Patents Examined by Bot Lee Ledynh
  • Patent number: 5142103
    Abstract: An encapsulated electrical capacitor in which an end and a major portion of the cylindrical outer shell of the capacitor is positioned within a cup-shaped sleeve before an outer housing is molded around the capacitor and sleeve. The sleeve has axially extending internal ribs which stiffen its outer annular wall to thereby help to prevent damage to the capacitor from hydraulic forces during the encapsulating process. The internal ribs also define insulating air spaces between one another, and this helps to reduce thermal conduction into the capacitor during the molding process. The outer housing is preferably formed from polypropylene, and the sleeve is preferably formed from a material which will retain a major portion of its strength and rigidity at the molding temperature of the outer housing, for example, a polyester material when the outer housing is formed from polypropylene.
    Type: Grant
    Filed: January 22, 1991
    Date of Patent: August 25, 1992
    Assignee: R & R Plastics, Inc.
    Inventor: Harold R. Stine
  • Patent number: 5140290
    Abstract: A device for inductive current limiting of an alternating current consisting of an induction coil (2), which includes at least one winding and through which current flows, a body (3) made of a ceramic high-temperature superconductor arranged concentrically to the latter and having a centrosymmetrical form which is hollow in the interior, and having located in the interior of said body (3) a concentrically arranged core (4) made of a soft magnetic material of high permeability. In normal operation (rated current), the superconductivity of the body (3) is effective and impedance of the induction coil (2) is very low. With overcurrent (mains short-circuit) the superconductivity disappears and the impedance of the induction coil (2) reaches its maximum, current-limiting value.
    Type: Grant
    Filed: November 14, 1991
    Date of Patent: August 18, 1992
    Assignee: Asea Brown Boveri Ltd.
    Inventor: Helmut Dersch
  • Patent number: 5140109
    Abstract: Disclosed is a container package for a semiconductor element, which comprises a vessel having in the interior thereof a space for containing a semiconductor element, which comprises an insulating substrate and a lid member, an external lead terminal for connecting the semiconductor element contained in the vessel to an electric circuit and a sealing agent for sealing the vessel and external lead terminal, wherein the external lead terminal is composed of an electroconductive material having a permeability lower than 210 (CGS) and a thermal expansion coefficient of from 9.times.10.sup.-6 to 12.times.10.sup.-6 /.degree.C.
    Type: Grant
    Filed: August 27, 1990
    Date of Patent: August 18, 1992
    Assignee: Kyocera Corporation
    Inventors: Hiroshi Matsumoto, Hiroaki Inokuchi
  • Patent number: 5138115
    Abstract: An integrated circuit package and method of making the package which allows an integrated circuit die to be bonded to a substrate without need of a carrier. The integrated circuit die has opposed active and passive surfaces and has lateral surfaces. An electrically insulative layer of material is deposited on the passive and lateral surfaces. A metal mask is formed to cover the active surface and the coated lateral surfaces. The metal mask includes slots which extend up the lateral surfaces and onto the active surface. The array of slots corresponds to an array of input/output contact pads on the active side. Metal is sputtered into the slots, whereafter the mask is removed to provide L-shaped conductive traces from the contact pads along the active and lateral sides. The assembly can then be rested on a substrate on the passive surface and the L-shaped traces bonded to contact pads on the substrate. The assembly allows testing at the die level.
    Type: Grant
    Filed: August 28, 1991
    Date of Patent: August 11, 1992
    Assignee: Atmel Corporation
    Inventor: Man K. Lam
  • Patent number: 5136119
    Abstract: The invention relates to a Faraday cage for use with relatively unshielded lectrical instruments to allow the instruments to be used in an environment of high electromagnetic interference. The cage is constructed of lightweight plastic material and is designed to be portable. It is a rigid cage when unfolded for use, yet is capable of being folded into a compact one-piece, substantially flat, stowable package, which can be erected for use with a minimum of effort.
    Type: Grant
    Filed: September 18, 1991
    Date of Patent: August 4, 1992
    Assignee: The United States of America as Represented by the Secretaty of the Navy
    Inventor: Walter E. Leyland
  • Patent number: 5136120
    Abstract: At least one pair of areas on a circuit pack or substrate is allocated for the placement of electromagnetic interference (EMI) absorbing material, e.g., split ferrite cores. All or a portion of the conductor paths for the circuit are routed between pairs of the allocated areas. After the circuit pack is developed and tested, if EMI suppression is required, the EMI-absorbing material extends around the conductors passing between the pairs of allocated areas using holes formed through the allocated pairs of areas. Such holes are formed prior to circuit assembly or, alternatively, are formed only as needed after circuit testing. A clip is used to secure the EMI-absorbing material to the circuit pack. Advantageously, the insertion and securement of the EMI-absorbing material does not require any soldering or special manufacturing tools or fixtures. Accordingly, it can be readily provided in any manufacturing process.
    Type: Grant
    Filed: December 12, 1990
    Date of Patent: August 4, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: Adam B. Craft, Gabor P. Torok
  • Patent number: 5134245
    Abstract: A low cost non-electric device to afford some protection to the operators of lap top computers from the electromagnetic fields emitted therefrom and to provide a comfortable cushion to rest the computer upon.
    Type: Grant
    Filed: May 31, 1991
    Date of Patent: July 28, 1992
    Inventor: Joseph M. Katz
  • Patent number: 5134244
    Abstract: An electromagnetic shield for a rotary/reciprocating shaft includes a garter-type resilient coil spring blocking the propagation of electromagnetic waves therepast with the coil spring including a plurality of individual coils for causing a blockage of electromagnetic waves therepast independent of the compression of the coil spring within a range of deflection of the individual coils.
    Type: Grant
    Filed: April 27, 1989
    Date of Patent: July 28, 1992
    Assignees: Peter J. Balsells, Joan C. Balsells
    Inventor: Peter J. Balsells
  • Patent number: 5126510
    Abstract: A thermal protector housing, for use in mounting an electrical thermal protector on a surface of a device to be protected against undue temperature rise, comprises a housing body of insulating material with an open end for receiving a thermal protector to be housed in it, a stop within a body limiting the distance the protector can be inserted and a securing member for securing a thermal protector between the open end and the stop, which securing member comprises a flexible finger portion of an exterior surface of the housing body.
    Type: Grant
    Filed: December 14, 1990
    Date of Patent: June 30, 1992
    Assignee: Challenger Electrical Materials, Inc.
    Inventors: Claude J. Bauer, Kenneth H. Walterick
  • Patent number: 5126507
    Abstract: For protecting electrical installations against electromagnetic interferences and especially against over-voltages as can for instance occur as a consequence of lightning strikes, electrical lines provided between individual electrical apparatus are laid in a flexible hollow tubular member having an electrically conducting surface and at least one separation or division in its longitudinal direction. The hollow member is also provided with an undulated profile. The hollow member can be designed either as divided tubular sections or as cable channels or ducts provided with a covering member.
    Type: Grant
    Filed: March 28, 1990
    Date of Patent: June 30, 1992
    Assignee: Messerschmitt-Bolkow-Blohm GmbH
    Inventor: Safa Kirma
  • Patent number: 5122619
    Abstract: A radiation shield for visual display terminals capable of being mounted in front of a visual display terminal for attenuating electromagnetic fields emanating from such visual display terminal which comprises a sheet of glass carrying on at least one face a layer of conductive metal that does not appreciably impair visibility through the coated glass and metal grounding member ultrasonically bonded to the glass sheet solely at one location adjacent to a corner of the glass sheet.
    Type: Grant
    Filed: July 1, 1991
    Date of Patent: June 16, 1992
    Inventor: Frank C. Dlubak
  • Patent number: 5117068
    Abstract: A TO-8 surface-mount package assembly for R.F. and microwave devices is disclosed. The assembly includes a lead-frame positioned beneath an alumina base. The alumina base supports a number of solid metal vias. The vias electrically connect the lead-frame to an R.F. or microwave device which is attached to the vias. The assembly also includes a gold plated Kovar seal-ring positioned over the base. The seal-ring and base are brazed together. A cover is then positioned over the seal-ring and welded to the seal-ring.
    Type: Grant
    Filed: August 17, 1990
    Date of Patent: May 26, 1992
    Assignee: Watkins-Johnson Company
    Inventors: Louis M. Seieroe, Kenneth S. Ledford
  • Patent number: 5117065
    Abstract: A method of joining shielding materials used for minimizing passage of electromagnetic and radio frequency energy through the walls of an enclosure, comprising the steps of securing a metallic backing plate to one wall of the enclosure, positioning an end portion of a first sheet of shielding material to the backing plate, then positioning an end portion of second sheet of shielding material atop the end portion of the first sheet of shielding material, and then applying a vibrating tool to the overlapped end portions of the first and second sheets of shielding material to metallurgically bond the facing surfaces of the overlapped shielding materials. A joint structure resulting from practice of the method is also disclosed.
    Type: Grant
    Filed: June 15, 1990
    Date of Patent: May 26, 1992
    Inventors: Howard S. Savage, Paul H. Nielsen
  • Patent number: 5107071
    Abstract: A sealing and shielding structure of the present invention comprises an elastic sealing member and an electromagnetic shideling member provided in a cavity formed at least in one of a first member and a second member both of which have conductive abutting faces. The elastic sealing member is, for example, slightly larger than the electromagnetic shielding member so as to be pressed between the first and the second members. Accordingly, when the first and the second members are closed, the elastic sealing member is compressed and deformed to push the electromagnetic shielding member so that the electromagnetic shielding member closely contacts with the conductive abutting faces of the first and the second members. Consequently, the sealing and shielding structure can produce a prominent electromagnetic wave shielding effect because of the electromagnetic shielding member kept in close contact with the conductive abutting faces of the first and the second members.
    Type: Grant
    Filed: September 14, 1990
    Date of Patent: April 21, 1992
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Asaharu Nakagawa
  • Patent number: 5097243
    Abstract: Thin-film transformer, for example suitable for use in a thin-film magnetic head, comprising a magnetic yoke composed of two magnetically permeable thin layers 3 and 5 and a primary turn constituted by an electrically conducting thin layer 13 and a secondary turn constituted by an electrically conducting thin layer 15. A thin layer 21 of a superconducting material is provided between the layer 3 and the said turns, or the turns are closely fitted together and made of a superconducting material themselves.
    Type: Grant
    Filed: March 8, 1990
    Date of Patent: March 17, 1992
    Assignee: U.S. Philips Corp.
    Inventors: Victor Zieren, Jacobus J. M. Ruigrok
  • Patent number: 5095177
    Abstract: A two-piece transceiver housing for a mobile telephone comprises an open-topped box and a separate lid both made of conductive material, specifically diecast aluminium. A plurality of flat projections are formed integrally on the underside of the lid. These projections are arranged to bear internally against the side wall of the box when the lid is in place to prevent radio frequency radiation escaping from the housing without the need for a separate sealing component. The projections have a tapering curvilinear or rectilinear profile. This helps to distribute the stress and enables the projections to suffer slight deflection without breaking even when they are made of cast aluminium which is relatively brittle.
    Type: Grant
    Filed: September 20, 1990
    Date of Patent: March 10, 1992
    Assignee: Technophone Limited
    Inventor: Martin L. Johnson
  • Patent number: 5093646
    Abstract: A high frequency matrix transformer comprises a plurality of interdependent magnetic elements interwired as a transformer. The various component parts of the high frequency transformer are arranged and interwired to provide a transformer having very low leakage inductance and very good coupling from the primary to the secondary. The high frequency matrix transformer is particularly well adapted for transformers requiring high equivalent turns ratios, high frequency, high power, and high dielectric isolation. It can have a plurality of parallel secondaries, which can source current to parallel rectifier circuits with current sharing. It can also have a plurality of parallel primary circuits, which also will current share, to balance the load between source switching circuits, or to provide dual input voltage capability (i.e., 120/240 volts). The high frequency matrix transformer tends to be spread out, and can be very flat, making it easy to ventilate or heat sink.
    Type: Grant
    Filed: March 13, 1989
    Date of Patent: March 3, 1992
    Assignee: FMTT, Inc.
    Inventor: Edward Herbert
  • Patent number: 5093761
    Abstract: A circuit board device includes a flexible circuit board, a rigid circuit board bonded to at least a part of the flexible circuit board, and a metal plate bonded to at least one of the rigid circuit board and a portion of the flexible circuit board which is itself bonded to the rigid circuit board. Heat generated from components mounted on the rigid circuit board is dissipated through the metal plate to a frame, for example.
    Type: Grant
    Filed: March 19, 1990
    Date of Patent: March 3, 1992
    Assignee: O.K Print Corporation
    Inventor: Risuke Ozaki
  • Patent number: 5091821
    Abstract: A detachable protective cover for an electrical terminal block comprising a pivot member top whose sides are pivotally attached by pins to support members connected to the terminal block with fasteners. The pivot member top overlays the block in the cover's closed position, but can be pivoted forward to expose the block in the cover's open position. In a preferred embodiment when the block is mounted horizontally on a distributing frame, the pivot member top can pivot forward and downwardly to an angle from the horizontal so as to preclude interference with a ladder associated with the frame when the ladder is positioned in front of an open cover.
    Type: Grant
    Filed: April 23, 1990
    Date of Patent: February 25, 1992
    Inventor: Thomas B. Peyton
  • Patent number: 5091606
    Abstract: An electromagnetic shielding gasket assembly includes a coil spring for blocking the propagation of electromagnetic waves therepast, with the coil spring including a plurality of individual coils canted along a center line thereof. The plurality of individual coils are supported in an orientation for controlling the electromagnetic shielding effectiveness of the coil spring, and a formable conductive material, disposed on said plurality of individual coils, is provided for being formed by the plurality of coils upon loading thereof. The formed conductive material fills an aperture of the coil spring to further block the propagation of electromagnetic waves.
    Type: Grant
    Filed: February 11, 1991
    Date of Patent: February 25, 1992
    Assignees: Peter J. Balsells, Joan C. Balsells
    Inventor: Peter J. Balsells