Patents Examined by Carl J. Arbes
  • Patent number: 10817060
    Abstract: A method of manufacturing a control device comprising an actuator for generating a haptic feedback. The method includes providing at least two flat anchors each of which comprises a connecting element for connection to a support component. The connecting element is arranged differently on each of the flat anchors. An actuator solenoid and the support component are mounted within the control device. A distance between the actuator solenoid and a predetermined point on the support component is determined to obtain a determined distance. One flat anchor is selected from the flat anchors based on an actual distance to the actuator solenoid when the one flat anchor is connected to the support component corresponding to a specific requirement, the actual distance being determined based on the determined distance. The one flat anchor selected is mounted within the control device.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: October 27, 2020
    Assignee: PREH GMBH
    Inventors: Ottmar Gleissner, Frank Then
  • Patent number: 10811348
    Abstract: A method of manufacturing a wiring substrate includes providing a support that includes a support substrate and first and second metal layers stacked in order over the support substrate. A surface of the second metal layer facing away from the first metal layer is a roughened surface or formed of particles. The second metal layer is selectively etchable with respect to the first metal layer. The method further includes selectively forming a third metal layer on the surface of the second metal layer, forming a first wiring layer that is a laminate of the second and third metal layers by simultaneously roughening the third metal layer and dissolving the second metal layer not covered with the third metal layer using an etchant, forming an insulating layer that covers the first wiring layer on the first metal layer, removing the support substrate, and removing the first metal layer by etching.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: October 20, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kazuhiro Kobayashi, Yusuke Karasawa
  • Patent number: 10811833
    Abstract: A system for assisting in the assembly of a cable harness may include a wire insertion apparatus that includes a frame that defines a connector mounting location; a projector mount attached to the frame and positioned so that a projector held in the projector mount projects graphical information onto a connector held by the mounting location; and the projector. The system may also include a computer device in communication with the projector and comprising a module configured for: projecting, via the projector, a plurality of alignment dots onto the connector; moving the alignment dots based on a first user input; receiving a second user input that the alignment dots are aligned and, based on the second user input, determining a position and orientation of the connector; and illuminating, via the projector, one or more pin locations of the connector based on the position and orientation of the connector.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: October 20, 2020
    Assignee: The Boeing Company
    Inventors: James R. Crocco, Stephen Doyle, Frederick C. Edman, Jason Gerald DeStories
  • Patent number: 10811652
    Abstract: To carry out accurate defect inspection over a wide area, a defect inspection device (1) includes: a radiation source section (2) configured to emit an electromagnetic wave (4) to a separator roll (10); and a sensor section (3) configured to detect the electromagnetic wave (4) that the radiation source section (2) has emitted to the separator roll (10), the sensor section (3) being configured to detect the electromagnetic wave (4) before and after the separator roll is moved relative to the radiation source section (2).
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: October 20, 2020
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Yoshitaka Shinomiya, Koji Kashu, Yasuyuki Kondo
  • Patent number: 10804126
    Abstract: A method for manufacturing a circuit board includes forming recess structures on a transferring layer; forming a dielectric layer on the transferring layer to form a stacking structure, in which the dielectric layer is at least embedded with the recess structures; bonding the stacking structure a base board by pressing, such that the dielectric layer is in contact with the base board; patterning the dielectric layer, including performing an exposure process on the stacking structure through the transferring layer; and after the exposure process is finished, removing the transferring layer.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: October 13, 2020
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventor: Po-Hsuan Liao
  • Patent number: 10804668
    Abstract: The present invention relates to a device (1) for assembling at least one plug housing (200) with prepared cable ends (111, 121) of a cable harness (100), in particular a twisted harness comprised of at least two cables (110, 120), wherein the device (1) has at least two cable grips (10, 20) each for gripping one of the at least two cables (110, 120) on a segment (112, 122) of a free cable end (111, 121), in particular untwisted. For selective assembly, in particular for insertion of the cable ends (111, 121) with a longitudinal offset into the plug housing (200) through a segment along the path of travel, which is potentially critical for a successful assembly process, the at least two cable grips (10, 20) are displaceable independently of one another in the longitudinal direction (L) of the cable ends (111, 121) to be gripped.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: October 13, 2020
    Assignee: Komax Holding AG
    Inventors: Thomas Bussmann, Beat Estermann
  • Patent number: 10798817
    Abstract: Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Javier Soto Gonzalez, Meizi Jiao, Shruti R. Jaywant, Oscar Ojeda, Sashi S. Kandanur, Srinivas Venkata Ramanuja Pietambaram, Roy Dittler, Rajat Goyal, Dilan Seneviratne
  • Patent number: 10794960
    Abstract: Disclosed is a technique for effectively detecting a low voltage defect that may occur at a secondary battery. A method for detecting a low voltage defect of a secondary battery includes an assembling step of assembling a secondary battery by accommodating an electrode assembly, in which a positive electrode plate and a negative electrode plate are stacked with a separator being interposed therebetween, and an electrolytic solution in a battery case; a primary aging step of aging the assembled secondary battery at a temperature of 20° C. to 40° C.; a primary formation step of charging the aged secondary battery at a C-rate of 0.1 C to 0.5 C; a high-rate charging step of charging the secondary battery at a C-rate of 2 C or above, after the primary formation step; and a detecting step of detecting a defect of the secondary battery, after the high-rate charging step.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: October 6, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Sung-Tae Kim, Joon-Sung Bae, Nak-Gi Sung
  • Patent number: 10796821
    Abstract: A method for manufacturing a high conductive Al alloy wire without conducting an annealing process includes: providing an Al alloy rod comprising 0.01 parts by weight to 0.08 parts by weight of Fe, Fe:Si=2 to 3:1 of Si and the balance Al and inevitable impurities, based on 100 parts by weight of an entire A1350 alloy; conform-extruding the Al alloy rod by passing through a dies of a conform extruder having a polygonal shaped structure to form a polygonal shaped Al alloy wire; cooling the extruded Al alloy wire to room temperature; and winding the cooled Al alloy wire using a winder.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 6, 2020
    Inventor: Mi-Song Ku
  • Patent number: 10798857
    Abstract: In a filter holding structure for holding a filter in a component suction head in which a suction nozzle is detachably attached to a tip part of a nozzle shaft, a filter holding space for holding the filter and an opening allowing communication between the filter holding space and the suction nozzle are provided in a tip part of the nozzle shaft. Also, a communication region of the filter holding space connected to the opening is made narrower than an end surface of the filter on the suction nozzle side and is held in the tip part of the nozzle shaft.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: October 6, 2020
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Yukinari Awano
  • Patent number: 10797458
    Abstract: A method is provided for producing a plug, having a plastic injection-molded encapsulation, for a fuel pump which arranged in a fuel tank of a motor vehicle. The plug has cables, stranded wires and a ground contact each protruding out of the encapsulation and each connected to encapsulated components. The plug elements and coils are inserted into a base plate. One core of a cable is soldered, welded or crimped to flat plug elements. The coils and stranded wires are each soldered, welded or crimped to a flat plug element. The base plate is inserted into a cavity of an injection mold, such that the cables and the stranded wires protrude out of the cavity through first passage openings and second passage openings, respectively, and cores are arranged in continuous openings of identical cross section in the wall of the injection mold. The cavity is then filled with a plastic.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: October 6, 2020
    Assignee: Vitesco Technologies GmbH
    Inventors: Gabriel Simara Lima, Otto Korst, Ralf Muehlhausen
  • Patent number: 10790645
    Abstract: A tool facilitates removal of a splice used to serially connect lengths of cable into an electrical power line. The tool has an elongated slide of semi-circular cross-section with outer and inner diameters suited to saddle the cable and snugly enter into an open end of the splice and into abutment against a spring-biased split-ring vise grip in the splice. With the leading end of the tool butted against the spring-biased vise grip, application of manual force to a handle on the trailing end of the tool drives the vise grip to compress its biasing spring, expanding the vise-grip and releasing the cable for removal from the vise grip and the splice without damaging the splice or cutting the cables connected to the splice.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: September 29, 2020
    Inventor: Andrew Scott Long
  • Patent number: 10784663
    Abstract: An apparatus for removing an inner sheathing of electrical conductors of a preferably multi-core cable comprises at least one holding arrangement/clamping device for axial and rotational clamping of the cable and a cutter assembly (1, 21) that can be rotated about the cable longitudinal axis, to the cutters of which a force can be applied in the direction of the cable axis. The at least one cutter (24, 26) comprises a contact surface (26) provided for placing on the surface of the inner sheathing and directly adjacent thereto a cutting edge (24), which protrudes beyond this contact surface (26).
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: September 22, 2020
    Assignee: SCHLEUNIGER AG
    Inventors: Carmelo Messina, Jörg Furrer, Klemens Imholz, Roman Widmer
  • Patent number: 10785586
    Abstract: The present invention relates to the technical field of electroacoustic products, and discloses sound-absorbing material, sound-absorbing particle, speaker module manufacturing processes, a particle and a module. The process comprises the following steps: placing a raw powder of a porous sound-absorbing material into a heating furnace to perform calcination, and introducing a processing gas during the calcination, wherein the calcination temperature is 120° C. to 800° C., and the calcination time is 6 h to 72 h.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: September 22, 2020
    Assignee: GOERTEK INC.
    Inventors: Jinli Liu, Xiaodong Cao
  • Patent number: 10773053
    Abstract: A method of manufacturing a flexible catheter with a locatable sensor includes simultaneously rotating first and second spools about a common axis, whereby first and second leads of a wire twist together to form a twisted pair of the wire, and rotating a catheter body about a longitudinal axis defined by the catheter body, whereby the twisted pair of the wire wraps about a proximal end portion of the catheter body.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: September 15, 2020
    Assignee: COVIDIEN LP
    Inventors: Daniel A. Ranum, Brian T. Stolz, Nathan J. Knutson, David M. Costello
  • Patent number: 10774434
    Abstract: The present invention relates to nonferrous metallurgy, in particular to the process equipment for electrolytic production of primary aluminum, namely to methods for lining cathode assemblies of reduction cells. The method for lining a cathode assembly of a reduction cell for production of aluminum comprises filling a cathode assembly shell with a thermal insulation layer, forming a fire-resistant layer followed by the compaction of layers, installing bottom and side blocks followed by sealing joints therebetween with a cold ramming paste. According to the first embodiment of the present invention, a resilient element made of a dense organic substance is placed between the thermal insulation layer and the fire-resistant layer. According to the second embodiment of the present invention, a flexible graphite foil is placed between the thermal insulation layer and the fire-resistant layer, and under the flexible graphite foil, a resilient element made of a dense organic substance is placed.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: September 15, 2020
    Assignee: United Company Rusal Engineering and Technology Centre LLC
    Inventors: Aleksandr Vladimirovich Proshkin, Vitalij Valer'evich Pingin, Samuil Yakovlevich Levenson, Andrej Gennad'evich Sbitnev, Aleksej Vasil'evich Morozov, Aleksej Sergeevich Zherdev
  • Patent number: 10773949
    Abstract: A method of manufacturing an electronic device includes providing a component carrier having a laminate of at least one electrically conductive layer structure and at least one electrically insulating layer structure, providing a mounting base for mounting an electronic component on and/or in the component carrier, and integrally forming a wall structure with the component carrier prior to mounting an electronic component on the mounting base, the integrally formed wall structure at least partially surrounding the mounting base for mounting the electronic component on the mounting base and protected by the wall structure.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: September 15, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Heinz Moitzi
  • Patent number: 10777457
    Abstract: A method of manufacturing, a carrier, and a semiconductor package are provided. The method involves depositing a plurality of conductive vias, applying a molding material over the lead frame, grinding the molding material to expose the plurality of conductive vias, and depositing a metalized pattern over the molding material. The carrier is manufacture by this method and the semiconductor package is formed based on the carrier.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: September 15, 2020
    Assignee: UBOTIC COMPANY LIMITED
    Inventor: Ming-Wa Tam
  • Patent number: 10775000
    Abstract: An automatic process of making a LED bulb comprising: automatic manufacturing of a glass core column with a driving chip and a resistor, automatic welding of an LED wick, automatic sealing and venting of a lamp cover and the wick and gas protection, automatic installation of a lamp holder, and automatic optical inspection and packaging. With the automatic process, which is a substitution for the manual production having a high cost labor and which reduces the uncertainty of the quality, continuous all-day production without interruptions is achieved, and the production efficiency and quality are improved.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: September 15, 2020
    Assignee: Dongguan Miray E-Tech Co., Ltd.
    Inventor: Jianwen Lei
  • Patent number: 10773051
    Abstract: A method of manufacturing a flexible catheter with a locatable sensor includes non-rotatably coupling a spool with a wire to a first portion of a spool carrier, non-rotatably coupling the spool carrier to a catheter body, and rotating the spool carrier with the catheter body, thereby wrapping a portion of the wire about a distal end portion of the catheter body to form a wrapping layer.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: September 15, 2020
    Assignee: COVIDIEN LP
    Inventors: Daniel A. Ranum, Brian T. Stolz, Nathan J. Knutson