Patents Examined by C. J. Arbes
  • Cable termination methods
    Patent number: 7743496
    Abstract: A termination for a multi-conductor cable is made by providing a metal structure that includes a plurality of parallel but spaced apart fingers that are joined together by a connecting member adjacent at least one end of each finger. Each of the conductors in the cable is connected to a respective one of the fingers at a location that is spaced from the connecting member. The cable and the fingers are then over-molded with an insulating material where the conductors are connected to the fingers. This over-molding leaves a portion of the length of each finger exposed. The connecting member is then severed and removed.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: June 29, 2010
    Assignee: Apple Inc.
    Inventor: Christopher D. Prest
  • Mounting method of passive component
    Patent number: 7743491
    Abstract: The present invention relates to a mounting method of passive component, and particularly relates to a mounting method of a small-size passive component. A passive component partially covered by an adhesive material is provided. Before the adhesive layer is melted, the adhesive material is melted and then solidified to form a fixing structure between the passive component and a substrate for fixing the passive component on the substrate. Therefore, the tombstone problem caused by uneven pulling force that the melted solder applies to the two ends of the passive component is effectively solved. The yield rate is increased, and the product loss is reduced.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: June 29, 2010
    Assignee: Advaced Semiconductor Engineering, Inc.
    Inventors: Wen-Shin Lin, Wei-Chih Wang
  • Method of manufacturing cord management device
    Patent number: 7743495
    Abstract: A method of manufacturing a cord management device. The method includes: (a) providing a power strip; (b) physically and electrically coupling a power cord to the power strip; (c) providing a stationary portion, providing the stationary portion includes: (1) providing a first wall; (2) providing two or more slots in the first wall configured to contain a first portion of a single electrical cord; and (3) providing a second wall spaced part from the first wall, the first wall and second wall defining a first space there between; (d) providing a cover; (e) hingedly attaching the cover to the stationary portion, thereby defining a second space; (f) integrating the power strip into the second space; and (g) locating a portion of the power cord in the first space.
    Type: Grant
    Filed: June 7, 2007
    Date of Patent: June 29, 2010
    Assignee: Belkin International, Inc.
    Inventors: Kenneth Mori, Barry Sween, Yoko Iida, John Wadsworth
  • Method for forming surface graft, conductive film and metal patterns
    Patent number: 7739789
    Abstract: The present invention provides a method for forming a surface graft, comprising the process of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and a surface graft material obtained thereby.
    Type: Grant
    Filed: March 24, 2005
    Date of Patent: June 22, 2010
    Assignee: FUJIFILM Corporation
    Inventors: Takeyoshi Kano, Koichi Kawamura
  • Method of manufacturing circuit board
    Patent number: 7735220
    Abstract: A circuit board for a brushless DC motor whose rotation is controlled based on data stored on a rewritable non-volatile memory of a micro-computer mounted on the circuit board includes a substrate defined by a plurality of a circuit areas and a non-circuit area. The circuit areas and the non-circuit area are connected by a plurality of conductive patterns. The micro-computer having the rewritable non-volatile memory is mounted on each of the circuit areas. The rewritable non-volatile memory is connected to writing terminals arranged on the non-circuit area by the conductive patterns. By connecting a program writer to the writing terminals and activating the program writer, data are written to the rewritable non-volatile memory of each of the circuit areas. After writing data, the circuit areas are detached from the substrate, and a plurality of circuit boards are manufactured.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: June 15, 2010
    Assignee: Nidec Corporation
    Inventors: Tatsuhisa Fujii, Tomotaka Yonemitsu
  • Processes for manufacturing printed wiring boards
    Patent number: 7730613
    Abstract: Methods of manufacturing printed wiring boards including electrically conductive constraining cores that involve a single lamination cycle are disclosed. One example of the method of the invention includes drilling a clearance pattern in an electrically conductive constraining core, arranging the electrically conductive constraining core in a stack up that includes B-stage (semi-cured) layers of dielectric material on either side of the constraining core and additional layers of material arranged to form the at least one functional layer, performing a lamination cycle on the stack up that causes the resin in the B-stage (semi-cured) layers of dielectric to reflow and fill the clearance pattern in the electrically conductive constraining core before curing and drilling plated through holes.
    Type: Grant
    Filed: March 6, 2007
    Date of Patent: June 8, 2010
    Assignee: Stablcor, Inc.
    Inventor: Kalu K. Vasoya
  • High capacity pick and place process
    Patent number: 7730611
    Abstract: A method of accurately placing an object with a pick and place machine provides raw material. A desired surface topography is created in the raw material. The raw material is diced into parts using a bevel cut so that each of the parts has bevel surfaces. A fixture is provided that has a plurality of spaced cavities with each cavity having bevel surfaces constructed and arranged to mate with the bevel surfaces of an associated part. A pick and place machine picks and places each part into an associated cavity such that the bevel surfaces of the part mates with the bevel surfaces of the cavity.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: June 8, 2010
    Assignee: Siemens Energy & Automation, Inc.
    Inventors: Ulf Becker, David Halk
  • Method of making electrically conductive patterns on a substrate
    Patent number: 7726015
    Abstract: The invention concerns a method which consists in coating uniformly the non-developable surface (6) with an electrically conductive material (9), which is in turn coated, by spraying, with a pattern (10) of polymerizable protective material, said pattern being polymerized as it is being formed, and then selectively eliminating, through the openings (10.8) of said pattern (10), the portions of said electrically conductive material (9) which do not over said electrically conductive patterns.
    Type: Grant
    Filed: February 20, 2006
    Date of Patent: June 1, 2010
    Assignee: Astrium SAS
    Inventors: Christian Desagulier, Alain Lacombe, Bruno Esmiller
  • Method of fabricating an electrical feedthru
    Patent number: 7726017
    Abstract: A method and apparatus for electrically interfacing between two or more distinct environments. The method and apparatus are directed to an electrical feedthru with exterior traces traversing a core. The electrical feedthru may be very small, facilitating its use in MEMS devices. The electrical feedthru may also include an over-mold shaped to create a mechanical seal between the two or more distinct environments without the use of an O-ring. The electrical feedthru is not limited to any particular geometry, it may be adapted to fit between any two environments, and thus the traces are not necessarily parallel to a central axis of the core.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: June 1, 2010
    Assignee: Schlumberger Technology Corporation
    Inventors: Cliff Evans, Mark William Dalton
  • Method of producing electrically conductive patterns on a substrate
    Patent number: 7721426
    Abstract: The invention concerns a method for producing electrically conductive patterns on a non-developable surface of an insulating substrate, and the resulting device. The invention is characterized in that it consists in: coating the non-developable surface (6) uniformly with a layer of electrically conductive material (9), which is in turn coated with a layer of protective material (10), and then, using a mobile laser head, eliminating by laser ablation the portions of said protective substance layer (10) which do not cover said electrically conductive patterns, then eliminating the portions of said electrically conductive material (9) exposed by the elimination of said portions of said protective material layer (10).
    Type: Grant
    Filed: February 20, 2006
    Date of Patent: May 25, 2010
    Assignee: Astrium SAS
    Inventors: Christian Desagulier, Alain Lacombe, Bruno Esmiller
  • Method for manufacturing single sided substrate
    Patent number: 7721427
    Abstract: Holes (40a) are formed with a laser beam through an insulating substrate (40) on which a metallic layer (42) is formed and via holes (36a) are formed by filling up the holes (40a) with a metal (46). After the via holes (36a) are formed, a conductor circuit (32a) is formed by etching the metallic layer (42) and a single-sided circuit board (30A) is formed by forming projecting conductors (38a) on the surfaces of the via holes (36a). The projecting conductors (38a) on the circuit board (30A) are put on the conductor circuit (32b) of another single-sided circuit board (30B) with adhesive layers (50) composed of an uncured resin in-between and heated and pressed against the circuit (32b). The projecting conductors (38a) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (32b).
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: May 25, 2010
    Assignee: Ibiden Co., Ltd.
    Inventors: Ryo Enomoto, Yasuji Hiramatsu
  • Method for inserting of preformed hairpin conductors into a rotor or stator
    Patent number: 7721413
    Abstract: Method and apparatus for insertion of preformed rotor and stator conductors into a twisting machine for forming hairpin shaped conductors of rectangular wire into stator conductors.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: May 25, 2010
    Assignee: Tecnomatic, S.p.A.
    Inventor: Sante Guercioni
  • Method of manufacturing a probe card
    Patent number: 7716824
    Abstract: An object of the present invention is to finely conduct an inspection of high integration devices by making it possible to form guide holes in a support plate of a probe card in a narrower pitch than in the conventional case of forming the guide holes in a support plate of the same area, and to broaden a range of options for an elastic member which works to urge a probe pin. The present invention has a circuit board and a support plate being placed under the circuit board and supporting the probe pin. In the guide hole formed in the support plate, the probe pin composed of an elastic portion and a pin portion is inserted, and a rip of the pin portion protrudes downward from the support plate. The guide hole has a quadrangular horizontal sectional shape.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: May 18, 2010
    Assignee: Tokyo Electron Limited
    Inventor: Kiyoshi Takekoshi
  • Method of moving at least two elements of a placement machine
    Patent number: 7716822
    Abstract: A method and placement device are provided for moving at least two elements in and opposite to a predetermined direction. The second element is simultaneously moved by means of the first element. The first element is moved in the predetermined direction, whereas the second element is moved relative to the first element in a direction opposite to the predetermined direction and vice versa.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: May 18, 2010
    Assignee: Assembleon N.V.
    Inventors: Benjamin C. H. Smeets, Josephus M. M. Van Gastel
  • Method of manufacturing a circuit board assembly for a controller
    Patent number: 7716821
    Abstract: A method of manufacturing a circuit board assembly for a controller. The method includes providing first and second printed circuit boards wherein the first printed circuit board has a plurality of copper pads containing slots therein that correspond to a plurality of power tabs in the second printed circuit board. The power tabs are then slid into the slots and the tabs are flooded with copper. At this time the power tabs are soldered within the slots to provide an electrical connection between the first and second printed circuit boards that allows for the transfer of current between the boards of more than three amps.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: May 18, 2010
    Assignee: Sauer-Danfoss Inc.
    Inventors: Xiao Yan, Thomas J. Bergherr
  • Method for assembling flexible bus connector
    Patent number: 7712215
    Abstract: A method for assembling a flexible bus connector is disclosed, which includes the following steps. The first is a preparing step. An insulative housing and a plurality of terminals are provided. The insulative housing defines an opening and a plurality of passageways, and forms an upper side wall, a lower side wall, and a rear wall corresponding to the opening. The second is an assembling step. Each terminal includes at least a contact portion, a support portion and a soldering portion. The contact portion and the support portion are located near the opening when assembled, and the soldering portion extending toward the rear wall of the insulative housing. The third is a positioning step. A lower end of the soldering portion is located on a position where the lower end is lower than an inner surface of the lower side wall of the insulative housing.
    Type: Grant
    Filed: January 7, 2008
    Date of Patent: May 11, 2010
    Assignee: P-Two Industries Inc.
    Inventors: Chien Chun Wang, Tung Chiung Kua
  • Acoustic noise reduction in a computer system having a vented cover
    Patent number: 7707711
    Abstract: A vented cover includes a pair of cross-flow ventilation ducts each including an acoustic noise reduction lining. The ducts are “cross-flow” in that they cross and bypass one another. The cover is affixed to an enclosure containing components of a computer system and abuts against a panel of the enclosure having an airflow aperture. An air moving device (AMD) passes air through the enclosure from the ducts if the cover is an intake cover, and/or into the ducts if the cover is an exhaust cover. The ducts increase the air path length, and the acoustic absorbing surface, thereby increasing acoustic attenuation. Airflow resistance is reduced by reducing surfaces perpendicular and close to the area where air enters and by reducing sharp turns in the ducts. The cover has a relatively thin depth because the ducts cross and bypass each other in a very space efficient manner.
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: May 4, 2010
    Assignee: International Business Machines Corporation
    Inventors: Richard Charles Bartell, Gerard Frances Muenkel, Matthew A Nobile
  • Compression tool length adjuster
    Patent number: 7703196
    Abstract: An adjustable driver pin connector compression tool comprising a body that is configured for receiving a plurality of different sized connectors. A sliding head assembly is slidably mounted within the interior of the body. The sliding head assembly being operatively coupled to a driver pin bolt moveable between at least two fixed driver pin positions.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: April 27, 2010
    Assignee: John Mezzalingua Associates, Inc.
    Inventor: Shawn Chawgo
  • Packaging method for assembling screw on printed circuit board
    Patent number: 7703200
    Abstract: A packaging method for assembling a screw to a printed circuit board (PCB) includes the steps of: providing a screw having a head, a threaded shank, and a ferrule enclosing the threaded shank; mounting a stop ring on the threaded shank to maintain a predetermined height from top of the head to bottom of the ferrule; using a tool to fetch the screw and align the threaded shank with one through hole provided on the PCB; releasing the screw from the tool for a flange of the ferrule to extend into the through hole on the PCB; heating to melt a solder layer atop of the PCB, so that the ferrule is fixedly held to the PCB when the molten solder layer is cooled and hardened again; and removing the stop ring so that the threaded shank is retracted into the ferrule.
    Type: Grant
    Filed: February 18, 2008
    Date of Patent: April 27, 2010
    Assignee: Fivetech Technology Inc.
    Inventors: Ting-Jui Wang, Ming-De Wu
  • Method of making a bottomless via
    Patent number: 7694413
    Abstract: A method for forming a copper interconnect is described. An opening in a dielectric layer disposed on a substrate is formed. A barrier layer is formed on the opening. A seed layer is formed on the barrier layer. The seed layer includes a noble metal copper alloy, the copper having less than 50% of the atomic weight of the noble metal copper alloy.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: April 13, 2010
    Assignee: Intel Corporation
    Inventors: Steven W. Johnston, Chin-Chang Cheng