Abstract: A process for producing sodium hypochlorite slurries admixes a hypochlorous acid solution having a concentration of 35 percent or greater by weight of HOCl with sodium hydroxide at a temperature below about 25.degree. C. The reaction produces a slurry of sodium hypochlorite pentahydrate in an aqueous solution of sodium hypochlorite where the sodium hypochlorite is present in a concentration of at least 35 percent by weight of NaOCl. The sodium hypochlorite slurries have improved stability and greatly reduced amounts of sodium chloride. The process for produces high strength sodium hypochlorite compositions of high purity having improved yields and reduced product decomposition.

Abstract: Ultrapure water is formed by a process employing a simple system for safely and easily removing oxygen from water containing dissolved oxygen; which process comprises dissolving a reducing agent in water containing dissolved oxygen and irradiating the resulting water with ultraviolet rays. The ultrapure water is particularly utilized as a rinsing water in the electronics industry.

Abstract: The present invention relates to an electrically conducting polymer, the water-insoluble polymer having essentially permanent self-doping properties, and the polynmer comprises:(a) electrically polymerized polyaniline in covalent combination with(b) an organic dopant having at least one sulfonic acid functional group. The electrically conducting polymer-dopant is preferred wherein the organic dopant is selected from benzenesulfonic acid, toluenesulfonic acid, benzenesulfonyl chloride, dodecylbenzenesulfonic acid, poly(vinylsulfonic) acid, trifluoromethanesulfonic acid, 1-butanesulfonic acid, modified NAFION, 2,3,5-trichlorobenzenesulfonic acid, vinylphenylsulfonic acid, or the alkali metal salts thereof. In another aspect, the present invention discloses a method to produce a water-insoluble polyaniline in which an aromatic organic dopant is covalently bonded to the polyaniline, which method comprises (a) electropolymerizing aniline in an aqueous solvent which contains the organic dopant.

Abstract: A bath for electrodepositing tin, lead or an alloy thereof, containing a tin and/or lead ion and a sulfate ion becomes stable at pH 1 or higher when a condensed phosphate ion is added thereto. The bath is effective for depositing tin-lead alloy films on sealing glass-metal integrated articles.

Abstract: A process for producing color filters, which comprises dispersing or dissolving pigments and the like having spectral properties in three primary colors, and a structure reinforcing resin in an aqueous medium, in the presence of a surfactant comprising a ferrocene compound, to prepare micelle solutions of dispersions in each color, and dipping the patterned electroconductive transparent substrate to be subjected to electrolytic treatment in each color, and thus forming a color-separated filter on the substrate. The color filter produced according to the above process can be utilized for display elements of filters, such as liquid crystal display devices, electrochromic display devices, latitude display devices, plasma display panels, spectroscopic devices, solid-state photographic devices and dimmers.

Abstract: The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid having an acid dissociation constant, for loss of a proton in aqueous solution, between 0.1 and 0.01, and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.

Abstract: Plating is achieved by selecting such a pH value that an increase of the weight composition of a metal to be plated and a decrease of the weight composition of said metal to be plated upon plating are compensated each other, and employing a plating solution of said selected pH value for plating.

Abstract: A method for producing smooth metal coatings on zincated aluminum substrates using a specially formulated zincating bath containing an additive comprising a bath soluble cationic condensation polymer represented by the general formula: ##STR1## wherein: Z represents a group of atoms necessary to complete a heterocylic compound having a five or six membered ring containing at least 2 nitrogen atoms;R is nothing or the alkyl group of an alkylating agent;X is Cl, Br or I, andn is >1.

Abstract: The present invention relates to a process for the preparation of polyaluminum hydroxychloride complexes having the general formula Al(OH).sub.x Cl.sub.y in solution or in solid form and intended to be used as flocculants and coagulants for water purification, sludge dewatering, plant dewatering and paper production, whereby one reacts aluminum chloride in solution with aluminum hydroxide, or aluminumoxide hydrates at a temperature of 120.degree.-170.degree. C. at an elevated pressure for 1.5-5 hrs, whereby the relationship AlCl.sub.3 :Al(OH).sub.3 is thus adjusted that the relationship OH:Al in the renewing compound Al(OH).sub.x Cl.sub.y becomes 0.5 to 1.5, preferably 0.8 to 1.2.

Abstract: This invention is an acid palladium strike bath which improves adhesion and porosity of subsequent platings of palladium or palladium alloys on metal substrates, especially those susceptible to passivation such as nickel, chromium, bronze and steel. The acid palladium strike bath which is useful for both low-speed and high speed plating operation includes a complexing agent selected from organic diamines and has a pH ranging from 2.0 to 6.0, preferably from 3.7 to 4.1. When used on easily corrodable substrates, such as copper, the palladium strike deposit protects the parts from chemical attack in the subsequent mainplating bath and prevents its contamination.

Abstract: A new method for purification of trivalent chromium electroplating baths contaminated with cationic metal ions is disclosed. In this purification process, the contaminated trivalent chromium is passed at the pH level of the bath through one or more columns containing an ion-exchange resin having the picolylamine group as the functional moiety. The cationic metal ions are preferentially bound to the resin while the trivalent chromium is passed through the resin with substantially no adsorption thereby purifying the electroplating bath. This process is preferably performed simultaneously with the electroplating process.

Abstract: The present invention provides a process for electroplating chromium using lead anodes while achieving the advantages of using methanesolfonic acid without suffering the excessive anode-corrosion characteristics associated with that acid. Accordingly, chromium is electrodeposited from a bath containing chromic acid, sulfate and an alkylpolysulfonic acid containing from one to about three carbon atoms. The invention also provides a plating process for chromium electrodeposition, a plating bath for use in the inventive process, and a replenishment composition for existing plating baths.

Abstract: Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having gold plated copper circuitization on a polyimide substrate. The method includes the steps of forming a pattern of copper circuitization on the selected portions of the polyimide substrate, and thereafter depositing a gold thin film of selected portions of the copper circuitization layer. The gold thin film is electrodeposited from an electrodeposition solution of KAu(CN).sub.2, K.sub.2 HPO.sub.4, and KH.sub.2 PO.sub.4, modified by the addition of an effective amount of NH.sub.4.sup.+.

Abstract: In accordance with this invention, a waste gas containing toxic NF.sub.3 gas is contacted with a honeycomb structure of a carbonaceous material to thereby convert NF.sub.3 into nontoxic CF.sub.4 and H.sub.2 gases with high efficiency.

Abstract: The rare earth borides, e.g., the tetraborides and hexaborides of lanthanum, cerium and praseodymium, are directly prepared by heating/reacting a mixture of at least one rare earth chloride and elemental boron at an elevated temperature, e.g., a temperature ranging from 1,200.degree. to 1,500.degree. C.

Abstract: A process for depositing tin upon a steel strip by high speed electroplating to produce tinplate, which includes a basis solution of an alkyl sulfonic acid, a solution soluble tin compound and a surfactant, preferably of an alkylene oxide condensation compound of 1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or 2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of six carbon atoms or less. After electroplating, the tinplate is rinsed and the rinse water only needs to be treated for removal of tin ions prior to discharge by normal procedures.

Abstract: Improved through-hole plating of printed circuit boards, wherein the ratio of the printed circuit board thickness to the diameter of at least one through hole is greater than 3 to 1, is achieved by a high-throw acid copper plating bath of this invention. The high-throw acid copper plating bath comprises an aqeuous solution of (A) copper sulfate, (B) sulfuric acid, (C) chloride ion, e.g., hydrochloric acid, (D) a carrier, (E) a brightener, and (F) an alkali metal salt; wherein the plating bath has a pH of not greater than about 1, the concentration of the hydrochloric acid is from about 6.0.times.10.sup.-4 to about 1.8.times.10.sup.-3 moles/liter, and the mole ratio of copper sulfate:sulfuric acid is not greater than about 1:25. Unlike previous high-throw acid copper plating baths, the bath of this invention contains an alkali metal salt. The use of the alkali metal salt makes it possible to maintain a lower acid concentration resulting in easier maintenance and more consistent plating.

Abstract: Chlorine dioxide, useful as a pulp mill chemical, is produced without producing sodium sulfate effluent for disposal, by effecting reduction of chloric acid in an aqueous reaction medium in a reaction zone at a total acid normality of up to about 7 normal in the substantial absence of sulfate ion and in the presence of a dead load of sodium chlorate added to and subsequently removed from the reaction medium. Chloric acid for the process is produced electrolytically from an aqueous solution of the deadload sodium chlorate and make-up quantities of sodium chlorate. The chloric acid reduction to produce chlorine dioxide may be effected using methanol or electrolytically.

Abstract: A transparent, strong CsI alloy havign additions of monovalent iodides. Although the perferred iodide is AgI, RbI and CuI additions also contribute to an improved polycrystalline CsI alloy.

Abstract: The present invention disclosed metal-coated fibers and metal matrix composites made therefrom comprising metal-coated carbon or graphite fiber which have a layer of CoW or NiW alloy interposed between the fiber and its outer metal layer.