Abstract: In a building box type plug-in modular rack structure for electronic equipment, a box-like shelf accommodates a plurality of printed circuit boards therein. A pair of side frames symmetrical in a right-and-left direction each has a recess at the upper end and a projection at the lower end for respectively mating with the projection and the recess of adjoining side frames. A framework is constituted by the pair of side frames and the shelf interposed between them. Covers cover the outer periphery of the framework. A plurality of frameworks are stacked and connected together by the recesses and the projections of the side frames. A top cover and a bottom cover respectively are fitted on the top and the bottom of the stack of frameworks.
Abstract: An electronic part assembly composed of a wiring board formed with a wiring circuit, and a plurality of electronic parts mounted to the wiring board, in which the wiring board is composed of a plurality of stages stacked up; the electronic parts are sorted into large parts which are high profile and small parts and disposed separately on the wiring board, while at least some of the small parts are each vertically disposed in the longitudinal direction of the wiring board and connected to adjacent stages of the wiring board by means of leads extending from the bath sides thereof.
Abstract: In the technical field of known cardholders for devices such as cards with magnetic stripes on which is encoded information and or data in the form of patterns of magnetism, the known cardholders offer no method of `keeping` (in magnetism terminology) the magnetic patterns. The present invention is characterised by incorporating into the cardholders, keepers in the form of sheets of magnetically soft ferromagnetic material with high resistance. The benefit of the invention is obtained when devices are placed with the reading surface of their magnetized stripes in close contact with the surface of the ferromagnetic material which, making use of known properties of the material, then acts as keeper of the magnetic patterns.
Abstract: A ceramic chip carrier is disclosed which preferably includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and at least one pin which is mechanically and electrically connected to a contact pad on the circuitized surface. Each mechanical/electrical connection between a pin and a contact pad includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.
June 17, 1993
Date of Patent:
February 22, 1994
International Business Machines, Inc.
Lance A. Bronson, Scott P. Moore, John A. Shriver, III
Abstract: A package for enclosing and mounting a multichip module to a printed wiring board including a ceramic base with an elevated peripheral ledge constructed of a material, having a coefficient of thermal expansion differing substantially from the coefficient of thermal expansion of the material of a serpentine sidewall mounted to the base, and having a lid mounted to the top of the sidewall. The package includes electrical contacts extending through the ledge for connecting the multichip module to the circuit board. The sidewall is a series of interconnected short segments having acute angles at their interconnection forming a pleated shape.
Abstract: A hybrid package in which Kovar feedthroughs are friction welded to an aluminum housing. Friction welding produces a very strong weld joint which resists the thermal stresses induced between the aluminum housing and Kovar feedthroughs by the large difference in their coefficients of thermal expansion. Friction welding also produces a very small heat affected zone, while brazing, soldering and other types of welding produce large heat affected zones which can cause annealing problems. The aluminum package is easy to machine, light in weight and provides good heat dissipation for the hybrid microcircuits in the package.
Abstract: An improved device for providing EMI/RFI shielding for a joint is disclosed comprising a compressible, resilient sealing element and a conductive shielding element bonded to the sealing element and positioned such that the shielding element provides a direct electrical contact across the joint. The disclosed invention further provides a cabinet which effectively utilizes such a device. The disclosed invention also includes an improved cabinet construction which minimizes the paths by which moisture and debris may enter the cabinet interior, while providing a cabinet which is transportable without violating the integrity of the cabinet structure.
Abstract: A box structure of a top, a back, a bottom, and two sides welded together to form an open front structure, and a two-piece front cover detachably attachable thereto; an interior horizontal wall welded in place to divide the interior space into a larger upper compartment to house the transformer, and a smaller lower compartment to house the wires connecting the transformer to a cable which has access to the lower compartment through a knock-out stamping in the bottom; two hanger strips attached to the top and the bottom, respectively, for attaching the box to a support; all of the seams for connecting the top and the bottom to the sides, the back, and the front cover being oriented such that water dripping over the outside of the box will be directed away from flowing to the inside of the box.
Abstract: A box-like housing for an electronics apparatus is provided having superior effects for preventing problems caused by ESD. The wall of the housing is formed by a sandwiched plate consisting of the innermost layer (1) of high electro-conductive material such as a steel plate, the middle layer (2) of electro-insulating material such as plastic, and the outermost layer (3) of low electro-conductive material having much higher resistance compared with the innermost layer (1) such as a carbon-containing paint coating. The innermost layer (1) and the outermost layer (3) are frame-grounded through a common earth line.(FIG. 1).
Abstract: Disclosed is a container package for a semiconductor element, which comprises a vessel having in the interior thereof a space for containing a semiconductor element, which comprises an insulating substrate and a lid member, an external lead terminal for connecting the semiconductor element contained in the vessel to an electric circuit and a sealing agent for sealing the vessel and external lead terminal, wherein the external lead terminal is composed of an electroconductive material having a thermal expansion coefficient of from 5.times.10.sup.-6 to 12.times.10.sup.-6 /.degree.C. and an electroconductivity of at least 10% (International Annealed Copper Standard).
Abstract: A method of producing an oxide superconducting wire. A non-oxidizing metal layer is formed between an oxide superconducting material and an oxidizing metal support in order to prevent oxygen from being taken away from the oxide superconducting material by the oxidizing metal support during a subsequent heat treatment for producing an oxide superconductor to thereby obtaining a wire composite. The wire composite is then heated to produce the oxide superconductor.
Abstract: An arrangement for providing radio frequency and electromagnetic interference protection to at least part of circuitry mounted on a circuit board comprises alternating slots and bridges which form a boundary between a protected area of the circuit board and an unprotected area of the circuit board. The circuit portions which require protection are mounted in the protected area and are covered by a top cover having fingers which extend through the slots. Connecting lines between the protected and unprotected portions of the circuit portions extend along the bridges between the slots. A bottom cover engages under the protected area and mates to the top cover for providing electromagnetic interference protection for the circuit portions within the protected area.
Abstract: A mounting structure in which an electronic apparatus unit housed in a shield case is anchored directly on a circuit board in fixedly secured relation by fastening part of the shield case thereto. A space is created between the circuit board and a bottom plate of the shield case and part of the shield case which encloses the outer periphery of the electronic apparatus unit extends below the bottom plate to abut the circuit board and fixedly secure the shield case to the circuit board.
Abstract: An apparatus 10 for shielding a personal occupancy space 11 from electromagnetic and geopathic fields has a floor shield 15 and two side wall shields 18 and 20. The shields are made of ferrous, wire mesh screening and are erected so as to traverse all three spatial protected space. The shields are grounded with the use of a wall plug 29 that has two non-conductive prongs 32 and a conductive grounding prong.
Abstract: A plastic package that includes a cavity for holding an integrated circuit die. The package also includes several singel-piece leads that each have bonding pad area on one end and an area for connecting to external circuitry on the other end. The package's plastic body supports the leads, separates them from each other, and includes a ridge that substantially encircles the cavity and separates the bonding pad areas from the cavity. The package may be made by forming a first portion including alignment protrusions sized to receive lead bonding pad ends, placing the leads with their bonding pads so that they are spaced apart by the protrusions, and securing them, preferably by supplying heat to the protrusions. A second portion of the package may then be molded around the first portion, the leads, and, preferably, a heat sink.
Abstract: A housing for a wave separator, comprising a casing, which has an opening at the top, an input port connector and a plurality of output port connectors respectively made at two opposite sides and integrally formed through molding process, and a covered board covered on said casing to close up said opening, wherein the casing has a stepped top edge comprised of a first step edge disposed at the inside at a lower position, a third step edge disposed at the topmost position, a second step edge disposed at the inside between the first and third step edges, and a V-groove defined between the second and third step edges, the first step edge having a tapered projection tightly engaged into the cover board at the bottom, the second step edge having a side wall portion peripherally engaged with the cover board and an upper part bent inwards to firmly retain the cover board around the periphery thereof.
Abstract: This is a semiconductor chip in which the conductive path between the chip and the lead frame via wires can be easily and reproduceably improved. This is accomplished by improving the bond between the wires and the lead frame members to which the wires are joined and by creating additional contacts between each wire and its respective lead even if the bonded contact breaks or fails at or immediately adjacent to the bonding point. This is accomplished by placing an insulating layer on the active surface of each chip, carrying input and output bonding pads thereon, to which lead frame conductors have been connected by bonding wires.
December 11, 1991
Date of Patent:
September 29, 1992
International Business Machines Corporation
H. Ward Conru, Gary H. Irish, Francis J. Pakulski, William J. Slattery, Stephen G. Starr, William C. Ward
Abstract: The disclosure concerns the encapsulation of integrated circuit chips, notably with a view to their being incorporated in a chip card. The encapsulation method comprises the formation of a pre-punched metallic conductive grid, the formation of a strip of pre-perforated plastic material, the transfer of a strip to the grid, the positioning of an integrated circuit chip in a perforation of the strip, and the formation of electrical connections between the chip and zones of the grid located in perforations of the strip. The perforations of the strip and the punched slots of the grid are arranged so that the strip covers and blocks all the interstices between conductors of the grid in the useful region corresponding to a module to be made. When a protecting resin is laid, it is confined and does not leak through the interstices of the grid. A plastic or metal ring defines the heightwise dimension of the micromodule.
Abstract: The electric-wave absorbing material for construction includes a medium and a large number of electric-wave absorbing particles dispersed therein. The particles are in the form of capsules filled with water. The electric-wave absorbing material for construction may be made of a construction material having provided thereon an electric-wave absorbing layer which includes such electric-wave absorbing particles.
March 7, 1991
Date of Patent:
September 8, 1992
Shimizu Construction Co., Ltd., Nippon Light Metal Company, Ltd.
Abstract: An electromagnetic-shielding gasket of the present invention shields electronic components from electromagnetic waves by covering a surface of a resilient core with metal mesh and inserting the core into a joint of a conductive housing which contains electronic components. The core comprises an installing portion which is fixed to the joint of the conductive housing. A segregating portion or area separates the metal mesh from the surface of the core in the corner portions so that when the core elastically deforms greatly during insertion or use of the gasket, the metal mesh does not break as the core presses and pulls the metal mesh.