Abstract: A row bar for forming magnetic heads includes a row of magnetic head forming portions each having a magnetic head and a cutting portion adjacent to the magnetic heads. A row of bonding pads and a first ELG pad are provided at the magnetic head, a second ELG pad is provided at the cutting portion, both of the first and the second ELG pads are adapted for contacting with a probe during lapping process, and a conductive structure that is higher than surfaces of the first and the second ELG pads is formed at peripheries of the first and the second ELG pads respectively. Due to the conductive structures, a probe used in lapping process will be prevented from shifting from the ELG pads to ensure a stable contact, thereby obtaining efficient and accurate resistance measurement.

Abstract: A flush ring spacer, and method for using it, to adjustably support and firmly mount an electrical device, such as an electrical receptacle or switch, within a wall or other support surface. Using the present invention, electrical devices may be connected to 1900 (4-square), gem or other electrical boxes, while remaining firmly flush to the wall or other surface. The electrical device will stay grounded and not move or push in (which can affect grounding), and the face plate will not crack and will no longer be used to support the electrical device.

Abstract: A slot flaring apparatus is presented herein. The slot flaring apparatus includes a base and flaring tool. The base is configured to receive and secure a stator that has a plurality of core slots. The flaring tool is configured to be controllably pressed against the stator and has a plurality of flaring teeth. Moreover, each tooth of the plurality of flaring teeth is configured to insert into and form a respective slot liner which has been inserted into the corresponding core slot.

Abstract: A tactile sensor includes a pressure transducer encapsulated in an elastic material that defines a contact surface and provides a transmission path that transmits contact forces or pressure distributions applied to the contact surface to the pressure transducer. The pressure transducer can be enclosed in a protective housing that defines a chamber around the transducer. The housing can include one or more openings that expose the chamber to the exterior pressure. The tactile sensor can be made by applying the elastic material in liquid form and exposing the housing to a vacuum that removes air inside the chamber allowing the liquid elastic material to flow into the chamber. Once cured, the elastic material defines a contact surface of the tactile sensor and serves to transfer contact forces applied to the contact surface to the transducer.

Abstract: A wiring board manufacturing method includes forming a conductor pattern within a waste board section of a wiring board including a product section and the waste board section, the conductor pattern in which a plurality of polygonal lands made of a conductor are arranged along a first direction and a second direction crossing the first direction, each of the plurality of polygonal lands making contact with an adjacent one of the plurality of polygonal lands at each apex of the plurality of polygonal lands; and selectively removing the conductor at the apex of at least part of the plurality of polygonal lands.

Abstract: In a component mounting system, recovery processing is repeated until a recovery count number Nr is larger than or equal to a defined count number Nth in a case where a pickup defect of a component occurs, an elapsed time is measured from error stoppage of a component mounting machine to canceling of the error stoppage in which the component mounting machine is error-stopped when the recovery count number Nr is larger than or equal to the defined count number Nth, the defined count number Nth is increased within a range in which the defined count number does not exceed the upper limit value Nmax in a case where the elapsed time is shorter than a defined time Tth, and the defined count number Nth returns to an initial value in a case where the elapsed time is longer than or equal to the defined time Tth.

Abstract: 1.

Abstract: Populating printed circuit boards with components on a pick-and-place variant set-up is provided. Each set-up includes a number of components, stocks of which are brought to setting-up tables on the pick-and-place line, and a set-up family is associated with each set-up, the family system, a fixed set-up and multiple printed circuit board types which can be populated using the set-up. The fixed set-up is optimized with respect to a weighted parameter, before determining, by means of a simulation, how well variant set-ups, with which the remaining components of predefined pick-and-place orders are associated, can be implemented on the setting-up tables and brought to the pick-and-place line. The quality of each different weighting is determined in order to determine an optimized weighting.

Abstract: A magnetic core is assembled from a plurality of electrical-steel laminations staked together by respective plug and socket portions of respective adjacent interlocks at locations that experience relatively-low magnetic flux density rate. An electrically-insulating-coating is placed on abutting lamination surfaces either before or after blanking the laminations, or after partially piercing the interlocks, prior to stacking and pressing the laminations together to form the magnetic core. The magnetic core is annealed in a non-oxidizing environment at a first temperature for a first period of time, and then cooled to a second temperature at a controlled rate of cooling. The first temperature is sufficiently high to prospectively cause fusion between adjacent laminations if not protected by the electrically-insulating-coating.

Abstract: A maintenance fixture for PCB?A and an operating method thereof are disclosed to mitigate the problems that the PCB?A may be scrapped upon removing a conductive adhesive. The maintenance fixture includes a cover plate and a support baseplate which is configured to support a PCB?A and provided with a stopper unit; the cover plate is movably connected to the support baseplate at a first end to be rotatable towards and away from the support baseplate, and is provided with a barrier layer at a first side which is perpendicular to the rotation direction and close to the support baseplate; the barrier layer is configured to be contacted with the PCB?A upon the cover plate being rotated towards the support baseplate to cover an electronic component zone and expose an electrode zone of the PCB?A.

Abstract: A method of extending the usable length of a power-over-ethernet cable includes the steps of providing twisted pairs of wires with the conductor of each wire being a 20 AWG or 22 AWG conductor and terminating the cable at an RJ-45 style connector. The connector for the 20 AWG conductors has an insert therein with holes that can accommodate 20 AWG conductors. FEP, PVC or PP insulation may surround each conductor.

Abstract: A method of fabricating an RF filter comprising an array of resonators, the method comprising the steps of: (a) Obtaining a removable carrier with release layer; (b) Growing a piezoelectric film on a removable carrier; (c) Applying a first electrode to the piezoelectric film; (d) Obtaining a backing membrane on a cover, with or without prefabricated cavities between the backing film and cover; (e) Attaching the backing membrane to the first electrode; (f) Detaching the removable carrier; (g) Measuring and trimming the piezoelectric film as necessary; (h) Selectively etching away the piezoelectric layer to fabricate discrete resonator islands; (i) Etching down through coatings backing membrane, silicon dioxide and into silicon handle to form trenches; (j) Applying passivation layer into the trenches and around the piezoelectric islands; (k) Depositing a second electrode layer over the dielectric and piezoelectric film islands; (l) Applying connections for subsequent electrical coupling to an interposer; (m)

Abstract: A method of fabricating an RF filter comprising an array of resonators comprising the steps of: Obtaining a removable carrier with release layer; Growing a piezoelectric film on a removable carrier; Applying a first electrode to the piezoelectric film; Obtaining a backing membrane on a cover, with or without prefabricated cavities between the backing film and cover; Attaching the backing membrane to the first electrode; Detaching the removable carrier; Measuring and trimming the piezoelectric film as necessary; Selectively etching away the piezoelectric layer to fabricate discrete resonator islands; Etching down through coatings and backing membrane to a silicon dioxide layer between the backing membrane and the cover to form trenches; Applying a passivation layer into the trenches and around the piezoelectric islands; Depositing a second electrode layer over the piezoelectric film islands and surrounding passivation layer; Applying connections for subsequent electrical coupling to an interposer; Selective

Abstract: A terminating apparatus for terminating a plurality of wires of a cable to a plurality of connection terminations of a communication module, the communication module comprises at least one upright walls each provided with at least one receiving slots for receiving the connection terminations each of which is electrically connected with one wire. The terminating apparatus comprises: at least one terminating portion into which the upright walls of the communication module are able to be inserted, each terminating portion separately holding the plurality of wires of the cable; and at least one cutting apparatus mounted in the terminating portions outside the receiving slot of the communication module and constructed to cut off parts of the wires which extend out the receiving slots after the wires are terminated to the connection terminations of the communication module. The wires may be easily and quickly terminated to the communication module.

Abstract: A recirculating powder applicator includes an applicator body having an inlet on an upstream surface and an outlet on a downstream surface, wherein the inlet and outlet define a passage that extends transversely through the thickness of the applicator body, a powder conduit, an air inlet, an exhaust aperture located on one of the upstream or downstream surfaces, and a circulation chamber located on the interior of the applicator body. The powder conduit and air inlet are in fluid communication with the passage and the passage is in fluid communication with the circulation chamber. A method of applying powder to a substrate during a continuous process includes using a recirculating powder applicator.

Abstract: The process utilizes a shaft (2) supporting the stator (1) and/or the rotor, respectively, and capable of rotating around its axis, a first (3) and a second (3?) working station allocated on an opposite position on the sides of the stator and/or the rotor, respectively, next to the outlet area of the lateral mouth of a cavity. Said stations have carrying devices (4, 4?) for the leading wire (f), clamps (5, 5?) capable of grasping and moving the tip of the wire (f), and sensors (6, 6?) for detecting the arrival of the extremity of the wire (f).

Abstract: A manufacturing method of a circuit board and a stamp are provided. The method includes: forming a circuit pattern and a dielectric layer on a dielectric substrate; forming a conductive via in the dielectric layer; forming a thermal-sensitive adhesive layer on the dielectric layer; forming a photoresist material layer on the thermal-sensitive adhesive layer; imprinting the photoresist material layer using a stamp, wherein a first conductive layer is disposed on the surface of the pressing side of the stamp, a second conductive layer is disposed on the surface of the other portions; applying a current to the stamp; removing the stamp and the photoresist material layer and the thermal-sensitive adhesive layer below the pressing side to form a patterned photoresist layer and thermal-sensitive adhesive layer; forming a patterned metal layer on the region exposed by the patterned photoresist layer; removing the patterned photoresist layer and thermal-sensitive adhesive layer.

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract: A crimping tool, for attaching at least one wire to a connector, includes a housing, a first handle coupled to the housing, and a second handle coupled to the housing and movable relative to the first handle. The crimping tool also includes a working head coupled to the housing opposite the first and second handles. The working head includes an upper wall, an end wall, and a gap defined between the upper wall and the end wall. The crimping tool also includes a punch assembly slidable along the working head toward the end wall in response to movement of the second handle toward the first handle. The punch assembly is visible through the gap as the punch assembly slides toward the end wall.

Abstract: The terminal connection strip includes: a carrier formed in a strip shape; and a plurality of terminal fitting which project from at least one edge side of the carrier in a width direction. The terminal fitting includes a crimping section which connects by crimping at least a conductor tip of an insulated wire provided with the conductor tip where a conductor is covered with an insulating cover and the conductor is exposed by peeling off the insulating cover on a distal end side of the insulated wire to the terminal fitting. The crimping section is formed into a hollow shape which allows the insertion of at least the conductor tip from a proximal end side of the crimping section and allows the crimping section to surround the conductor tip.