Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract: A layer of transparent conductive material is disposed on a surface of a substrate. Further layers of conductive material are deposited on the layer of transparent conductive material or on an opposite surface of the substrate. The layers are selectively etched to yield a layout of pads for mounting electrical components and conductive traces forming an electrical circuit.

Abstract: A device for fitting printed circuit boards (5) with contact pins (7), comprising at least one insertion device (1) for inserting at least one contact pin (7) into a printed circuit board (5), at least one measuring device (3) for measuring the angle of insertion (?) between the at least one inserted contact pin (7) and the printed circuit board (5), wherein the measuring device (3) comprises a sensor assembly (9) having at least two sensors (11) arranged at different heights above the printed circuit board (5) in such a way that the contact pins (7) can be detected by the sensors (11). At least one of the sensor assemblies (9) and the printed circuit board (5) are capable of being displaced in a plane parallel to the printed circuit board (5).

Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

Abstract: The present invention provides a securing device for securing a card to a socket within a computer is provided where the card and the socket are coupled. The device includes a unitary base member comprising a foundation portion dimensioned to receive a stationary socket and an arm portion orthogonally positioned relative to the foundation. A first engaging means is formed on at least one side of the arm member. The device also includes a clasp assembly that includes an opening for slideably receiving the arm portion of the unitary base member, a recess for receiving a non-connecting end of a card, and a second engaging means for securely engaging the first engaging means. The clasp assembly secures the card to the socket with the socket received in the foundation portion and edge of the card is received in the recess.

Abstract: A method for sealing a housing includes providing a base plate of the housing with at least one opening; providing an electrical connection that extends through the base plate from an inner side to an outer side of the base plate; and applying a sealing compound into the opening from an outer side of the base plate in order to seal an interface between the base plate and the electrical connection.

Abstract: This invention provides a solder ball loading apparatus which enables fine solder balls to be loaded on pads while void is blocked from being caught into bump upon reflow. Inactive gas is supplied and the inactive gas is sucked from a loading cylinder located above a ball arrangement mask so as to gather solder balls. The gathered solder balls are rolled on the ball arrangement mask by moving the loading cylinder horizontally and the solder balls are dropped onto connecting pads on a multilayer printed wiring board through openings in the ball arrangement mask. Oxidation of the solder balls and mixture of voids upon reflow are prevented by loading the solder balls in the atmosphere of inactive gas.

Abstract: An animal training apparatus including an electrical conductor embedded within a flexible member, and a housing having a through-opening for receiving the electrical conductor therethrough. The flexible member is molded around the electrical conductor and the antenna, while the electrical conductor is positioned such that it extends into the housing through the through-opening. As a result of the molding process, the flexible member shields the housing through-opening, discouraging substances such as water from accessing the interior of the housing via the through-opening.

Abstract: A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.

Abstract: According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes applying a coating layer of electrically conductive transparent compounds onto a substrate; depositing in a vacuum deposition chamber an electrically conductive material onto the coating layer to form an electrically conductive layer; applying an etch-resist material on selective areas of the electrically conductive layer, wherein the selective areas are substantially areas pre-designed to carry the conductive objects; and chemically etching the electrically conductive material from exposed areas of the electrically conductive layer that are not covered by the etch-resist material.

Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

Abstract: Systems, methods, and apparatus are provided for electronic device manufacturing. The invention includes removing a first substrate carrier and a second substrate carrier from a moving conveyor using an end effector assembly and concurrently transferring the first and second substrate carriers from the moving conveyor to a support location via the end effector assembly. Numerous other aspects are provided.

Abstract: The present invention provides methods of manufacturing a high efficiency solar cell. In one embodiment, in a solar cell having a grid pattern that channels current, a defect causes an undesired current flow is removed by mechanically removing a portion of the grid pattern, thereby passivating the defect by removing a segment of the solar cell adjacent the defect. The segment also includes the front and back portions of the solar cell at the location of the defect without including the defect.

Abstract: The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates.

Abstract: An improved LED lamp manufacturing method is described. An LED lamp bulb and a pair of electrical cables are provided. The LED lamp bulb is electrically coupled with the pair of electrical cables. A main body is provided to enclose the LED lamp bulb, wherein the main body consists of a first plastic member and a second plastic member. The first plastic member is coupled with the second plastic member.

Abstract: An antenna wire (210, 260, 310, 410, 510, 610, 710) is mounted to a substrate (204, 254, 304, 404, 504, 604, 704) so that end portions (210a/b, 260a/b, 310a/b, 410a/b, 510a/b, 610a/b, 710a/b) of the wire are spaced far enough apart for a transponder chip (208, 250, 308, 408, 508, 608, 708) to be positioned therebetween, such as into a recess (206, 256, 306, 406, 506, 606, 706) in the substrate. The end portions are left unmounted, as “wire bridges”, “jump loops”, or “flat loops”. The end portions may be re-positioned to be over the terminals (208a/b, 258a/b, 308a/b, 408a/b, 508a/b, 608a/b, 708a/b) of the chip for bonding. Or, the chip (or substrate) may be moved (such as side-to-side, or rotated) so that the chip's terminals are under the end portions of the wire for bonding. Insulation may be removed from the end portions of the wire prior to bonding.

Abstract: Described are methods for fabricating high speed metallic electrical interconnects for printed wiring board for high speed transmission of a data signal across an interconnect in a systems. The trench under electrical signal line is made using the separate dielectric layer having through holes opened through that said dielectric layer and aligned with electrical signal line. The layer with through holes aligned with electrical signal line sandwiched in between layer carrying the electrical signal line and a layer carrying ground conducting line for the case of microstrip-type transmission line. The two separate layers with the through-holes opened and aligned with the electrical signal line are needed for the stripline-type transmission line. Multi-layers board having high speed electrical signal lines can be made utilizing the configuration described.

Abstract: LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces.

Abstract: A method for producing a portable electronic object having contact pads arranged on a plane with a thickness which differs from the thickness of a standard smartcard. The object is electrically connected to data transfer station connectors, by delivering a data transfer station having an electric probe connector and submitting the object to the data transfer station in such a way that the contact pads thereof are accessible to the electric probes in a direction perpendicular to the plane. Objects obtainable include UBS keys or PCMCIA cards or readers.

Abstract: A circuit board assembly fixture is used in assembling a circuit board assembly. The fixture includes supporting surfaces each including a first side and an opposite second side, wherein each first side receives at least one of the fixed circuits to be coupled together using at least one flexible circuit. The fixture also includes at least one hinge to couple the supporting surfaces together, wherein the hinge enables the supporting surfaces to be folded into a desired alignment relative to each other and provides structural support for the assembly. Moreover, the fixture includes at least one fastening mechanism extending from the surface first side to retain the fixed circuits in position relative to the supporting surfaces. Further, the fixture includes at least one retainer coupled to at least one of the supporting surfaces to retain an alignment of each of the supporting surfaces relative to each other.