: July 8, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: JinHyong Kim, SeungTae Kim
  • Patent number: 8760853
    Abstract: A disconnect mechanism, an electrical component assembly including the disconnect mechanism, and an electrical circuit protector in turn including the electrical component assembly. The disconnect mechanism includes a carriage, as well as a switch actuator connected to the carriage for moving the carriage between a switch-closed position and a switch-open position. A contactor is mounted to the carriage so as to move with the carriage, the contactor including first and second contactor terminals and providing selective electrical connection between the contactor terminals. A movable disconnect switch contact is connected to the first contactor terminal, and is movable with the carriage and the contactor. A fixed disconnect switch contact is positioned for selective engagement with the movable disconnect switch contact as the carriage moves to the switch-closed position.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: June 24, 2014
    Assignee: Electro-Mechanical Corporation
    Inventor: Scott A. Bullock
  • Patent number: 8760869
    Abstract: An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air deflector blocks an opening of the channel to deflect and guide airflow flow through the first heat sink and the second heat sink.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: June 24, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Zeu-Chia Tan
  • Patent number: 8755179
    Abstract: A thermal interposer for a heat-generating electronic component located on an adapter card of a computer includes a thermally conducting planar body. The thermally conducting planar body may be configured to be coupled to the adapter card such that a first surface of the planar body is in thermal contact with a surface of the electronic component. The thermal interposer may also include a cold plate assembly removably coupled to a second surface of the planar body opposite the first surface. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: June 17, 2014
    Assignee: Asetek A/S
    Inventors: Monem H. Alyaser, Jeremy A. Rice
  • Patent number: 8755184
    Abstract: A container data center is disclosed in the present invention, relating to the field of data centers. The container data center includes: a container box, in which the inside of the box is divided into an equipment compartment, a power supply and distribution compartment and a water chilling set compartment; doors set in the box; a power supply equipment installed in the power supply and distribution compartment; an electronic equipment and a water chilling terminal installed in the equipment compartment; a water chilling set installed in the water chilling set compartment, in which the water chilling set is in communication with the water chilling terminal to provide cold water for the water chilling terminal.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: June 17, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yonghui Peng, Jun Zhao, Na Wei, Mingliang Hao
  • Patent number: 8755183
    Abstract: A car electric equipment case module includes a housing, a covering structure, an electric equipment set, and a fan. The housing has a side wall, a containing space containing the electric equipment set and a first ventilator formed on the side wall. The covering structure includes a casing assembled to the housing and a block wall connected to the casing and extending outside the side wall to cover the first ventilator. An air channel connected the first ventilator is formed between the block wall and the side wall. The fan configured in the housing provides an air flow. The air flow flows into the containing space through the air channel and the first ventilator and flows out through a second ventilator formed on the covering structure, or flows into the containing space through the second ventilator and flows out through the first ventilator and the air channel.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: June 17, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Huan-Lung Gu, Jyh-Chun Chang
  • Patent number: 8755172
    Abstract: A power transfer device adapted for interconnection with the electrical system of a building includes a housing that includes a base having a back wall and an intermediate member that engages the base. A first housing section engages the base and the intermediate member and defines a first interior portion. A second housing section engages the base and the intermediate member and cooperates with the base to define a second interior portion. Fasteners secure the intermediate member, the first housing section and the second housing section together. Power transfer switching components are interconnected with and carried by one of the housing sections. A cover may be pivotably mounted to the housing. During assembly, the power switching components are mounted to one of the housing sections to form a subassembly that is connected to the base as a single unit.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: June 17, 2014
    Assignee: Reliance Controls Corporation
    Inventor: Neil A. Czarnecki
  • Patent number: 8755176
    Abstract: The invention provides a data storage system for connection to a primary power source, the data storage system comprising: one or more data storage media; one or more interfaces, each interface able to connect to at least one of the data storage media so as to couple power from the primary power source to the at least one of the data storage media; one or more energy modules, each energy module being able to connect to an interface for providing back-up power to the one or more of the data storage media in the event of a failure of the primary power source.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: June 17, 2014
    Assignee: Xyratex Technology Limited
    Inventors: David M. Davis, Alexander C. Worrall
  • Patent number: 8749976
    Abstract: In one embodiment, the disclosure includes a telecom utility cabinet including a heat load chamber. The telecom utility cabinet also includes an air introducing duct configured to conduct air from the heat load chamber to a geothermal cooling system. The telecom utility cabinet also includes an air discharging duct configured to conduct air from the geothermal cooling system to the heat load chamber. In another embodiment, the disclosure includes a method for managing temperature in a telecom utility cabinet. The method includes introducing air from a heat load chamber to a geothermal cooling system and discharging air from the geothermal cooling system to the heat load chamber.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: June 10, 2014
    Assignee: Futurewei Technologies, Inc.
    Inventors: Pedro Fernandez, Shanjiu Chi, Amit Kulkarni, Liqian Zhai, Kelly C. Johnson, Yong Lu, Mahmoud Elkenaney