Abstract: A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

Abstract: A coating composition including an alkali metal silicate, a wetting agent, and a hydrophilic antifog agent forms an antifog coating on a substrate. The coating may be applied to the surface of a film from an aqueous dispersion of the ingredients, followed by drying to form a composite film.

Abstract: A processing chamber component and method for fabricating the same are provided. The processing chamber component is fabricated in the manner described herein and includes the creation of at least a macro texture on a surface of the chamber component. The macro texture is defined by a plurality of engineered features arranged in a predefined orientation on the surface of the chamber component. In some embodiments, the engineered features prevent formation of a line of sight surface defined between the features to enhance retention of films deposited on the chamber component.

Abstract: A conductive glass substrate includes a glass substrate, a silicon dioxide layer, and a conductive mesh line, the glass substrate defines a meshed groove on a surface thereof; the silicon dioxide layer is attached to the surface of the glass substrate having the groove; the conductive mesh line have a shape adapted to that of the groove, the conductive mesh line is deposited in the groove and attached to the glass substrate via the silicon dioxide layer. In the conductive glass substrate, the conductive mesh line is received in the groove, compared with the conventional conductive glass substrate, a flexible substrate as a supporting body is not needed, the cost is down, and the structure of the conductive glass substrate is simple, further reducing the process, saving manpower and resources. A method of preparing the conductive glass substrate is provided.

Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Abstract: A conductive member disposed as a power supply line and the like includes: a first conductive material and a second conductive material, at least one of which includes a conductive material having electrical resistance lower than that of aluminum; and a metal film formed by depositing powder including a metal, which is accelerated together with a gas and sprayed, in a sold state, onto a surface of a butting part, where the first conductive material and the second conductive material are butted against each other.

Abstract: Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 ?g/dm2; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 ?g/dm2; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt %.

Abstract: Provided is a copper-clad laminate obtainable by bonding a copper foil on which roughening treatment including copper-cobalt-nickel alloy plating is performed and a liquid crystal polymer to each other, wherein the copper-clad laminate is free from a roughening particle residue on a surface of the liquid crystal polymer resin after copper foil circuit etching. The copper-clad laminate obtainable by bonding a copper foil and a liquid crystal polymer to each other, wherein the copper foil includes a copper primary particle layer formed on a surface bonded to the liquid crystal polymer and a secondary particle layer formed on the primary particle layer and made from a ternary alloy including copper, cobalt, and nickel; the primary particle layer has an average particle size of 0.25 to 0.45 ?m; and the secondary particle layer has an average particle size of 0.05 to 0.25 ?m.

Abstract: Channels may be formed in the inlay substrate of a transponder, such as by laser ablation, and the antenna wire may subsequently be laid in the channels. Laying the wire in a channel ensures that it substantially fully embedded in the substrate, thereby eliminating a need for pressing the wire into the substrate. The channels may be tapered, or profiled, to enhance adhesion of a self-bonding wire. A recess for the chip module can also be formed using laser ablation, and insulation may be removed from end portions of the antenna wire using laser ablation. Laser ablation may also be used to create various mechanical and security features.

Abstract: Provided is a rolled copper or copper-alloy foil having a roughened surface, the rolled copper or copper-alloy foil subjected to roughening treatment with copper fine grains wherein a copper base plating layer is provided between the copper roughened layer and the rolled copper or copper-alloy foil. An object of the present invention is to provide a roughened rolled copper-alloy foil having fewer craters, the presence of which is a serious disadvantage unique to a rolled copper-alloy foil having a roughened surface. In particular, provided is a rolled copper or copper-alloy foil in which the development of craters caused by inclusions present in or near a surface of the base material can be controlled.

Abstract: The present invention relates to a method of manufacturing a web of a plurality of conductive structures which may be used for example to produce an antenna, electronic circuit, photovoltaic module or the like. The method involved simultaneously patterning at least one pattern in a conductive layer using a plurality of registration marks. The registration marks serve to align and guide the creation of the plurality of conductive structures. Optical brighteners may also be utilized within the adhesive layer and the registration marks of the present invention in order to detect the location where conductive structures are to be placed.

Abstract: Flexible metamaterials and three-dimensional metamaterials operable in the terahertz range are disclosed. Methods are disclosed for fabricating terahertz response metamaterials using microfluidic-jetted techniques. Layers of material including substrate and deposited material are stacked to form three dimensional bulk metamaterials. The fabricated metamaterials act as left-handed metamaterials in the range 0.1 to 3.0 THz.

Abstract: A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 ?m to 1.0 ?m, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil.

Abstract: A sealing member is disclosed, which includes a first structure and a second structure. The first structure includes a groove with an opening towards the outside of the sealing member, wherein the second structure is disposed in the groove. The first structure includes a first material, and the second structure includes a second material, wherein the water absorption rate of the second material is greater than the water absorption rate of the first material. Also, an electronic device using the sealing member is disclosed.

Abstract: The invention relates to an enamelled part (3, 11, 21) for a dial comprising a ceramic substrate (31) coated with a first enamel layer (4?, 12, 24, 33) to improve the appearance of said part. According to the invention, the part includes at least one other enamel layer (6?, 8?, 9, 14, 16, 25, 35, 37, 39, 41, 43, 45) partially covering the first enamel layer (4?, 12, 24, 33) so as to form a decoration with a similar improved appearance. The invention concerns the field of timepieces, jewellery and gems.

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 ?g/dm2 of Ni and said Cr layer containing 10-100 ?g/dm2 of Cr is provided.

Abstract: A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating.

Abstract: The present invention relates to a method of manufacturing a web of a plurality of conductive structures which may be used for example to produce an antenna, electronic circuit, photovoltaic module or the like. The method involved simultaneously patterning at least one pattern in a conductive layer using a plurality of registration marks. The registration marks serve to align and guide the creation of the plurality of conductive structures. Optical brighteners may also be utilized within the adhesive layer and the registration marks of the present invention in order to detect the location where conductive structures are to be placed.

Abstract: A composite dual blackened copper foil includes a copper foil and two blackened layers. The copper foil has a shiny side and a matte side. The blackened layers are formed on the shiny and matte sides respectively. The blackened layers are formed alloy by electroplating in a plating bath consisting essentially of copper, cobalt, nickel, manganese, magnesium and sodium ions. A rough layer is selectively formed between the blackened layer and the shiny side as well as the matte side. Both side of the copper foil is spotless, powder free, and good in etching quality. The copper foil is effective at blocking electromagnetic wave, near infrared, undesired light and the like. The copper foil exhibits strong light absorption and is applicable to direct gas laser drilling. A method of manufacturing the composite dual blackened copper foil is also provided.

Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.