Patents Examined by Bruce M. Kisliuk
  • Patent number: 5609148
    Abstract: A method and apparatus for dicing a semiconductor wafer in which the wafer is bowed or bent by forcing it into contact with a spherical surface having parallel grooves therein and in which an array of parallel wire saws that are in registration with the grooves is forced against the wafer for sawing parallel channels therethrough. A second array of parallel wire saws that are orthogonal to the wires of the first array is provided spaced therefrom for sawing parallel channels through the wafer that are orthogonal to the channels produced by the first array of parallel wire saws.
    Type: Grant
    Filed: March 31, 1995
    Date of Patent: March 11, 1997
    Assignees: Siemens Aktiengesellschaft, Kabushiki Kaisha Toshiba
    Inventors: Alexander Mitwalsky, Katsuya Okumura
  • Patent number: 5609517
    Abstract: A composite polishing pad is provided, with a supporting layer, nodes attached to the supporting layer, and an upper layer attached to the supporting layer which surrounds but does not cover the nodes. The support layer, nodes, and upper layer may all be of different hardnesses.
    Type: Grant
    Filed: November 20, 1995
    Date of Patent: March 11, 1997
    Assignee: International Business Machines Corporation
    Inventor: Michael F. Lofaro
  • Patent number: 5607348
    Abstract: An apparatus for grinding a disc brake disc having opposite surfaces, the apparatus comprising: a free-standing support; a pair of rotors, at least one of which is a grinding rotor, the rotors attached to the support to extend in spaced relation at opposite sides of a disc for grinding at least one face of the disc, wherein at least one rotor is pivotally attached to the support and can be moved toward and away from the disc independent of the other rotors; adjustment means attached to the support to allow adjustment of the angle of at least one rotor in relation to a face of the disc; and drive means to rotate at least one of the rotors.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: March 4, 1997
    Inventor: Francisco R. Lopez
  • Patent number: 5605498
    Abstract: An eyeglass lens trimming machine includes spring arrangements operative between a carriage and a chassis to urge the carriage towards an associated feeler. The feeler being mobile on the chassis, auxiliary spring arrangements between it and the carriage also urge the carriage towards the feeler.
    Type: Grant
    Filed: October 5, 1994
    Date of Patent: February 25, 1997
    Assignee: Essilor International Cie Generale d'Optique
    Inventor: Michel Nauche
  • Patent number: 5604946
    Abstract: A multi-purpose fencing tool which includes an elongated member (2) having a slidably adjustable flange (3) which may be positioned and fixed along the length of elongated member (2). Elongated member (2) includes one end having a point extending therefrom for engaging a link on a chain and the other end presents a flattened surface for tamping. Elongated member (2) also includes a plurality of holes along its length so that slidably adjustable flange (3) may be positioned along the length of elongated member (2) and fixed in its location. The tool may serve as a post puller, as an implement for tamping and compacting fill around a newly installed fence post, as an implement for assisting the fence builder in easily pulling fencing wire from a spool and as an implement for tensioning fencing wire prior to securing the wire to the post.
    Type: Grant
    Filed: February 25, 1994
    Date of Patent: February 25, 1997
    Inventor: Wilfred W. Stenerson
  • Patent number: 5605501
    Abstract: A surfacing pad adapted for use with a lapping tool has a substrate sheet having a plurality of mushroom-shaped projections which interlock with a number of loops on a lapping tool for retention of the pad on the tool. A segmented projection means is also provided.
    Type: Grant
    Filed: September 20, 1995
    Date of Patent: February 25, 1997
    Inventor: Ronald C. Wiand
  • Patent number: 5605499
    Abstract: A method for flattening an inter-layer insulating film of a semiconductor device of a multi-wiring is carried out with a chemical-mechanical polishing process by using an apparatus, which includes two-layer polishing cloth having an unwoven cloth and a hard foamed layer affixed on a support plate. In order to fluff on a surface of the hard foamed layer or recreate on the whole surface thereof, a tool is provided on the polishing cloth. A silicon wafer is held through a backing pad so that an insulating film of a semiconductor device formed on the wafer is polished by the polishing cloth by rotation of the support plate and the wafer, and at the same time the surface layer of the polishing cloth is fluffed by the tool provided with a polishing surface having the curvature as that of the backing pad. Therefore, a polishing rate can be kept stable, and uniformity of polishing quantity is improved.
    Type: Grant
    Filed: April 13, 1995
    Date of Patent: February 25, 1997
    Assignee: Speedfam Company Limited
    Inventors: Misuo Sugiyama, Hatsuyuki Arai
  • Patent number: 5604966
    Abstract: A seaming device for connecting building panels in a continuous along adjacent side edges of two building panels in the construction of a building or light structure which is particularly suited for seaming panels with both curved and straight portions. The seaming device includes a first frame having an electric motor and two horizontally opposed rollers and a second portion having an electric motor and two horizontally opposed rollers with the first and second portions being coupled together in a hinge-like manner.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: February 25, 1997
    Assignee: M.I.C. Industries, Inc.
    Inventors: Frederick Morello, Christopher K. Kastner
  • Patent number: 5601479
    Abstract: A method and apparatus for decontaminating structures which utilizes abrasive blasting in conjunction with a reverse air flow to remove contaminants from a structure. The apparatus comprises an abrasive blasting device for projecting abrasive material through a nozzle onto a structure at a high velocity. An enclosure is connected to the blasting device which surrounds the nozzle and forms a vacuum envelope around the nozzle and a portion of the structure being decontaminated. A vacuum apparatus is connected to the enclosure for providing a reverse air flow from the enclosure to a collection chamber in the vacuum. A high pressure pump/motor assembly delivers abrasion material at high pressure from a hopper to the blasting device. As contaminants are abraded from the structure, the reverse air flow provided to the enclosure causes the abrasive material and the material abraded from the structure to be collected in the collection chamber.
    Type: Grant
    Filed: September 28, 1994
    Date of Patent: February 11, 1997
    Inventor: Eugene W. Santos
  • Patent number: 5601474
    Abstract: A polishing disc of spherical polishing device for polishing optical end surface capable of minimizing optical loss due to reflection in a returning direction. With this polishing disc of polishing device for polishing a spherical surface on optical fiber end surface, a tip end of a ferrule supporting an optical fiber is pressed against a surface of the polishing disc and a relative movement for polishing is caused between the ferrule tip end and the polishing disc surface to polish a tip end of the optical fiber into a spherical surface. The polishing disc A is constituted by a flat plate made of an elastic material and a soft plastic film which is provided on said flat plate as a film surface without containing abrasive and which has rugged patterns having a surface roughness of several microns or less. The surface of the soft plastic film is preferably a rough surface having rugged patterns of a surface roughness of 2 .mu.m or less.
    Type: Grant
    Filed: December 7, 1994
    Date of Patent: February 11, 1997
    Assignee: Seikoh Giken Co., Ltd.
    Inventor: Mitsuo Takahashi
  • Patent number: 5601003
    Abstract: An injection-molded plastic handle for tools, particularly screwdrivers, having zones of plastic of different hardness, the harder plastic being nondeformable under the forces which occur as a result of the actuating load while the softer plastic permits slight elastic deformations, and having a centrally located receiving hollow space (5) for the tang of a tool blade (2), and, in order to obtain a development which is of optimized grippability and more advantageous in use, the central hollow space is located in a center part (6) having a profiled cover surface (11) around which a cover is injected, the depressions (8) resulting from the profiling of the cover surface (11) being filled with a softer plastic until obtaining an approximately circular cross-sectional shape.
    Type: Grant
    Filed: December 12, 1994
    Date of Patent: February 11, 1997
    Assignee: Wera Werk Hermann Werner GmbH & Co.
    Inventors: Klaus Amtenbrink, Robert Hoy, Martin Strauch
  • Patent number: 5601481
    Abstract: In order to be able to sand the surface of an item (3) uniformly smooth, a sanding machine is used with sanding tools in the form of sanding rollers (29) which are rotated as well as turned in the same plane, and which at the same time herewith are also moved in a reciprocating manner transversely to and parallel with the direction in which the item is conveyed, whereby during the working stroke the sanding elements on the sanding rollers (29) will sand at all possible contact angles in relation to the item (3). The risk of sanding damage such as marks and grooves as a result of over-sanding, or the possible lack of sanding as a result of too sporadic contact, is herewith reduced, and the best possible result is achieved.Furthermore, the wear on the sanding rollers (29) is completely uniform, whereby their endurance is extended.
    Type: Grant
    Filed: February 15, 1995
    Date of Patent: February 11, 1997
    Assignee: HH Patent A/S
    Inventor: Keld O. Hundeb.o slashed.l
  • Patent number: 5601477
    Abstract: A compact cutter for drilling or cutting material, such as rock, is formed from a substrate of tungsten carbide, or other hard substance, bonded to a polycrystalline layer which includes an upper, generally planar cutting surface. The corner formed by the cutting surface and the sides of the polycrystalline layer is rounded by honing to remove cracks and other irregularities and to eliminate the need for chamfering the corner.
    Type: Grant
    Filed: March 16, 1994
    Date of Patent: February 11, 1997
    Assignee: U.S. Synthetic Corporation
    Inventors: John A. Bunting, Kenneth M. Jensen
  • Patent number: 5599225
    Abstract: A process for forming a twisted stem tool uses a specially designed clamping jaw fixture at the nose or bight portion of a half-round wire or cotter pin which helps to reduce the required clamping force and distribute that force over the entire wire-fill material interface. The jaws of the clamping fixture engage the outside of the nose over a substantial area, and in some forms actually bite into the wire or pin. After the twisting operation, the stem is placed in a swaging or coining press, and the stem beyond the fill material is reformed into a three or six-sided drive stem. The cold flow of the metal to form the flat sides locks the twisted half round wire or pin sections together so that the stem will resist unwinding if the tool is driven in a reverse direction. The coining of the stem providing flats provides a tighter confinement of the bundle of fill material at the stem, and enables a common three or six jaw Jacob's style chuck, for example, to obtain a more secure grip.
    Type: Grant
    Filed: October 11, 1995
    Date of Patent: February 4, 1997
    Assignee: Jason Incorporated
    Inventors: Rueben B. Warner, James B. Tyler
  • Patent number: 5598752
    Abstract: A torque-latch ring plier system includes a ring plier having a pair of opposed arms with opposed semi-circular segments forming an annular receptacle. A connecting link joins the pair of arms at the annular receptacle for pivotable movement. A lever is rotatably mounted to one of the arms at about its midpoint and is rotatable to engage a reaction device on the other arm for urging the arms to pivot about the link and close the opposed segments. A coupler is associated with the lever to enable a torque wrench to be connected such that operation of the torque wrench is effective to operate the pliers and establish a selected torque at the opposed segments. The system further includes a tilting bench plate for releasably holding a device to be tightened for angularly positioning the device for ease of access.
    Type: Grant
    Filed: August 14, 1995
    Date of Patent: February 4, 1997
    Assignee: Daniels Manufacturing Corporation
    Inventors: George G. Daniels, Robert D. Gracey, Jr.
  • Patent number: 5597341
    Abstract: To planarize an insulating film formed on a semiconductor substrate, a polishing slurry containing cerium oxide is used to polish the surface of the insulating film. Using the cerium oxide included slurry as a polishing agent, the insulating film is not contaminated by alkali metal is during the polishing process. Furthermore, the insulating film is polished at an enhanced polishing rate.
    Type: Grant
    Filed: May 26, 1995
    Date of Patent: January 28, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masako Kodera, Hiroyuki Yano, Atsushi Shigeta, Riichirou Aoki, Hiromi Yajima, Haruo Okano
  • Patent number: 5597346
    Abstract: An improved semiconductor wafer carrier (16) holds semiconductor wafer (14) during a CMP process and achieves a more uniform layer of slurry (24) at greater polishing speeds. Carrier (16) directs slurry (24) between semiconductor wafer (14) and conditioning pad (22) and includes wafer holding surface (52) for holding semiconductor wafer (14) as semiconductor wafer (14) contacts conditioning pad (22) and slurry (24). Outer rim portion (56) surrounds semiconductor wafer holding surface (52). A plurality of slurry channels (58) associate with outer rim portion (56) for receiving slurry (24) and directing slurry (24) between semiconductor wafer (14) and conditioning pad (22) for maintaining a uniform layer of slurry (24) between semiconductor wafer (14) and conditioning pad (22).
    Type: Grant
    Filed: March 9, 1995
    Date of Patent: January 28, 1997
    Assignee: Texas Instruments Incorporated
    Inventor: Eugene O. Hempel, Jr.
  • Patent number: 5595531
    Abstract: A random orbit sander having a speed limiter includes a bearing upon which a platen is rotatably mounted. The speed limiter includes a braking member formed of a non-magnetic, electrically conductive material fixed relative to the platen of the sander. The spin limiter also includes at least one magnet supported by a housing of the sander and being disposed adjacent the braking member. A magnetic field formed by the at least one magnet intersects the braking member wherein relative movement between the at least one magnet and the braking member results in the generation of an eddy current force which inhibits rotation of the platen.
    Type: Grant
    Filed: July 26, 1995
    Date of Patent: January 21, 1997
    Assignee: Ryobi North America
    Inventors: Paul W. Niemela, David G. Peot
  • Patent number: 5595533
    Abstract: A power transmission belt having an endless body with a length and defining an elongate rib. The body has an inside, an outside, and laterally spaced sides. The rib has an exposed surface to engage with a cooperating pulley. At least a first portion of the exposed rib surface is formed by at least one of grinding and cutting. There is a second portion of the exposed surface that is neither cut nor ground during formation of the power transmission belt.
    Type: Grant
    Filed: October 3, 1995
    Date of Patent: January 21, 1997
    Assignee: Mitsuboshi Belting Ltd.
    Inventor: Toshimi Kumazaki
  • Patent number: 5594981
    Abstract: An apparatus is disclosed which has utility for assembling a flexible tubular segment telescopically upon an end portion of a length of tubing when the tubing has an outer diameter which is substantially the same or greater than the inner diameter of the tubular segment. The apparatus has the capacity to controllably stretch the flexible tubular segment sufficiently to facilitate passage therethrough of an end portion of a length of the tubing. The end portion of the length of tubing is then positioned inside the stretched flexible tubular segment such that the stretched tubular segment is located a pre-selected distance from the free end of the end portion of the length of tubing. The tubular segment is then allowed to contract around the the end portion. The assembled tubular segment and end portion of the length of tubing are then ejected from the apparatus while maintaining the pre-selected distance of the tubular segment from the free end of the end portion of the length of tubing.
    Type: Grant
    Filed: September 21, 1995
    Date of Patent: January 21, 1997
    Assignee: Abbott Laboratories
    Inventors: Carl J. Piontek, Bradford L. Buck