Abstract: A test apparatus has at least one optical source, a high-speed photodetector, a microcontroller or processor, and electrical circuitry to power and drive the optical source, high-speed photodetector, and microcontroller or processor. The apparatus measures the frequency response and optical path length of a multimode optical fiber under test, utilizes a reference VCSEL spatial spectral launch condition and modal-chromatic dispersion interaction data to estimate the channels total modal-chromatic bandwidth of the fiber under test, and computes and presents the estimated maximum data rate the fiber under test can support.

Abstract: A photonic integrated chip structure and a fabrication method thereof can effectively realize P\N electrical isolation among discrete devices in an integrated chip so as to perform P\N dual-side RF driving on the devices. The photonic integrated chip structure includes a substrate; and a buffer layer; a bottom conductive layer, formed on the buffer layer, which comprises a plurality of bottom conductive regions, wherein a bottom isolation region is arranged between two adjacent bottom conductive regions; the type of dopant in the bottom isolation region is opposite to that in the adjacent bottom conductive regions; a core layer, which comprises a plurality of core regions, wherein the core regions are in one-to-one correspondence with the bottom conductive regions; a top conductive layer, which comprises a plurality of top conductive regions, and a top isolation region is arranged between two adjacent top conductive regions.

Abstract: A lithium niobate on insulator (LNOI) optical waveguide including a first region, a second region, and a third region, a substrate layer extending across the first region, the second region, and the third region, and a first cladding layer disposed on the substrate layer across the first region, the second region, and the third region. The LNOI optical waveguide further includes a lithium niobate (LN) layer disposed on the first cladding layer across the first region and the second region. The LN layer has a planar surface in the first region and a vertically tapered surface in the second region, and a dielectric strip in contact with the LN layer across the first region and the second region, and in contact with the first cladding layer across the third region.

Abstract: An armored DSS cable includes: an inner layer part including a first rope helically wound; and a surface layer part including an optical fiber module and a plurality of third ropes, the optical fiber module having an optical fiber and a plurality of second ropes helically surrounding the optical fiber and having a smaller outer diameter than the first rope, the third ropes having a larger outer diameter than the first rope, such that the optical fiber module and the third ropes are arranged on an identical circle and helically wound, wherein the inner layer part and the surface layer part are formed concentrically.

Abstract: Structures for a cavity-mounted chip and methods of fabricating a structure for a cavity-mounted chip. The structure comprises a substrate including a cavity, a thermoelectric device inside the cavity, and a chip disposed inside the cavity adjacent to the thermoelectric device. The thermoelectric device includes a first plurality of pillars and a second plurality of pillars that alternate with the first plurality of pillars in a series circuit, the first plurality of pillars comprising an n-type semiconductor material, and the second plurality of pillars comprising a p-type semiconductor material.

Abstract: A system includes a plurality of wafer-scale modules and a plurality of optical fibers. Each wafer-scale module includes an optical backplane and one or more die stacks on the optical backplane. The optical backplane includes a substrate and at least one optical waveguide layer configured to transport and/or manipulate photonic quantum systems (e.g., photons, qubits, qudits, large entangled states, etc.). Each die stack of the one or more die stacks includes a photonic integrated circuit (PIC) die optically coupled to the at least one optical waveguide layer of the optical backplane. The plurality of optical fibers is coupled to the optical backplanes of the plurality of wafer-scale modules to provide inter-module and/or intra-module interconnects for the photonic quantum systems.

Abstract: Embodiments of the disclosure relate to an optical fiber cable having at least one optical fiber, a cable jacket and a foam layer. The cable jacket includes an inner surface and an outer surface in which the outer surface is an outermost surface of the optical fiber cable. The inner surface is disposed around the at least one optical fiber. The foam layer is disposed between the at least one optical fiber and the cable jacket. The foam layer is made of an extruded product of at least one thermoplastic elastomer (TPE), a chemical foaming agent, and a crosslinking agent. The foam layer has a closed-cell morphology having pores with an average effective circle diameter of less than 100 ?m. Further, the foam layer has a compression modulus of less than 1 MPa when measured at 50% strain.

Abstract: A cable that protects an object includes a sheath and a cylindrical reinforcement member disposed inside the sheath and that surrounds the object. The cylindrical reinforcement member has a first side edge and a second side edge that extend in a longitudinal direction. The cylindrical reinforcement member is formed of a cable reinforcement sheet including a first metal sheet and a second metal sheet joined to the first metal sheet. A portion of the first metal sheet overlaps a portion of the second metal sheet, and the overlapping portions define a joint portion where the first metal sheet and the second metal sheet are joined. The joint portion is inclined, from the second side edge to the first side edge, toward the first metal sheet.

Abstract: A plurality of waveguide display substrates, each waveguide display substrate having a cylindrical portion having a diameter and a planar surface, a curved portion opposite the planar surface defining a nonlinear change in thickness across the substrate and having a maximum height D with respect to the cylindrical portion, and a wedge portion between the cylindrical portion and the curved portion defining a linear change in thickness across the substrate and having a maximum height W with respect to the cylindrical portion. A target maximum height Dt of the curved portion is 10?7 to 10?6 times the diameter, D is between about 70% and about 130% of Dt, and W is less than about 30% of Dt.

Abstract: An optical fiber drop cable including a cable jacket having an outer surface defining the outermost surface of the optical fiber drop cable. The optical fiber drop cable also includes a subunit, a first strength element, and a second strength element. The first strength element, the second strength element, and the subunit are embedded in the cable jacket, and the first strength element, the second strength element, and the subunit are arranged substantially parallel to each other on a first plane. The subunit includes a buffer tube having an inner surface and an outer surface, at least one optical fiber, and a plurality of strengthening yarns. The plurality of strengthening yarns are disposed between the inner surface of the buffer tube and the at least one optical fiber, and the outer surface of the buffer tube is at least partially in contact with the cable jacket.

Abstract: A carriage is configured to be mounted in a fiber distribution cabinet. The carriage includes a carriage body having a front end, a rear end, a first side, a second side, and a back wall cooperating to define a cavity. A top wall is disposed at the front end of the carriage body, and a plurality of side walls extending from the back wall to the top wall. The top wall, the side walls, and the back wall define a plurality of openings at the front end of the carriage body. The top wall includes a plurality of slots, and each the plurality of slots being associated with a respective one of the plurality of openings. The plurality of openings are sized and configured to receive a fiber optic component.

Abstract: Provided is an optical connector. The optical connector includes an optical sub-assembly (OSA) substrate integrally formed, the OSA substrate including a bottom surface, a first support surface, and a second support surface, the first and second support surfaces being formed together at a height of a first level from the bottom surface and apart from each other; a light-emitting device arranged on the first support surface; a ball lens located on a first optical path of light emitted from the light-emitting device, the ball lens being arranged on the second support surface; an optical fiber arranged at a rear portion of the ball lens along the first optical path; an optical filter configured to spatially separate the first optical path from the light-emitting device and a second optical path from the optical fiber; and a light-receiving device located on the second optical path and arranged on the second support surface.

Abstract: A head-up display includes an image generating unit and a waveguide glass. The waveguide glass faces toward the image generating unit. The waveguide glass includes a first microstructure, a second microstructure and a third microstructure. The first microstructure has a first width. The second microstructure is adjacent to the first microstructure. The third microstructure is adjacent to the second microstructure. The third microstructure has tiling areas adjacent to each other. A gap between the two adjacent tiling areas is less than half of the first width.

Abstract: Provided are (i) a fiber-optic cable having a cable sheath that enables significant changes in the cable's cross-sectional shape when the cable is bent and (ii) a raceway that can be used to deploy such a fiber-optic cable.

Abstract: An optical fiber cable includes: a core including optical fibers; a reinforcing wrap that surrounds the core; and a sheath that accommodates the core and the reinforcing wrap. The reinforcing wrap includes an overlapping portion. A first end portion of the reinforcing wrap overlaps a second end portion of the reinforcing wrap at a portion of the reinforcing wrap in a circumferential direction of the optical fiber cable in a cross-sectional view.

Abstract: A light source device includes: a substrate having a support face; a plurality of light emitting elements disposed on the support face, the plurality of light emitting elements including a first light emitting element and a second light emitting element, each of which is a vertical-cavity surface-emitting laser element; and a planar lightwave circuit having a light incident face that faces the support face and including a plurality of optical waveguides configured to guide light that has exited from the respective plurality of light emitting elements and entered the light incident face. The planar lightwave circuit is directly or indirectly supported by the plurality of light emitting elements. The substrate includes a first wiring layer electrically connected to the first light emitting element and the second light emitting element.

Abstract: An apparatus for determining a wavelength and a power of an input signal is described. The apparatus comprises a memory which stores instructions, which when executed by the processor, cause the processor to: recover a first phase for a first Mach-Zehnder Interferometer MZI; recover a second phase for a second MZI; subtract the first phase from the second phase to provide a phase difference; determine an unwrapped phase difference as a function of wavelength; determine a coarse wavelength; and determine a first wavelength for the first FSR and a second wavelength from the second FSR; and average the first and second wavelengths to determine the wavelength of the input signal.

Abstract: A low fatigue rewindable optical fiber cable comprises a core having at least one optical transmission element, a dielectric armouring surrounding the core and a sheath surrounding the dielectric armouring. Particularly, the low fatigue rewindable optical fiber cable is characterized by a fatigue performance ratio (FPR) which is a ratio of a cross sectional area of the sheath and a cross sectional area of the dielectric armouring and is between 3 to 4.5 that enables at least 10 cyclic winds and unwinds carried out on a drum with a diameter of 40 times an outer diameter of the low fatigue rewindable optical fiber cable.

Abstract: Electrical test of optical components via metal-insulator-semiconductor capacitor structures is provided via a plurality of optical devices including a first material embedded in a second material, wherein each optical device is associated with a different thickness range of a plurality of thickness ranges for the first material; a first capacitance measurement point including the first material embedded in the second material; and a second capacitance measurement point including a region from which the first material has been replaced with the second material.

Abstract: A method is described of manufacturing an optical sensing element for detecting a presence and/or determining a concentration of an analyte in a fluid medium, in particular in an aqueous medium. The optical sensing element includes an optical waveguide (e.g. an optical fiber) comprising an optically transparent material for guiding light through the sensing element along a flightpath. The optical sensing element further includes an inorganic coating for adsorbing the analyte from the fluid medium and an adhesion promotion layer formed between the optical waveguide and the inorganic coating. The adhesion promotion layer includes an adhesion promotion material for promoting adhesion of the inorganic material.