Abstract: A method to assemble a transmitter optical module is disclosed, where the optical module installs two lenses, one of which concentrates an optical beam emitted from a laser diode, while, the other collimates the optical beam concentrated by the former lens. The method has a feature that the first lens is firstly positioned in a point to collimate the optical beam coming from the laser diode, then, moved to a point, which is apart from the former point with respect to the laser diode, to concentrate the optical beam. The process performs the steps to position the lens by a jig to extract the optical beam passing through the first lens outside of the housing.

Abstract: A method of aligning microwires includes modifying the microwires so they are more responsive to a magnetic field. The method also includes using a magnetic field so as to magnetically align the microwires. The method can further include capturing the microwires in a solid support structure that retains the longitudinal alignment of the microwires when the magnetic field is not applied to the microwires.

Abstract: A method and system for installing and removing a row of cables from a cable array is provided. The method includes providing an installation tool having a first body with a plurality of arms extending from one side. The plurality of arms being configured to receive a cable connector body, the plurality of arms including at least one first projection extending from one of the plurality of arms. The installation tool is moved onto a row of cables held coupled together by a bracket, each of the cables in the row of cables having a cable connector body. The connector bodies are engaged into receptacles and the bracket is moved with the at least one first projection.

Abstract: A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising at least one leader thread configured to be threaded through the at least one through via. Using the probing device comprises inserting a selected one of the at least one leader threads through a selected one of the at least one through via to thereby probe a surface of the printed circuit assembly; and responsive to detecting a defect in the selected through via, using a flexible circuit connected to the selected leader thread to repair the detected defect.

Abstract: An apparatus having a reduced reflection from its surface includes a dielectric material and a capacitive circuit analog sheet buried within the dielectric material and configured to produce a reflection that adds out of phase with a reflection from an incident side of the dielectric material. The capacitive circuit analog sheet comprises conductive patches configured to have high impedance for transverse magnetic (TM) polarization.

Abstract: Various technologies described herein pertain to assembling electronic devices into a microsystem. The electronic devices are disposed in a solution. Light can be applied to the electronic devices in the solution. The electronic devices can generate currents responsive to the light applied to the electronic devices in the solution, and the currents can cause electrochemical reactions that functionalize regions on surfaces of the electronic devices. Additionally or alternatively, the light applied to the electronic devices in the solution can cause the electronic devices to generate electric fields, which can orient the electronic devices and/or induce movement of the electronic devices with respect to a receiving substrate. Further, electrodes on a receiving substrate can be biased to attract and form connections with the electronic devices having the functionalized regions on the surfaces. The microsystem can include the receiving substrate and the electronic devices connected to the receiving substrate.

Abstract: A method for fabricating an M×N, P-bit phased-array antenna on a flexible substrate is disclosed. The method comprising ink jet printing and hardening alignment marks, antenna elements, transmission lines, switches, an RF coupler, and multilayer interconnections onto the flexible substrate. The substrate of the M×N, P-bit phased-array antenna may comprise an integrated control circuit of printed electronic components such as, photovoltaic cells, batteries, resistors, capacitors, etc. Other embodiments are described and claimed.

Abstract: A method of splicing shielded wire cables includes the steps of providing a first, second, and third shielded wire cable each having a core conductor axially surrounded by a shield conductor which is axially surrounded by an insulative jacket, providing a flexible insulation layer, a flexible conductive layer, and a section of dual wall heat shrink tubing. The first portion of the flexible insulation layer about the joined first, second, and third core conductors, wrapping the flexible conductive layer about the first, second, and third shield conductors, and disposing the flexible conductive layer and portions of the first, second, and third insulative jacket within the section of dual wall heat shrink tubing, thus forming a shielded wire cable splice.

Abstract: Pliers include a pair of arm members, a pair of handles, at least one interchangeable working jaw and a control mechanism. Each arm member includes two parallel arm plates. The handles are connected to each other for movement of the arm members towards and away from each other. The working jaw is detachably supported in between the arm plates of the associated arm member. The control mechanism includes a retaining spacer, a driving member and a spring biased between the retaining spacer and the driving member. The retaining spacer is positioned in between the arm plates of the arm member. The driving member is movably disposed in between the arm plates of the arm member and has an end knob exposed outside the arm member so that pressing of the end knob of the driving member drives the driving member to be engaged with or disengaged from the working jaw.

Abstract: A crimping die includes a first die for constraining the wire crimping portion by a concave die surface shaped in conformity with the wire crimping portion, and a second die including a convex die surface paired with the concave die surface. A width of a recess on the concave die surface and that of a projection on the convex die surface are equal to an outer diameter of the wire crimping portion. The wire crimping portion is pressed by the concave die surface of the first die and the convex die surface of the second die, whereby the wire crimping portion and the wire inserted into the cylindrical interior of the wire crimping portion are crimped and fixed.

Abstract: A method for manufacturing a printed circuit board of a backlight module is provided. The printed circuit board includes a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar. The heat dissipating region is connected with the light bar region. A connection location of the light bar region and the heat dissipating region is subjected to cutting to form a slot located at a side of the printed circuit board in order to prevent short-circuiting between the heat dissipating region and the conductive circuit of the light bar region. The cutting is made to partly penetrate through the thickness of a dielectric layer on which the conductive circuit is formed in order to completely separate the light bar region from the heat dissipating region.

Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

Abstract: A solder tail extender connector and method are provided for implementing production of solder tail extender connectors from compliant pins. A forming fixture is provided to collapse compliant pins prior to soldering. The compliant pin is collapsed at or beyond the normal compliant pin low end dimensions and removed from the forming fixture. A solder tail extender optionally is added to the collapsed compliant pin, forming the solder tail extender connector.

Abstract: A method of manufacturing an automobile high voltage wire harness includes setting a shrinkable tube which has a color to make the wire harness recognized as a high voltage one outside a metal pipe body which is an exterior member of one or a plurality of high voltage electrical pathway(s) wired in an automobile, making the shrinkable tube shrink to cover part of or all of the outer surface of the metal pipe body, and bending the metal pipe body to a predetermined position to be formed into a three-dimensional shape.

Abstract: When forming a module 100 having a configuration in which a column-shaped connection terminal 11, which forms an interlayer connection conductor, and an electronic component 102 are mounted on a wiring substrate 101 and sealed with a resin, the column-shaped connection terminal 11 which has a substantially T-shaped cross section and in which a first end portion has a larger diameter than a second end portion is prepared (the preparation step), an electronic component 102 is mounted on one main surface of the wiring substrate 101 and the connection terminal 11 is mounted on the one main surface in such a manner that the second end portion of the connection terminal 11 having a smaller diameter is connected to the wiring substrate 101 (the mounting step), and the electronic component 102 and the connection terminal 11 are sealed with a resin layer 103 (the sealing step).

Abstract: In some examples, a method of making a therapy delivery element configured for at least partial insertion in a living body includes braiding a plurality of fibers to form an elongated braided structure with a lumen. At least one reinforcing structure is weaved into the fibers of the braided structure. A portion of the reinforcing structure is extended from the braided structure to form at least one fixation structure. At least one of the braided structure or the reinforcing structure can be attached to at least one of an electrode assembly or a connector assembly.

Abstract: A method which comprises arranging a plurality of electronic chips in a plurality of chip accommodation cavities each defined by a respective surface portion of a substrate and a wall delimited by a respective one of a plurality of holes in an electrically conductive frame arranged on the substrate, at least partially encapsulating the electronic chips in the chip accommodation cavities by an encapsulant, and forming electrically conductive contacts for electrically contacting the at least partially encapsulated electronic chips.

Abstract: A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit to move along the drill hole formed in the first backdrilling toward the target signal layer; and when the backdrill bit is in contact with the conductive layer, completing a second backdrilling with a second preset depth starting from the conductive layer.

Abstract: There is provided an apparatus for alignment of a thin-film transistor (TFT) panel and a barrier panel of a three-dimensional (3D) display. The apparatus comprises at least one light source for illuminating pixels in at least one region of the TFT panel and for illuminating at least one region of an exposure pattern of the barrier panel; a pattern recognition system for detecting light emitted from the at least one light source that is reflected by or transmitted through the 3D display, to generate alignment data relating to an alignment between the detected illuminated pixels of the TFT panel and the exposure pattern of the barrier panel; and a positioning mechanism for adjusting the relative position between the barrier panel and the TFT panel in relation to the alignment data. The at least one light source comprises at least one invisible light source which emits invisible light outside the visible region of the electromagnetic spectrum.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.