Abstract: The present invention discloses a color filter by copper and silver film, comprising: a lower copper layer; a lower silver layer formed on the lower copper layer; a medium formed on the lower silver layer; an upper copper layer formed on the medium; and an upper silver layer formed on the upper copper layer.
Abstract: An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0.
Abstract: The present invention provides a resin composition which can produce a multilayer printed wiring board not causing peeling and crack in a thermal shock test such as a cooling/heating cycle, and having high heat resistance and low-thermal expansion characteristics, when the resin composition is used for an insulating layer of the multilayer printed wiring board; and also an insulating sheet provided on a base, a prepreg, a multilayer printed wiring board and a semiconductor device using thereof. The resin composition is used for forming an insulating layer of the multilayer printed wiring board, wherein a surface roughness parameter Rvk value of the insulating layer is from 0.1 ?m to 0.8 ?m, measured after the insulating layer being formed with the resin composition, and subject to roughening treatment.
Abstract: An electrical component includes a ceramic base body that includes a surface that is partially ceramic, electrodes in the ceramic base body that have ends that form parts of the surface of the ceramic base body, and a bonding layer on the surface of the ceramic base body. The bonding layer has a composition such that, when the bonding layer is heated, the bonding layer is less adhesive to the ends of the electrodes than when not heated.
Type:
Grant
Filed:
August 3, 2005
Date of Patent:
June 5, 2012
Assignee:
EPCOS AG
Inventors:
Harald Köppel, Robert Krumphals, Axel Pecina
Abstract: A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.
Type:
Grant
Filed:
July 17, 2009
Date of Patent:
May 29, 2012
Assignee:
World Properties, Inc.
Inventors:
Sankar K. Paul, Christopher J. Caisse, Dirk M. Baars, Allen F. Horn, III
Abstract: To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. In a construction in which by using a solder paste containing solder particles 5 in a thermosetting resin 3a, a rigid substrate 1 and a flexible substrate 7 are bonded by the thermosetting resin 3a, and a first terminal 2 and a second terminal 8 are electrically connected by the solder particles 5, a blending ratio of an activator of the thermosetting resin 3a in the solder paste is properly set and oxide film removed portions 2b, 8b, and 5b are partially formed in oxide films 2a, 8a, and 5a of the first terminal 2, the second terminal 8, and the solder particles 5.
Abstract: The invention relates to a composite artificial grass fiber for use in an artificial lawn, in particular an artificial grass sports field, which artificial grass fiber is made up at least of several monofilament fibers. The invention further relates to an artificial lawn, in particular an artificial grass sports field built up of a substrate to which composite artificial grass fibers according to the invention are attached. The invention also relates to a method for manufacturing a composite artificial grass fiber according to the invention, in particular for an artificial lawn, which comprises the steps of manufacturing several monofilament fibers and forming said several monofilament fibers into a composite artificial grass fiber.
Type:
Grant
Filed:
November 13, 2007
Date of Patent:
May 22, 2012
Assignee:
Ten Cate Thiolon, B.V.
Inventors:
Frank Pfeiffer, Marinus Hendrikus Olde Weghuis, Frederik Jan Van Der Gaag, Hermannus Hendrik Jager
Abstract: Provided is a laminated ceramic package. The laminated ceramic package includes a laminated ceramic substrate having a conductive pattern therein, a first ceramic layer on the laminated ceramic substrate, and a second ceramic layer on the first ceramic layer. The first ceramic layer has a firing area shrinkage rate of about 1% or less. The second ceramic layer has a cavity receiving electronic components and a different firing shrinkage rate from the first ceramic layer.
Abstract: A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer, the second insulating layer with a second conductive wiring electrically connected to the first conductive wiring and a softening temperature higher than the first insulating layer. The first insulating layer is mainly formed of a liquid crystal polymer. The core insulating layer and the second insulating layer are mainly formed of a polyimide resin or a bismaleimide triazine resin. The first conductive wiring and the second conductive wiring are electrically connected through a conductive via formed penetrating through the first insulating layer and the second insulating layer in a thickness direction.
Abstract: The present invention provides a ceramic green sheet with a thin flat plate shape obtained by molding and solidifying a ceramic slurry, which contains a ceramic powder, dispersion medium, and gelling agent, into a thin flat plate. The ceramic green sheet partially includes a body that is obtained by molding and solidifying a conductor paste, which becomes a conductor later, and the body is exposed on a part of each of the both surfaces of the sheet. Plural ceramic green sheets described above are produced. The plural ceramic green sheets are successively stacked and press-bonded in the thickness direction in such a manner that the bodies included in the respective sheets are connected to each other for all combinations of the adjacent two sheets. As a result, a ceramic green sheet laminate is formed, which includes one body that is obtained by connecting the bodies included in the respective sheets.
Type:
Grant
Filed:
February 25, 2009
Date of Patent:
May 15, 2012
Assignee:
NGK Insulators, Ltd.
Inventors:
Kunihiko Yoshioka, Koji Kimura, Satoshi Ishibashi
Abstract: In a method for applying a multilayer wear-resistant coating on metallic, optionally already coated, surfaces, the coating is composed of at least two anti-wear layers (5) and an intermediate layer (10) each arranged between two anti-wear layers (5). The intermediate layer (10) is comprised of a material composition containing the material of the anti-wear layer (5) and a further material, wherein the application of the intermediate layer (10) is effected with a content of the material of the anti-wear layer (5) decreasing over a first transition region (a) and a content of the material of the anti-wear layer (5) increasing over a second transition region (b), the content of the material of the anti-wear layer (5) in the intermediate layer (10) being selected to be at least 5% by weight in every point.
Abstract: A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.
Abstract: Disclosed herein is a polymer substrate for a flexible display, comprising a reticular superelastic alloy structure and/or an annular superelastic alloy structure therein. The polymer substrate has an improved flexibility because the superelastic alloy structure is embedded therein.
Type:
Grant
Filed:
September 11, 2008
Date of Patent:
May 1, 2012
Assignee:
Korea Advanced Institute of Science and Technology
Inventors:
Choon Sup Yoon, Young Chul Sung, Dong Ho Cho, Duk Young Jeon
Abstract: The present invention provides a plated article that has a thin seed layer having a uniform thickness, formed by electroless plating and allowing formation of ultrafine wiring, and that avoids the complicated formation of a bilayer of a barrier layer and a catalytic metal layer prior to forming the seed layer. The present invention also provides a method for manufacturing the plated article. The plated article has an alloy thin film formed on a substrate and containing a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5at% to 40at% of the metal (A).
Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.
Type:
Grant
Filed:
October 23, 2008
Date of Patent:
April 24, 2012
Assignee:
E. I. du Pont de Nemours and Company
Inventors:
Pui-Yan Lin, Govindasamy Paramasivam Rajendran, George Elias Zahr
Abstract: A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of .ltoreq.40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body. The method involves: (a) providing an unfired, ceramic sheet having a thickness of .ltoreq.40 mils and preferably comprising .ltoreq.99% aluminum oxide; (b) forming multiple blind holes in said sheet; (c) inserting solid wires, preferably of platinum, in said holes; (d) firing the assembly of sheet and wires to a temperature sufficient to sinter the sheet material but insufficient to melt the wires; and (e) removing sufficient material from the sheet lower surface so that the lower ends of said wires are flush with the finished sheet lower surface.
Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 ?m.
Abstract: The invention relates to a coated article which has (i) at least one electrically non-conducting base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer, wherein the copper or copper alloy layer (ii) is positioned between the base layer (i) and the layer containing the conductive polymer (iii), and which is characterized in that the layer (iii) contains at least one precious metal or at least one semiprecious metal or a mixture thereof. The invention also relates to a process for its production and also its use for the prevention of corrosion and to preserve the solderability of printed circuit boards.
Abstract: The present invention provides an artificial grass granulated infill excellent in productivity, workability, and recyclability, and an artificial grass structure using the same. A hollow cylindrical granulated infill 5 which has a height h of 3.0 mm or less and an outside diameter of 3.0 mm or less and satisfies the condition: ?2/?1=0.40 to 0.85, where ?1 presents the outside diameter and ?2 represents the inside diameter, is made from a material comprising a synthetic resin having a hardness of 60 or more in accordance with JIS-K6253 type A.
Abstract: There are provided a method of manufacturing a ceramic sintered body. A method of manufacturing a ceramic sintered body according to one aspect of the invention may include: preparing at least one ceramic sheet having first ceramic particles and glass particles; preparing at least one constraining sheet having second ceramic particles having a smaller particle size than the glass particles and the first ceramic particles; forming a ceramic laminate by alternating the ceramic sheet and the constraining sheet while the ceramic sheet and the constraining sheet are in contact with each other; and sintering the ceramic laminate so that components, which do not react with the first ceramic particles, from the glass particle are moved into the constraining sheet to sinter the constraining sheet when the ceramic sheet is sintered.