Patents Examined by Carl J. Arbes
  • Patent number: 10418155
    Abstract: Twisting device for electrical conductors has at least one twisting head that rotates about an axis of rotation and a clamping device. The twisting head is movable in the direction of its axis of rotation toward the clamping device and is mounted on a first, motorized length compensation carriage, while the clamping device is mounted on a travel compensation carriage that is movable towards the length compensation carriage parallel to the axis of rotation of the twisting head. After the conductors have been cut to size and transferred to the twisting head and the clamping device, they are placed under tension. Then, the twisting head is activated to rotate about an axis of rotation parallel to the conductors while simultaneously moving towards the clamping device. Simultaneously, the clamping device is subjected to a force directed away from the twisting head and the travel/force profile for the clamping device is evaluated.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: September 17, 2019
    Assignee: SCHLEUNIGER HOLDING AG
    Inventors: Uwe Keil, Roland Kampmann
  • Patent number: 10412840
    Abstract: Systems and methods are provided to produce electromechanical interconnections within integrated circuits (ICs), printed circuit boards (PCBs) and between PCBs and other electronic components such as resistors, capacitors and integrated circuits. Elements include so-called “smart pins” or “neuro-pins” that facilitate electrical pathways in the dimension normal to the plane of a PCB. Smart pins or neuro-pins may be inserted using automated processes that do not require the high temperatures normally associated with soldering. Resultant circuits generally contain a large number of layers that are more compact and more readily constructed compared with conventional PCB-based circuitry.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: September 10, 2019
    Assignee: DOTSLAM, INC.
    Inventors: Lewis James Marggraff, Nelson G. Publicover, Blake Marggraff, Edward D. Krent, Marc M. Thomas
  • Patent number: 10404028
    Abstract: An automatic-robotic-system-for-cable assembly system and method is provided. The method and system are configured to use a cartridge which holds one or both ends of the cable. The cartridge moves along an automatic cable assembly line, with the line segmented into different stages, at which a process is performed by a specific machine. Different machines, such as actuators or modular machines, perform operations on the cartridge at the different stages. In preparation for or as part of the operations, the actuators or modular machines may apply one or more forces to the cartridge, causing one or more of the following to occur: moving an end of the cartridge to a modular machine, rotating an end of the cable, tipping the ends of the cable, etc. In this way, use of the cartridge enables the automatic assembly of the cables held in the cartridge.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: September 3, 2019
    Assignee: Frisimos, Ltd.
    Inventors: Tal Pechter, Hanan Ben Ron
  • Patent number: 10395800
    Abstract: Embodiments are directed to a method for manufacturing a product comprising: establishing, by a computing device comprising a processor, at least one parameter of a particular instance of a component to be used in the product, adapting, by the computing device, a baseline model of the component based on the at least one parameter to accommodate use of the particular instance of the component, growing a structure based on the adapted model to accommodate the particular instance of the component using an additive manufacturing technique, coupling the structure to the particular instance of the component, growing an electrical harness by using additive printing to establish an electrical cable, and assembling the product by coupling the electrical harness to the particular instance of the component.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: August 27, 2019
    Assignee: RAYTHEON COMPANY
    Inventor: Rigel Q. Woida-O'Brien
  • Patent number: 10396639
    Abstract: A method for manufacturing a coil of an electrical machine includes providing a laminated core having a first and a second slot, and inserting a first winding segment in the first slot to a first region having a first end portion and a second winding segment in the second slot to a second area having a second end portion. The method includes adhering the first end portion by inserting in a first recess a bending device and by positioning of a retaining element into a locking position in the first recess, and holding the second end portion by inserting in a second recess of the bender. The method includes bending the first and the second range in a bending direction to a first bending angle. The method also includes releasing the first end portion, and turning the second region in the bending direction to a second bending angle.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: August 27, 2019
    Assignee: CPT Group GmbH
    Inventors: Christoph Radtke, Mario Weseler, Tassilo Gellermann
  • Patent number: 10389326
    Abstract: Methods and apparatus for reducing electric loss in an elastic wave element. In one example such a method includes forming an IDT electrode on a piezoelectric body, and forming the connection wiring on the piezoelectric body and electrically connecting the connection wiring to the IDT electrode. Forming the connection wiring includes sequentially forming a lower connection wiring on an upper surface of the piezoelectric body and forming an upper connection wiring over the lower connection wiring. The method further includes forming a reinforcement electrode over the connection wiring that divides the upper connection wiring into first and second upper connection wirings electrically connected to one another by the reinforcement electrode. The reinforcement electrode is formed abutting an upper surface of the lower connection wiring between the first and second upper connection wirings and electrically connected to the lower connection wiring and to the first and second upper connection wirings.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: August 20, 2019
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Yosuke Hamaoka, Mitsunori Miyanari, Hiroyuki Nakamura, Hidekazu Nakanishi
  • Patent number: 10383235
    Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: August 13, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jung-Je Bang, Mi-Jin Kim, Sae-Bom Lee, Hyun-Joo Han, Kun-Tak Kim
  • Patent number: 10374570
    Abstract: A method of manufacturing an acoustic wave element includes simultaneously forming a plurality of electrodes on a piezoelectric substrate, the plurality of electrodes including first and second IDT electrodes and a connection electrode, forming an insulation over the plurality of electrodes and the piezoelectric substrate, the insulation having a first thickness in a direction perpendicular to the surface of the piezoelectric substrate over the second IDT electrode, processing a first portion of the insulation over the first IDT electrode and a second portion of the insulation over the connection electrode to reduce a thickness of the first and second portions of the insulation to a second thickness, and processing a third portion of the insulation over the surface of the second IDT electrode to reduce the first thickness of the third portion to a third thickness, the third thickness being greater than the second thickness.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: August 6, 2019
    Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
    Inventors: Tomohiro Iwasaki, Hiroyuki Nakamura
  • Patent number: 10369730
    Abstract: Portable electronic device capable of processing information, said portable electronic device including a body arranged to be capable of being secured to the user, and at least one electronic assembly for processing information, the body of the portable electronic device being formed by a layer of plastic material which gives the portable electronic device a shape and thickness, characterized in that the portable electronic device includes a first impermeable plastic film which serves as a coating for the layer of plastic material, and a second impermeable plastic film secured to the periphery of the first impermeable plastic film, and in that the electronic assembly for processing information is arranged between the first and second impermeable plastic films. The invention also concerns a method of manufacturing a portable electronic device.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: August 6, 2019
    Assignee: The Swatch Group Research and Development Ltd.
    Inventors: Pascal Heck, Cedric Nicolas
  • Patent number: 10374399
    Abstract: A tool facilitates removal of a splice used to serially connect lengths of cable into an electrical power line. The tool has an elongated slide of semi-circular cross-section with outer and inner diameters suited to saddle the cable and snugly enter into an open end of the splice and into abutment against a spring-biased split-ring vise grip in the splice. With the leading end of the tool butted against the spring-biased vise grip, application of manual force to a handle on the trailing end of the tool drives the vise grip to compress its biasing spring, expanding the vise-grip and releasing the cable for removal from the vise grip and the splice without damaging the splice or cutting the cables connected to the splice.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: August 6, 2019
    Inventor: Andrew Scott Long
  • Patent number: 10368448
    Abstract: A method of manufacturing a component carrier, wherein the method comprises mounting a known-good component on or spaced with regard to a first known-good component carrier block, thereafter forming an electrically conductive connection structure on and/or in and/or spaced with regard to the first component carrier block, and embedding the component between the first component carrier block and a second known-good component carrier block.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: July 30, 2019
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Marco Gavagnin, Gernot Grober, Christian Vockenberger
  • Patent number: 10361611
    Abstract: A coil end bending jig pushes down a plurality of coil ends of coil segments held by a toric stator core, the plurality of coil ends being arranged on a same circumference. The coil end bending jig includes a plurality of bending units each having a bending tooth that makes contact with a corresponding one of the coil ends, and a guide member having a plurality of guiding slits into which the plurality of bending units is inserted, respectively. The plurality of guiding slits extends from an inner peripheral side of the stator core to an outer peripheral side of the stator core so as not to intersect with each other when viewed from an axial direction of the stator core.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: July 23, 2019
    Assignee: TOYOTA JIDOSHA KABUSIKI KAISHA
    Inventor: Yasuyuki Hirao
  • Patent number: 10356914
    Abstract: A method of lamination of dielectric circuit materials is provided. The method includes preparing first and second circuit layers of dielectric materials, stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: July 16, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Patrick J. Kocurek, Sankerlingam Rajendran
  • Patent number: 10356924
    Abstract: A container may be provided. The container may comprise a first surface and a second surface concentric with the first surface. The first surface and the second surface may define a volume. The volume may house a concentric length of multiple parallel conductors. The multiple parallel conductors may pass through a restricting mechanism to restrict the multiple parallel conductors to pass at the same rate and at the same length.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: July 16, 2019
    Assignee: Southwire Company, LLC
    Inventors: Willie Franklin Fowler, Jr., Jeremy Harris, Richard Mike Temblador, Juan Alberto Galindo Gonzalez
  • Patent number: 10356967
    Abstract: Described herein is an apparatus and method for manufacturing an image display. The apparatus provides an automated method for efficient production of a finished image display, beginning with a planar, unassembled, image display and resulting with a fully-assembled image display in its final form, such as a cube-shaped image display with a plurality of images affixed thereto. In one embodiment, the apparatus is machinery configured as a semi-automated workstation, configured with four jigs stationed on a rotating platform housed on a workstation base. The rotating platform is configured for 360 degree rotation and advancing each jig through one of four work positions. The rotating platform is controlled by a control panel, which can be operated manually or automated. In one embodiment, the machinery is capable of high through-put manufacturing—up to three hundred image display cubes in one hour of operation.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: July 16, 2019
    Assignee: Gallery Blocks LLC
    Inventors: Ryan J. Millman, Cheyne Smith
  • Patent number: 10355325
    Abstract: A method for reusing a vehicle rechargeable battery to rebuild an assembled battery from a plurality of battery units having a usage history is provided. The method includes measuring a remaining charge of each of a plurality of battery units obtained by dismantling an assembled battery having a usage history. The method further includes selecting from the battery units a battery unit in which the measured remaining charge is greater than or equal to a remaining charge lower limit value, which is set in a range that is greater than zero and less than a lower limit value of a remaining charge control range of a vehicle in which the assembled battery was installed, and assembling a new assembled battery using the selected battery unit.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: July 16, 2019
    Assignees: PRIMEARTH EV ENERGY CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Daisuke Koba, Shinichiro Ito, Yasushi Nakagiri, Tamotsu Fukuma, Kouichi Ichikawa, Yasuhiro Takahashi, Masahiko Mitsui
  • Patent number: 10356969
    Abstract: A recognition mark which is formed on a tape retaining cover which retains a carrier tape, which holds components in pockets, in relation to a sprocket with which the tape feeder is provided, and the component or the pocket which is positioned at a suction position through an opening which is formed in the tape retaining cover are recognized. Based on recognition results, tape feed positional correction for positioning the suction target component at the suction position is performed such that the component, which is adjacent on an upstream side in a tape feed direction to the component which is positioned at the suction position, is not exposed by greater than or equal to a predetermined amount from the opening.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: July 16, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Koji Watanabe, Hiroyuki Fujiwara, Shinji Yamamoto
  • Patent number: 10355567
    Abstract: A joining method for coil ends includes: pressing a pair of tapered portions such that a pair of first pressing jigs provided with a pair of detent portions is brought closer to the coil ends along an axial direction of the stator core, the pair of detent portions being fitted to the tapered portions; fixing axial positions of the pair of tapered portions such that the pair of detent portions is fitted to the pair of tapered portions so that the pair of tapered portions is sandwiched in a circumferential direction; fixing radial positions of the pair of tapered portions such that the pair of tapered portions is sandwiched by a pair of second pressing jigs so that the tapered portions of the pair of tapered portions make contact with each other; and welding a contacting portion where the tapered portions make contact with each other.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: July 16, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Daisuke Mizushima, Yasuyuki Hirao
  • Patent number: 10349532
    Abstract: A method and structure are provided for implementing stub-less printed circuit board (PCB) vias and custom interconnect through laser-excitation conductive track structures. Stub-less printed PCB vias are formed which terminate at desired signal layers by controlled laser excitation without stubs or the need to back-drill to remove such stubs.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: July 9, 2019
    Assignee: International Business Machines Corporation
    Inventors: Layne A. Berge, John R. Dangler, Matthew S. Doyle, Joseph Kuczynski, Thomas W. Liang, Manuel Orozco
  • Patent number: 10340173
    Abstract: Systems and methods for releasing semiconductor devices during pick and place operations are disclosed. A representative system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a release station having a fluid delivery device coupleable to a source of release fluid, the fluid delivery device having an exit positioned to direct release fluid toward a semiconductor die carried by the support member at the release station.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: July 2, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Andy E. Hooper