Patents Examined by Carlos Gamino
  • Patent number: 10107002
    Abstract: Embodiments of an automatic girth fitter system use a device or devices to automate the alignment of horizontal weld seams in both shop- and field-built tanks or vessels. The automated system device or devices may also be used to remove shims that are used to gap the horizontal weld seams and provide plate alignment prior to fitting or welding those seams.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: October 23, 2018
    Assignee: NewCon, LLC
    Inventor: John Newmeister
  • Patent number: 9884384
    Abstract: A solder dross recovery module has gears and a waste collection chamber positioned within a solder pot. The gears are configured to draw in solder dross from a surface of molten solder stored in the solder pot. The gears apply pressure to the solder dross so as to separate solder from the solder dross. The recovered solder is returned to the molten solder in the solder pot. A resulting waste material is collected in the waste collection chamber.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: February 6, 2018
    Assignee: Flextronics AP, LLC
    Inventors: Dason Cheung, Murad Kurwa
  • Patent number: 9873171
    Abstract: A method for holding a sintering filler material during a brazing/sintering operation for repairing a damaged area of a component wherein the component is in either a bonding face down position, bonding face vertical position or bonding face up position. The method includes providing a wire mesh and attaching the wire mesh to the component in a location corresponding to the damaged area. Further, the method includes forming a gap between the wire mesh and the component. Moreover, the sintering filler material may be inside the wire mesh or both inside and outside the wire mesh in order to secure the sintering filler material to the damaged area.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: January 23, 2018
    Assignee: Siemens Energy, Inc.
    Inventors: Hang Li, Mark A. Garcia, Somesh J. Ghunakikar, William J. Lowe
  • Patent number: 9875985
    Abstract: A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: January 23, 2018
    Assignee: International Business Machines Corporation
    Inventors: Jae-woong Nah, Sébastien S. Quesnel, Katsuyuki Sakuma
  • Patent number: 9865563
    Abstract: A wire tensioner has a wire passage through which a wire is inserted. The wire passage include: an inlet through which a compressed gas enters; a first outlet through which the compressed gas is discharged and is provided on an upper side of the inlet; a first flow contraction portion provided on the upper side of the inlet, and for contracting an area of the wire passage; a second flow contraction portion provided on a lower side of the inlet, and for contracting the area of the wire passage; a third flow contraction portion provided on a side of a bonding tool of the second flow contraction portion, and for making the flow of the compressed gas to the side of the bonding tool contracted; and a second outlet through which the compressed gas is discharged and is provided on the lower side of the second flow contraction portion.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: January 9, 2018
    Assignee: SHINKAWA LTD.
    Inventor: Yoshitaka Takagi
  • Patent number: 9855623
    Abstract: A method for connecting a tubular cable lug produced from a non-ferrous metal to a strand produced from aluminum, includes steps of providing a tubular cable lug having a tubular portion and a connecting portion, providing an ultrasonic welding device having a sonotrode that has a pressure surface and having an anvil that has a mating pressure surface, securing the connecting portion to the anvil by clamping such that the tubular portion faces the mating pressure surface of the anvil, inserting one end of the strand into the tubular portion of the tubular cable lug, bringing the pressure surface into contact with the tubular portion, pressing the pressure surface against the tubular portion such that the tubular portion is forced against the mating pressure surface, and generating an ultrasound vibration oriented approximately perpendicular to a tube axis of the tubular portion by means of the sonotrode.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: January 2, 2018
    Assignee: TELSONIC HOLDING AG
    Inventor: Claus Regenberg
  • Patent number: 9815134
    Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: November 14, 2017
    Assignee: MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATION
    Inventors: Kazutoshi Yokoo, Daisuke Tanaka, Daisuke Kawada, Koshiro Niihara, Hiroki Takagi, Yujiro Watanabe, Hiroshi Nakajima
  • Patent number: 9796583
    Abstract: Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: October 24, 2017
    Assignee: Microchips Biotech, Inc.
    Inventors: Jonathan R. Coppeta, Kurt Shelton, Norman F. Sheppard, Jr., Douglas Snell, Catherine M. B. Santini
  • Patent number: 9782858
    Abstract: A method for producing an assembly unit includes providing the assembly unit with an assembly part and at least one welding element serving for the thermal joining of the assembly part to a basic construction. The welding element is fixed in a through opening of the assembly part with at least one form-locking connection acting in the direction of the center longitudinal axis of the through opening and having a first end face, a second end face facing away from the first, and a peripheral surface that interconnects the end faces. The welding element has two side faces running parallel to each other and pointing away from each other, a profile that ensures the at least one form-locking connection and two transverse surfaces which connect the side faces one to the other.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: October 10, 2017
    Assignee: Richard Bergner Verbindungstechnik GmbH & Co. KG
    Inventors: Wilhelm Schneider, Juliane Niedermueller, Klaus Dehlke
  • Patent number: 9780055
    Abstract: A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment. The composition may include at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %.
    Type: Grant
    Filed: June 30, 2012
    Date of Patent: October 3, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yoshie Yamanaka, Ken Tachibana, Shunsaku Yoshikawa, Hikaru Nomura
  • Patent number: 9773750
    Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: September 26, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu, Hung-Fai Stephen Law
  • Patent number: 9718144
    Abstract: A large surface area ultrasonic block horn includes one or more shaped elements having a node at a mid-point of the shaped element that is narrower than opposed ends of the shaped element.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: August 1, 2017
    Assignee: Branson Ultrasonics Corporation
    Inventor: James F. Sheehan
  • Patent number: 9707640
    Abstract: A vibration dampening device for the manufacture by rotational friction welding of a turbomachine rotor including a first disc and a second disc each having a hub with an internal surface is provided. The device includes a first clamping device configured to be positioned coaxially to the hub of the first disc and having a pair of radially opposite jaws suited to come into contact with the internal surface of the hub of the first disc.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: July 18, 2017
    Assignee: SNECMA
    Inventor: Jean-Luc Bour
  • Patent number: 9694436
    Abstract: The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: July 4, 2017
    Assignee: VEECO PRECISION SURFACE PROCESSING LLC
    Inventors: William Gilbert Breingan, Lev Rapoport, John Clark, John Taddei, Laura Mauer
  • Patent number: 9682449
    Abstract: A structural element and method for repairing a damaged portion of a metal component utilizes a preform configured to engage with the metal component and receive a repair material. The preform may be made of a material having a first melting point, and the repair material may be made of a material having a second melting point that is lower than the first melting point. The preform may be a mold configured to reconstruct the shape of the damaged portion of the metal component. The repair material may include a first material and an additive material, such as boron. The repair material may have a melting point that is approximately 40 degrees Fahrenheit lower than the melting point of the metal component.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: June 20, 2017
    Assignee: United Technologies Corporation
    Inventors: Philip R. Belanger, Paul M. Lutjen, Richard K. Hayford
  • Patent number: 9675477
    Abstract: A welded stent and stent delivery system, with a stent including a first strut having a first strut nickel titanium alloy layer and nickel titanium soluble core, the first strut nickel titanium alloy layer being disposed around the first strut nickel titanium soluble core; and a second strut having a second strut nickel titanium alloy layer and nickel titanium soluble core, the second strut nickel titanium alloy layer being disposed around the second strut nickel titanium soluble core, the second strut nickel titanium alloy layer being connected to the first strut nickel titanium alloy layer with a weld. The first and second strut nickel titanium alloy layers are made of a nickel titanium alloy, the first and second strut nickel titanium soluble cores are made of a nickel titanium soluble material, and the weld is made of an alloy of the nickel titanium alloy and the nickel titanium soluble material.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: June 13, 2017
    Assignee: Medtronic Vascular, Inc.
    Inventor: Dustin Thompson
  • Patent number: 9666460
    Abstract: A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: May 30, 2017
    Assignee: Besi Switzerland AG
    Inventors: Guido Suter, Kevin Domancich, Daniel Andreas Scherer, Reto Weibel
  • Patent number: 9604319
    Abstract: In one aspect of the disclosure, an apparatus for manipulating a plurality of curved sheets is provided. Each of the plurality of curved sheets includes an upper surface and a lower surface. The apparatus includes tooling to be coupled to the upper surface of each of the plurality of curved sheets. The tooling is capable of moving the plurality of curved sheets relative to each other and abutting the plurality of curved sheets so that the upper surface of each of the plurality of curved sheets is coextensive with a virtual arcuate surface. The apparatus also includes a welding apparatus capable of welding the plurality of curved sheets together after abutting the plurality of curved sheets.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: March 28, 2017
    Assignee: THE BOEING COMPANY
    Inventor: Peter Z. Anast
  • Patent number: 9573222
    Abstract: A method for friction stir welding two components, with a rotating tool that comprises a rotating or non-rotating shoulder surface for subjecting the components to a process force in the region of a joining zone, and with a stirring pin for stirring plasticized material or for plasticizing and stirring the components in the region of the joining zone, in which method a stirring pin with a section slidably plunges in a slide on which the components are supported, which slide is guided along the joining zone on a side of the component, which side faces away from the tool, so that during welding an automatic relative movement between the stirring pin and the slide or the shoulder surface of the tool and a support surface of the slide, which support surface supports the components, is made possible, as well as a device for implementing such a method.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: February 21, 2017
    Assignee: Airbus Operations GmbH
    Inventors: Sergio Tavares, Marco Pacchione, Hartmut Ostersehlte
  • Patent number: 9573214
    Abstract: A method of applying solder includes providing a first roller and a second roller, where at least one of the first and second rollers has an outer surface comprising a solder wicking material. A metallic article is provided, the metallic article having a first side and a second side, and having an opening extending from the first side to the second side. The metallic article is dipped in solder, where the dipping forms an initial coating of solder on the metallic article. After the dipping, the metallic article is fed between the first and second rollers. The wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: February 21, 2017
    Assignee: Merlin Solar Technologies, Inc.
    Inventors: Alejandro de la Fuente Vornbrock, Venkateswaran Subbaraman