Abstract: Chemical mechanical polishing (CMP) of thin film materials using a slurry including a surfactant chemical operative to polish high portions of the film being planarized while preventing the polishing of low portions of the film is disclosed. The low portions can be in a step reduction region of a deposited film. The CMP process can be used for form a planar surface upon which subsequent thin-film layers can be deposited, such as an electrically conductive material for an electrode. The subsequently deposited thin-film layers are substantially planar as deposited without having to use CMP. The resulting thin-film layers are planar and have a uniform cross-sectional thickness that can be beneficial for layers of memory material for a memory cell. The processing can be performed back-end-of-the-line (BEOL) on a previously front-end-of-the-line (FEOL) processed substrate (e.g., silicon wafer) and the BEOL process can be used to fabricate two-terminal non-volatile cross-point memory arrays.

Abstract: A method for using a segmented grounding system, including a bit including a coupling portion at a first end, and a generally tapered second end, a shaft with a first end configured to couple to the coupling portion of the bit, and a second end comprising a receiving structure, and a tool configured to couple to the receiving structure of the second end of the shaft.

Abstract: A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.

Abstract: Insulated electrically conductive fibers or microwires of sizes on the order of 1 mil (25 microns) diameter, so as to be suitable for processing into yarns or multi-microwire bundles, for example, for incorporation into conformable fabric products or for use as wearable electronic circuitry are made by coprocessing a core of a lower-melting-point metal within a sheath of a higher-melting-point polymer.

Abstract: There are provided the steps of mounting a semiconductor chip on a first substrate, providing an underfill resin between the semiconductor chip and the first substrate, forming a through hole on a second substrate, providing an electrode on the second substrate, bonding the first and second substrates to include the semiconductor chip through the electrode, and filling a sealing resin between the first and second substrates at a filling pressure capable of correcting a warpage generated on the semiconductor chip and the first substrate while discharging air from the through hole.

Abstract: A method for making an electronic switch mountable on a circuit board includes the steps of: (A) providing a housing that includes a base having opposite inner and outer sides, and a cover body having a main portion that cooperates with the inner side of the base to define a chamber, and an end portion that cooperates with the outer side of the base to define a sealing space; (B) providing a terminal having a connecting part extending through the base and the sealing space for connection with the circuit board; (C) providing the base with a hollow portion that projects outwardly from the outer side thereof into the sealing space and that confines an air-discharge hole communicating fluidly with the chamber; (D) providing a first adhesive layer to seal the sealing space without covering the air-discharge hole; and (E) sealing the air-discharge hole.

Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

Abstract: An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.

Abstract: A method of manufacturing a metal-insulator-metal (MIM) capacitor that includes at least one of the following steps: Sequentially forming a bottom metal film, an insulating film, and a top metal film over a wafer. Forming a first pattern for etching the top metal film and the insulating film. Etching the top metal film and the insulating film, using the formed first pattern, and then stripping the first pattern. Conducting a heat treatment and a cooling split for the wafer. Forming a metal pattern for etching the bottom metal film. Etching the bottom metal film, using the formed metal pattern, and then stripping the metal pattern.

Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Abstract: A method is disclosed for the fabrication of feedthrough devices that can transmit a single or plurality of electrical signal(s) to or from within a leak-tight (hermetic) chamber from or to the outside of said leak-tight (hermetic) chamber. The invention allows materials known to be well-tolerated within the human body such as alumina-oxide ceramic and platinum to be used as raw materials in the fabrication of body-compatible, single or multi-channel leak-tight (hermetic) feedthroughs.

Abstract: A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

Abstract: The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided LCP, where both the high and low temperature LCP are provided with a z-axis connection. The single sided conductive layer is a bus layer to form z-axis conductive stud within the high and low temperature LCP. High and low temperature LCP layers are etched or built up to form circuit patterns and subsequently bonded together to form final multilayer circuit pattern where the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond.

Abstract: A method is described for manufacturing electronic assemblies (52). Electronic die (36) held in a plastic matrix (43) form a partially completed panel (35) of electronic assemblies (52). The panel (35) is adhesively mounted to a ceramic carrier (20) having multiple holes (22) there through. Conductive interconnects (38-1, 38-2, etc.) and other layers are applied to the panel, coupled to electrical contacts on the die (36) and external electrical contacts (39-1) for the panel (50). The panel (50) and the carrier (20) are separated and the panel singulated to release the finished electronic assemblies (52). Silicone is a preferred adhesive (27) and is dissolved using a non-polar solvent (70) that penetrates through the holes (22) in the carrier (20) to the adhesive (27). The adhesive (27) is preferentially applied using a transfer adhesive sandwich (24), that is, an adhesive layer (27) with removable plastic sheets (25, 26) on either side that can be peeled away from the adhesive (27).

Abstract: An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

Abstract: A method for installing compression connectors of various sizes and types on the end of a coaxial cable utilizes a tool having a base mounting a pair of movable anvils for engaging two different lengths of connectors. The movable anvils define an aperture which is shaped to permit easy entry and exit of a cable while still applying a suitable retention force to an inserted cable. A slidably mounted plunger cooperates with the anvils to compress a connector. One of the anvils has an aperture size that permits the anvil to squeeze or pinch an inserted cable and thereby restrain a cable longitudinally during initial seating of the connector onto a cable by means of the plunger.

Abstract: Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

Abstract: An electronic component mounting method for mounting a electronic component on a board, in which an Au bump provided at an electronic component is joined to a joining terminal formed on a board by using solder made of Sn or solder containing Sn and the electronic component is adhered to the board by means of thermosetting resin thereby to mount the electronic component on the board. The applied thermosetting resin is flown toward the outside by the lower surface of the electronic component, then a part of the solder particles contained within the thermosetting resin are made in contact with the side surfaces of the Au bumps which are heated to the temperature higher than the melting point of the solder and also another part of the solder particles are molten in a state of being sandwiched between the Au bumps and the electrodes. Thus, the diffusion of Sn into the Au bumps from the outside is promoted and so the density of Sn within the Au bumps can be increased.

Abstract: A method for manufacturing an electronic substrate including an electronic component bonded with adhesive to a base part, comprises (a) applying a droplet containing the adhesive to an area on the base part, the area facing to the electronic component, within a range substantially equal to a size of the electronic component by using a droplet ejection head moving in relatively to the base part, and (b) mounting the electronic component on the adhesive applied to the base part.

Abstract: A method forming at least a portion of a cable comprises providing at least one cable conductor core, extruding at least an inner layer of a polymeric insulation material over the at least one conductor core, providing a plurality of strength members having a coating of the polymeric insulation material, heating the at least one cable conductor core and the strength members, embedding the strength members into the inner layer of the cable conductor core, and extruding an outer layer of the polymeric insulation material over the cable conductor core and the plurality of strength members and bonding the outer layer to the inner layer and the coating to form the cable and provide a contiguous bond between the inner layer, the strength members, and the outer layer, wherein the polymeric insulation material of the inner layer, the strength member coating, and the outer layer are amended to enable the inner layer and the outer layer to melt at a greater rate than the strength member coating.