Abstract: A ceramic base used for a semiconductor device is plate-shaped and is made of a material consisting essentially of ceramic. In plan view, the base is rectangular and has four corner portions each located between two adjacent side walls. The corner portion comprises a main bevel and two auxiliary bevels located at respective sides of the main bevel and extending to the two side walls, respectively, so that two first corners are defined between the main bevel and the auxiliary bevels, respectively, and two second corners are defined between the auxiliary bevels and the side walls of the base, respectively.

Abstract: A customizable circuit using a programmable interconnect and a compatible tape design for tape automated bonding of chips to the circuitry. The programmable interconnect comprises layers of wires, with one layer of wires forming overlap regions with the adjacent layer of wires. The wires can be selectively linked later to form the desired interconnect. The selective linkage represents the customization of an otherwise undedicated interconnect. The TAB chip bonding design uses a carrier tape to bond the integrated circuit chips to the programmable interconnect. Also disclosed is a method for forming the interconnect.

Abstract: A device for facilitating integrity of an electrical interconnection of a pair of electrical suspended conductor cables includes a flexible conductive loop and a tension retainer between the cables. Free adjacent spaced apart ends of the cables are connected to the loop, the loop being electrically in series with the cables. A tension retainer is in series structurally with the respective adjacent and spaced ends of the two electrical conductor cables and maintains a first position of suspension. Axial tension on at least one of the cable tending relatively to separate the cables causes movement or breakage of the tension retainer thereby permitting the flexible conductive loop to move and expand and retain electrical integrity between the cable ends in a second suspended position.

Abstract: A superconducting conductor comprises a first fraction of prior-tinned strands (1, 3, 5, 7, 9, etc. . . . ) and an additional fraction of non-prior-tinned strands (2, 4, 6, 8, 10, etc., . . . ). The strands of the first fraction and of the additional fraction alternate regularly and are maintained in a coherent assembly after being assembled with transposition by heating to melt the layer of tin on the prior-tinned strands, with the tin from said layer then solidifying, thus providing substantially point adherence between the previously tinned strands while leaving channels (11, 12, etc. . . . ) inside the superconducitng conductor for cooling liquid circulation. The invention is also to a method of manufacturing such a superconducting conductor.

Abstract: A resilient electromagnetic shielding gasket utilizes a plurality of conductive wire coils which are loaded in a manner so that coil spacing may be selectively adjusted at specific areas along the circumference thereof in order to provide an electromagnetic shield. Other portions along the circumference of the gasket provide sufficient biasing capability to take up for variations that may occur due to torquing, eccentricities, irregularities and other variables and thereby imminent contact between mating surfaces under load. The spacing along a seal-load portion of the gasket is selected to limit the passage of electromagnetic energy with a wavelength greater than a selected value.

Abstract: A superconducting structural body comprising an oxide based superconducting ceramics powder having a perovskite structure and a metal sheath surrounding the oxide based superconducting ceramics powder, the metal sheath including an Ag portion and a non-Ag metal portion, the Ag portion existing from the inner to outer surfaces of the metal sheath, a superconducting ceramics powder portion existing in the structural body, the non-Ag metal protion used as a structural material of the metal sheath of an outermost layer of the structural body, the superconducting ceramics powder portion and the non-Ag metal portion being disposed so as to be indirectly contact each other through the Ag material, and the superconducting structural body having a compressed oriented layer in which the C-axis of the crystal in the superconducting ceramics powder is oriented in the direction perpendicular to the longitudinal direction of the superconducting structural body, and in which a thickness thereof is not smaller than 5 .mu.

Abstract: The tri-state dual-in-line package (DIP) switch includes a base with a plurality of transverse grooves, a plurality of conducting pins attached to the transverse grooves; a plurality of slide members, each having a top protrusion and one conducting element attached to the rear surface; and a cover having a plurality of openings for the top protrusions of the slide members. The base is tightly sealed to the cover by means of high frequency welding, wherein energy directors provided for in at least one of the base or said cover are melted by allowing high frequency current to pass through the cover to the base. The width of the base is wider than that of prior art and the conducting pins are folded twice to maintain a standard distance.

Abstract: A magnetic shield which comprises: a plurality of metallic cylinders connected to each other in the axial direction thereof, each of the plurality of cylinders having at one end thereof an engaging section for receiving an end of an adjacent metallic cylinder to be connected thereto; and a film of a composite oxide superconducting material containing a Cu.sub.x O.sub.y -radical, formed on the entire inner surface of each of the plurality of cylinders, including the inner surface of the engaging section thereof. The above-mentioned magnetic shield can easily be scaled up and has a high magnetic shielding effect.

Abstract: A toroidal hybrid transformer includes a primary winding (2), which is superconducting in operation and a secondary winding (10) which is non-superconducting, separated by thermal and electrical insulation. A strength member (1) withstanding the centripetal forces exerted on the primary winding supports the primary winding (2) and is disposed inside the conductor turns (20, 21; 26, 27, 28) constituting the primary winding. Anchoring wedges (3, 12) mechanically couple the strength member to at least that portion of each of said conductor turns which is adjacent to the axis of symmetry (14) of the toroidal transformer, thereby transmitting the centripetal forces exerted on the primary winding to the strength member.

Abstract: A multifilamentary superconducting cable has two parallel spaced-apart guide wires. A first layer of mutually parallel superconducting filaments is woven partially around and between the guide wires in a transposed braid. Likewise, a second layer of mutually parallel superconducting filaments is woven partially around and between the guide wires in a transposed braid. Thus, the two layers overlap each other as the respective layers pass between the guide wires. The two superconducting layers and two guide wires are enclosed in a helical copper duct, with the guide wires being oriented within the duct.

Abstract: A package for a heat generating, high voltage hybrid circuit is disclosed which comprises a package housing having a sidewall structure formed from an electrically insulative, thermally conductive ceramic material that obviates the need for using separate insulator structures between the sidewalls of the package and the electrical feedthroughs which afford electrical access to the circuit contained within the package housing. The feedthroughs include a layer of hardenable material for sealingly mounting a terminal connector through the sidewalls of the package. In one embodiment of the invention, the hardenable material sealingly mounts the terminal connectors of the electrical feedthroughs within circular openings in the sidewall structure.

Abstract: A method for producing an information card by printing an electroconductive pattern and a first electrode surface of a battery on a first cover sheet, applying a battery activator onto the first electrode surface, resting an electrolyte-impregnated separator onto the first electrode surface, fixing an IC chip to the electroconductive pattern in a predetermined position, printing a second electrode surface of the battery on a second cover sheet, applying a battery activator onto the second electrode surface, and lapping and sticking the first and second cover sheets together and cutting them into a predetermined size.

Abstract: A housing (100), that is suitable for use in a automated manufacturing and/or testing environment, is constructed and arranged to substantially enclose and shield a trimmable electrical circuit (107) from radio frequency interference external to the housing (100). At least a portion of the housing (100) is constructed and arranged to shield while contemporaneously allowing a laser beam (114) to pass therethrough so as to focus on at least a portion of the trimmable electrical circuit (107) and thereby laser trim the trimmable electrical circuit (107).

Abstract: A component housing for an electromechanical component as an aeration opening provided with an insulating shaft formed by an insulating wall extending from the housing wall. The insulating shaft is open to the interior of the housing at an end lying opposite the aeration opening to form an insulating path between voltage carrying parts within the housing and neighboring metallic parts outside of the housing after the aeration opening is opened.

Abstract: A pin grid array package having a substrate formed from a ceramics containing a 90% or higher alumina composition. The substrate has an palladium-silver layer on an upper surface thereof with a silver layer further provided on the Pd-Ag layer and a gold bonding pad on a outer periphery of a cavity of the substrate so as to provide electrical connection between pins and chip. The Ag layer is covered with a dielectric layer to prevent contamination from moisture.

Abstract: A spring finger EMI gasket is disclosed in which portions of its finger parts are so formed that they can be completely flattened with negligible permanent set. Thus when used in a seam, they can be flattened to provide broad are a metal-to-metal contact for low electrical impedance across the seam, while at the same time serving as a positive mechanical stop. In its preferred embodiment, when the seam is disassembled, the tips of the finger parts press firmly against one of the surfaces of the seam so as to resist snagging, a frequent cause of damage to spring fingers.

Abstract: The invention relates to a process for coating sintered cermet or cerglass articles with a metal or metal alloy. The process is particularly useful to eliminate pores and cavities from the surface of the article. During hermeticity testing, these pores and cavities trap tracer gas and result in an erroneous leak rate measurement. In one embodiment, the coated surfaces are subsequently coated with a second metal layer by immersion plating followed by electrolytic deposition. The process is particularly suited to the manufacture of cermet and cerglass components for semiconductor packages.

Abstract: A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.

Abstract: A control box 6 of an air conditioner at the front part of the body has two compartments 6A, 6B parted by a partition plate 7. One compartment 6A is for receiving lead wires 2 which connect electric components with a compressor motor and a fan motor, and the other compartment 6B is for containing electric parts. The lead wires 2 are folded once in the compartment 6A. and again folded at the rear end of the partition plate 7. By such twice folding of the lead wires and cramping them at the rear end of the partition plate 7, damaging of electric components by the lead wires is prevented.

Abstract: A chip component incorporating an electrical or electronic function member (2) and having terminal elements (7, 8) is integrated in a pre-fabricated housing (9) of cup shape composed of insulating material, with the function member (2) being held in the housing (9) by supporting elements (12) so as to form at least one air gap (10) that is 1 mm less wide and that separates the function member (2) from the inner housing surfaces (11) on all sides except where the function member (2) is fixed in the housing (9) with small-area supporting elements (12).