Abstract: A circuit board comprising a board body which includes an insulating substrate or a plurality of laminated insulating substrates. The circuit board includes a connection material for electrically connecting together circuit patterns that are formed on both surfaces of the board body and/or a connection material for electrically connecting together a circuit pattern formed on one surface of the board body and circuit patterns formed between the insulating substrates. The connection material is constituted by an electrically conducting substance filled in a through-hole formed in the board body, and at least one end surface of the electrically conducting substance is substantially flush with the circuit pattern formed on one surface of the board body.

Abstract: A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. The compositions of the present invention are useful as adhesives for interconnecting a semiconductor chip to a substrate.

Abstract: A metallic printed board is formed by laminating an insulation layer on the surface of a metallic sheet as a base, and then electronic parts are mounted on the conductor pattern formed on the surface of the insulation layer. A double-sided printed board mounted thereon electronic parts is placed in parallel. Both the printed boards are supported and fixed monolithically by filling the space between the printed boards with an insulation resin and curing the resin. Furthermore, an insulation resin is laminated on the surface of the printed board in such a manner that the resin may cover the mounted electronic parts, and cured. The heat generated from the electronic parts can be efficiently transmitted to the insulation resins by using a resin having a high thermal conductivity for both of the insulation resins, and the heat is then emitted from the surfaces of the metallic sheet or the insulation resin.

Abstract: An insulating paste comprises a glass component composed of SiO.sub.2, B.sub.2 O.sub.3 and K.sub.2 O as xSiO.sub.2 --yB.sub.2 O.sub.3 --zK.sub.2 O, where x, y and z (% by weight) fall within the area surrounded by points A (x=65, y=35, z=0), B (x=65, y=20, z=15), C (x=85, y=0, z=15) and D (x=85, y=15, z=0), and an organic vehicle. The insulating layer made of the paste has a low dielectric constant and excellent insulating properties.

Abstract: Described is a printed wiring board comprising a composite of an electrically conductive core laminated with layers of dielectric material and electrically conductive material.

Abstract: A laminate of a film of a liquid crystal polyester resin includes (A) from 55 through 99% by weight of a liquid crystal polyester and (B) from 45 through 1% by weight of an epoxy group-containing thermoplastic resin laminated on a metallic foil, and is useful for producing a printed-wiring board. The laminate is excellent in heat resistance, processibility and flexibility and is inexpensive and therefore suitable for producing printed-wiring boards.

Abstract: This invention provides a device for capacitively measuring the distance to an object, which comprises an electrode that will couple capacitively with the object, a shield that surrounds the electrode and is electrically isolated from the electrode by means of insulation, and a layer of insulation that surrounds the shield, wherein the insulation between the electrode and the shield, and the insulation that surrounds the shield, are formed by deposition.This invention further provides a method for measuring the distance to a solid object, which comprises forming an electrode that will capacitively couple with the object, depositing a layer of insulation over at least part of the electrode so that the insulation surrounds the electrode, depositing a layer of metal over the insulation to form a shield, and depositing a second layer of insulation over the shield.

Abstract: An undercoating agent for a multilayer printed circuit board which comprises:(a) a normally solid epoxy resin having a softening point of 45.degree. to 120.degree. C.,(b) an epoxy resin curing agent,(c) a diluent in which the epoxy resin is dissolved and which consists of a photopolymerizable monomer, and(d) a photopolymerization initiator,said undercoating agent being effectively used in the production of a multilayer printed circuit board which utilizes making the undercoating agent tack-free by irradiation with active energy beams and the main curing of the undercoating agent by heating.

Abstract: A composition having an empirical formula MB.sub.2-z +N, wherein 0<z<0.10 and M is selected from the group consisting of Zr, Hf and Ti, wherein N is selected from a group consisting of Cu, Au and Ag and wherein the MB.sub.2-z defines a ceramic matrix structure defining a volume with void spaces comprising at least 10 percent of the volume of the matrix structure and the N occupies at least 70 percent, by volume, of the void spaces. A preferred method of making the composition is a two step process: First, ZrB.sub.2 powder (which preferably is slightly enriched in Zr is vacuum hot pressed at a hot pressing temperature of about 2150 degrees C. to create a ceramic matrix having a density of about 68 percent. Second, the ceramic matrix is heated in a pool of copper at a vacuum and at an infiltration temperature of about 1700 degrees C. to permit copper from the pool to infiltrate the ceramic matrix.

Abstract: A multilayer circuit board includes a plurality of substrates. Each of the substrates includes a thermosetting resin film having respective surfaces, a metal layer formed on the one of the surfaces and a thermoplastic polyimide film formed on the other surface. Each of the substrates has at least one via hole, which is filled with thermoplastic polyimide resin containing electrically conductive material to form an electrically conductive via. The metal layer is defined as a predetermined circuit pattern electrically connected to the via. The plurality of substrates are laminated in such a manner that the substrate is adhered to an adjacent one by means of the thermoplastic polyimide film.

Abstract: Provided is a process for producing a semiconductor silicon wafer by which an intrinsic gettering effect can be improved and at the same time the top side can be made free from faults. A silicon ingot is produced and sliced to obtain silicon wafers. Then, a polycrystal silicon depositing film is formed on one side of a silicon wafer, which is subjected to a heat treatment in an inert gas, a reducing gas or a mixture thereof to discharge oxygen from the vicinity of the other side. Alternatively, after discharging oxygen from the silicon wafer by a heat treatment, a polycrystal silicon depositing film may be formed on one side of the silicon wafer.

Abstract: The present invention provides a banding system, banding tape and method of using the same, each of which is particularly useful a variety of items such as flowers, straws, pens, pencils, newspapers, and vegetables. The banding system comprises a first strip and second strip. The first strip comprises an elastic polymeric material having a percent recovery of at least 50% after being elongated to 100% of its original length. The first and second strips are capable of being bonded together. The banding tape comprises a strip of elastic polymeric material having inner and outer surfaces and a nontacky layer on at least a portion of at least one of the surfaces. The method of using the banding system or tape of the invention comprises the steps of collecting one or more objects into a bundle, wrapping, stretching and securing the system or tape around the bundle, and allowing the elastic strip to at least partially recover to exert a compressive force on the bundle which holds the bundle together.

Abstract: A resistive component which is composed of one or more resistive films which, if necessary, may be provided on a substrate, and at least one of which is on the basis of CrSi, the resistive film on the basis of CrSi comprising 5-50 at. % Cr, 10-70 at. % Si, 5-50 at. % O and at least one element of the group formed by B, C and N in a concentration of 1-50 at. %. The advantageous properties of the resistive component in accordance with the invention are based on the reactive incorporation of oxygen and carbon or oxygen and nitogen or oxygen and carbon and nitrogen into resistive films on the basis of CrSi.

Abstract: Gas-permeable 100% reinforced thermosetting polyester film material for the manufacture of pest control applicators, comprising a grid including a base of polyester yarn overlain with top and bottom layers of polyester fibers, and an aqueous-based paste of the same polyester filling the spaces between the grid yarn and fibers and having a melting point lower than the grid yarn and fibers polyester. A pest control applicator is formed of such film material, filled with pest control agent reactive with water to release a fumigating gas, and after reaction of the pest control agent with air humidity, the applicator is immersed in water to deactivate residial pest control agent.

Abstract: The invention relates to an open cell, porous, selectively conductive member containing an elastomer that is reusable in use and preparation. The scaffold for the elastomer has conductive areas through conductive, z-axis pathways are provided which are electrically isolated from adjacent z-axis conductive pathways. The elastomer is non-adhesive and/or non tacky and allows for temporary connection of electronic components.

Abstract: In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to drastically simplify the production process, in forming an electronic circuit board in which glass ceramics is used for board material and a wiring conductor and junction electrode wherein the Cu is sized to extend beyond the pin hole so that solder only contacts it and not the ceramic circuit board. The wiring and junction electrode is formed in a same process while forming a cover coat on the electrode using board material, and Au or Au--Ni laminated film is formed on this electrode as occasion demands, and then an electronic component is connected thereto using a solder such a Au--Sn or Au--Ge.

Abstract: A multi-layered substrate capable of lowering transient and steady heat resistances. A metal serving as a heat conductor having good heat conducting property is fitted in the uppermost insulating layer, and a power element is disposed on the fitted metal. The heat generated by the power element is conducted to the metal in the uppermost insulating layer and is radiated. The metal can be composed of a mixture of molybdenum particles or tungsten particle having a high melting point and aluminum particles.

Abstract: This invention provides an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape of the invention comprises an adhesive layer composed of at least a polyimide selected from (I) a polyimide comprising the repeating unit represented by the following formula (1), (II) a polyimide comprising the repeating unit represented by the following formula (2), and (III) a polyimide comprising the repeating units represented by the following formulas (1) and (2) in a suitable proportion, provided on at least one surface of a heat resistance film or on a surface of a release film: ##STR1## wherein Ar is a divalent group having aromatic rings, Ra is a divalent group having 2 to 6 benzene rings; Rb is an alkylene group having 2 to 20 carbon atoms, a specific ether group or a specific dimethylsiloxane group: X.sup.1 is NH, NR (R is a C.sub.1 -C.sub.4 alkyl group or alkoxy group) or S; and X.sup.2 is NH, NR (R is a C.sub.1 -C.sub.

Abstract: The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate and depositing a layer of reducible material on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region is interspersed between the sintered ceramic regions.

Abstract: A component for use in manufacturing articles such as printed circuit boards comprising a laminate of a sheet of copper foil and a sheet of aluminum or the like. A band of flexible adhesive joins the sheets around their borders and creates a protected central zone at the interface of the sheets. Islands of adhesive are located inwardly of the edges of the sheets through which tooling pin holes may be formed to facilitate handling of the foil.