Abstract: A method is provided for producing a metal composite. The composite includes a metal material and a resin curing layer provided along the metal material, and is obtained by using heat and pressure to mold a preform. The preform includes a sheet-shaped base material containing a thermosetting resin, and a metal material arranged or layered so as to contact the sheet-shaped base material. The method for producing a metal composite includes heating the sheet-shaped base material and semi-curing the thermosetting resin while the metal material in the preform arranged inside a mold is heated to a temperature exceeding 180° C., and molding the preform into a composite using pressure, wherein the thermosetting resin is at least one type selected from the group consisting of epoxy resins, phenol resins, benzoxazine resins, and unsaturated polyester resins.

Abstract: A method for fabricating a circuit board structure is provided. The method includes providing a first circuit board and a second circuit board, wherein the area of the second circuit board is less than the area of the first circuit board. The first circuit board and the second circuit board are combined by a surface mount technology to form the circuit board structure having a portion with a different number of layers.

Abstract: A solid state drive (SSD) assembly and an assembly method for solid state drives, which does not require using screws. The assembly method includes aligning a printed circuit board with a first cover and a second cover, the first cover having pre-installed standoffs on an inner surface thereof. The printed circuit board and the second cover respectively having a first set of through-holes, and the first set of through-holes correspond to the standoffs. The assembly method further includes placing the printed circuit board between the first and second covers, thereby exposing an end portion of each of the standoffs in the through-holes of the second cover, and deforming the end portion of each of the standoffs about the through-holes, thereby fastening the first and second covers with one another.

Abstract: A method of forming conductive traces on insulated substrate includes the steps of providing an insulated substrate; forming a coating layer on a surface of the insulated substrate, dividing the coating layer into traces-forming zones and non-traces-forming zones through laser engraving, and removing areas of the coating layer that are located in the traces-forming zones through laser-vaporizing to expose corresponding portions of the surface of the insulated substrate; forming a metallized layer of conductive traces by performing a metallizing treatment on the exposed portions of the insulated substrate and on the coating layer; and directly stripping off the residual coating layer from the non-traces-forming zones or removing it using an acid, an alkaline or a neutral solution.

Abstract: Disclosed is a procedure for manufacturing a cable connector device with a blade and the structure of the cable connector device including a printed circuit board and a cable thread. a bore is made on the printed circuit board covered with a conductive layer, and then the head of the cable connector component is placed into the bore and is soldered to the conductive layer. Then, the cable threads are held in the bladed opening of the cable connector. In the next step, the entire unit is covered by a resin case, thereby also holding the cable threads in the opening of the cable connector. The case itself consists of a single part and does not require any other holding component or plastic shell. Given the small size of the case, there is a shortened warm up period.

Abstract: A scissors-type crimping tool for crimping a female contact onto an electrical conductor, comprising a planar base member having body and first lever portions; an annular crimping die member connected for rotation between die-open and die-crimping positions relative to the base member body portion; a toggle link arrangement connecting a second lever for pivotal movement relative to the base member body portion; and a cascade spring arrangement operable by the toggle arrangement from a non-stressed condition to a stressed caged condition during initial movement of the second lever in the closed direction, and to a stressed condition during further movement of the second lever, thereby to afford processing of different cross-sections of ferrules and conductors in the crimping die, and to apply the force of the stressed cascade spring arrangement to the crimping die member during the final stage of the crimping operation.

Abstract: A process for manufacturing an electrochemically active device comprising the steps of: —providing a substrate (110) comprising an electrode receiving surface portion (111) having substantially constant wetting tension throughout said electrode receiving surface portion, —providing a plurality of first electrodes (120) directly on said electrode receiving surface portion, —leaving intermediate portions (130) of said electrode receiving surface portion (111) free from said electrodes, —providing a layer of electrolyte (140) covering said plurality of first electrodes (120) and said intermediate portions (130), and—wherein wetting tension of the surfaces of the intermediate portions (130) is arranged to act more repelling on the electrolyte compared to the wetting tension of the surfaces of the plurality of first electrodes (120), whereby, the electrolyte is concentrated to the surfaces of the plurality of first electrodes (120), and the surfaces of the intermediate portions (130) are substantially free of elec

Abstract: A process for manufacturing a fabric pressure sensor comprises cutting a sensing fabric to a pre-determined size, connecting a flexible electric wire with a wire of the sensing fabric by sewing, fixing the sensing fabric by means of a clamping positioner at a pre-determined tension, bonding a lower conversion layer with the sensing fabric by means of a lower conversion layer positioning box, bonding an adjustable column with the sensing fabric by means of an upper conversion layer positioning box, and bonding the upper conversion layer with the adjustable column by means of the upper conversion layer positioning box. A tool for manufacturing the sensor comprises an electrical property measuring device, a wire connecting tool, and a sensor structural component assembling tool. The present invention provides an easy and convenient way of manufacturing a fabric pressure sensor, monitoring the quality of manufacture, and enhancing the manufacturing precision and product yield.

Abstract: A passive cardiac electrical lead is assembled by coupling an inner conductor coil to a connector pin to form an inner conductor assembly. The inner conductor assembly is threaded through a connector insulator. An insulator tubing is placed over the inner coil. A proximal end of the insulator tubing is sleeved over the distal extension of the connector insulator. An outer conductor coil is coupled to a ring connector to form an outer conductor assembly. The inner conductor assembly is threaded through the outer conductor assembly. The ring connector is sleeved on the distal extension of the connector insulator and over the insulator tubing. A proximal seal is sleeved over a socket end of the connector pin. A portion of the proximal seal is seated on the proximal extension of the connector insulator.

Abstract: A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle ?. The angle ? is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w.

Abstract: An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the two electronic component mounting apparatuses (M5*) each of which is equipped with a tray feeder (30) is brought into the second operation mode.

Abstract: A bonding system 1 includes a plurality of laser resonators 7 and a plurality of optical fibers f1 to f36 each having a laser beam inlet connected to one of the plurality of laser resonators. The optical fibers are bundled, and laser beam outlets of the optical fibers are disposed so as to optically face a heating region S of an electronic component 3, and the heating region is irradiated with spots of laser beams emitted from the laser beam outlets. The heating region S is divided into at least corner sub-regions S1 at the corners of the electronic component and an inner sub-region S2 inside the electronic component, and the laser power of the laser resonators whose laser beam outlets face the corner sub-regions is set higher than the laser power of the laser resonators whose laser beam outlets face the inner sub-region.

Abstract: A detector comprising a circuit board, a board-side connector which is mounted on the circuit board, and a flexible cable which has a terminal part inserted in the board-side connector, wherein a reinforcement member of the flexible cable is attached to an end part of the flexible cable which includes the terminal part, and the reinforcement member includes a foldable part which allows local bending of the end part of the flexible cable.

Abstract: Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.

Abstract: A method and system for pins detection and insertion of an electronic component are provided. The method includes picking an electronic component having a plurality of pins by a pick and place device, acquiring a plurality of serial images with respect to the plurality of pins at different height along an image acquiring direction by an image acquiring device, separately detecting image positions corresponding to the plurality of pins in the plurality of serial images, determining whether the electronic component is qualified according to a distance between the image positions of two adjacent pins, and if the electronic component is qualified, inserting the electronic component to a circuit board according to a position relationship between the image positions of the pins and a geometric center position of the pick and place device.

Abstract: The present invention relates to a setup method for deciding component feeding apparatuses to be attached to each of mounting machines in a component mounting system. The setup method includes a first step of deciding component feeding apparatuses to be attached to each of the mounting machines based on substrate data defining components to be mounted by each of the mounting machines; a second step of determining whether or not there is within the components included in the substrate data a sole mounted component to be mounted by only one mounting machine among the multiple mounting machines; and a third step of deciding, when the determination is made that the sole mounted component exists, to attach component feeding apparatuses feeding the sole mounted component or an alternative component capable of replacing the sole mounted component onto at least one mounting machine other than the only one mounting machine.

Abstract: A vacuum thermally bonding apparatus is provided, in which while air is being prevented in vacuum from entering a bonding layer, an element is thermally bonded to a substrate under vacuum by forming the bonding layer having a good thickness under an appropriate pressing pressure, while suppressing runout of the adhesive as much as possible, with a pressing force being slightly adjustable. A lower end portion of an upper frame member is gas-tightly slidably sealed to a peripheral portion of the lower plate member to form a vacuum partition wall therein, and a pressurizing release film is contacted with an upper face of the element, and thermally softened in the atmospheric pressure.

Abstract: A structure for wireless communication having a plurality of insulator layers, a conductor layer separating each of the insulator layers, and at least one connector connecting two conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.

Abstract: The invention provides a method for manufacturing an oxygen sensor that is excellent in responsiveness and can be preferably used for diagnosis of catalyst deterioration. An oxygen sensor 1 equipped with an oxygen sensor element 11 comprising a solid electrolyte 21 and Pt coatings, as a pair of electrodes, on both surfaces of the solid electrolyte 21 is manufactured. The method comprises at least steps of: providing a Pt coating 23 on at least one of the solid electrolyte 21 surfaces exposed to the gas to be tested so as to form closed pores 23a inside the Pt coating 23; and heating either the Pt coating 23 or 24 exposed to gas to be tested in a gas atmosphere with higher oxygen concentration than that of the atmospheric gas.