Patents Examined by Chris Chu
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Patent number: 10241276Abstract: An optical fiber connector dust cap made of transparent material and suitable to be fitted in a port of an optical fiber adapter, and an indicator lamp provided at a port of the optical fiber adapter. A reflective surface is provided inside the dust cap, and an optical fiber connector is inserted into another port of the optical fiber adapter. A light emitted from the indicator lamp hits one side of the reflective surface, and is then reflected towards the external end section of the dust cap by the reflective surface, and is output from the external end section of the dust cap. Allowing an operator to clearly see the operational status of the indicator lamp on the optical fiber adapter, at the external end section of the dust cap.Type: GrantFiled: March 18, 2016Date of Patent: March 26, 2019Assignee: CommScope Telecommunications (Shanghai) Co., Ltd.Inventors: Xiongliang Chai, Wenyong Fan, Weili Zhang
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Patent number: 10244637Abstract: Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive film.Type: GrantFiled: August 9, 2011Date of Patent: March 26, 2019Assignee: CAMBRIOS FILM SOLUTIONS CORPORATIONInventors: David Jones, Florian Pschenitzka, Xina Quan, Michael A. Spaid, Jeffrey Wolk
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Patent number: 10222570Abstract: Fiber optic equipment that supports independently translatable fiber optic modules and/or fiber optic equipment trays containing one or more fiber optic modules is disclosed. In some embodiments, one or more fiber optic modules are disposed in a plurality of independently translatable fiber optic equipment trays which are received in a tray guide system. In this manner, each fiber optic equipment tray is independently translatable within the guide system. One or more fiber optic modules may also be disposed in one or more module guides disposed in the fiber optic equipment trays to allow each fiber optic module to translate independently of other fiber optic modules in the same fiber optic equipment tray. In other embodiments, a plurality of fiber optic modules are disposed in a module guide system disposed in the fiber optic equipment that translate independently of other fiber optic modules disposed within the module guide system.Type: GrantFiled: January 24, 2017Date of Patent: March 5, 2019Assignee: Corning Optical Communications LLCInventors: Terry Lee Cooke, David Lee Dean, Jr., Tory Allen Klavuhn, Juan Garcia Martinez, Elmer Mariano Juarez, Manuel Alejandro Lopez Sanchez, Juan Miguel Gonzalez Covarrubias
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Patent number: 10216016Abstract: Methods, systems, and devices are disclosed for linear optical phase modulators. In some aspects, a linear optical phase modulator device is provided to include a substrate; a PN junction formed on the substrate to include a P region, a N region and a depletion region formed by the P and N regions; and an optical waveguide formed on the substrate and structured to guide light in one or more optical modes to have a spatial optical intensity distribution based on a free carrier density spatial distribution in the PN junction in such that the depletion region exhibits a substantially linear response with regard to a voltage applied to the PN junction to modulate a phase of the light guided by the optical waveguide.Type: GrantFiled: July 27, 2015Date of Patent: February 26, 2019Assignee: Cornell UniversityInventors: Yoon Ho Lee, Jaime Cardenas, Michal Lipson
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Patent number: 10209466Abstract: Disclosed is a package comprising a substrate having a patterned surface with an optical contact area, an optical redistribution layer (oRDL) feature, and a build-up material extending over the patterned surface of the substrate and around portions of the oRDL features. In some embodiments, the package comprises a liner sheathing the oRDL features. In some embodiments, the oRDL feature extends through openings in an outer surface of the build-up material and forms posts extending outward from the outer surface. In some embodiments, the package comprises an electrical redistribution layer (eRDL) feature, at least some portion of which overlap at least some portion of the oRDL feature. In some embodiments, the package comprises an optical fiber coupled to the oRDL features.Type: GrantFiled: April 2, 2016Date of Patent: February 19, 2019Assignee: Intel IP CorporationInventors: Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes, Klaus Reingruber, Andreas Wolter, Richard Patten
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Patent number: 10209441Abstract: In an FOP 1, a glass body 8 is configured by including antimicrobial glass portions 10 made of antimicrobial glass containing Ag2O. Here, the glass containing silver does not have chemical durability, so that it has properties to easily emit Ag ions due to moisture. Ag ions have an excellent antimicrobial effect. Therefore, by configuring the glass body 8 to include the antimicrobial glass portions 10 containing Ag2O, the glass body 8 can obtain a sterilization effect due to the action of Ag ions. Therefore, the FOP 1 can be provided with antimicrobial activities.Type: GrantFiled: July 3, 2017Date of Patent: February 19, 2019Assignee: HAMAMATSU PHOTONICS K.K.Inventor: Takeo Sugawara
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Patent number: 10191229Abstract: An optical transceiver that optionally exchanges between the bail and the pull-tab for disengaging the optical transceiver with the cage is disclosed. The optical transceiver provides a slider to be assembled with both of the bail and the pull-tab. The slider provides an opening common to the bail and the pull-tab, and a composite opening that includes a portion for the bail and another portion for the pull-tab. The bail, by rotating around the common opening, may induce forward and rearward motions for the slider, while, the pull-tab, by pulling and pushing, may directly cause the forward and rearward motions for the slider through the composite opening.Type: GrantFiled: November 6, 2017Date of Patent: January 29, 2019Assignee: Sumitomo Electric Industries, Ltd.Inventor: Takashi Matsui
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Patent number: 10162198Abstract: The present disclosure relates to an integrated chip having a multiband transmission and reception elements coupled to an integrated dielectric waveguide. In some embodiments, the integrated chip has a dielectric waveguide disposed within an inter-level dielectric (ILD) structure over a substrate. A multiband transmission element having a plurality of phase modulation elements is configured to generate a plurality of modulated signals in different frequency bands. A plurality of transmission electrodes are located along a first side of the dielectric waveguide and are respectively configured to couple one of the plurality of modulated signals into the dielectric waveguide.Type: GrantFiled: September 7, 2016Date of Patent: December 25, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chewn-Pu Jou, Tien-I Bao
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Patent number: 10162130Abstract: A flat optical fiber cable assembly includes a flat optical fiber cable having an optical fiber cord and at least one tension wire, and a reinforcement mechanism having a reinforcing sleeve sleeved on the at least one tension wire, and a reinforcing body having an outer surface, a through groove indented inwardly from the outer surface, and a positioning groove that is indented inwardly from the outer surface, that is angularly spaced apart from the through groove and that has an engaging portion. The optical fiber cord is inserted into the through groove, and the at least one tension wire is inserted into the positioning groove with the reinforcing sleeve engaging the engaging portion.Type: GrantFiled: December 10, 2015Date of Patent: December 25, 2018Assignees: AMPHENOL FIBER OPTIC TECHNOLOGY (SHENZHEN), GLORIOLE ELECTROPTIC TECHNOLOGY CORP.Inventors: Bo-Lin Jiang, Song-Sheng Li, Min Chen, Chia-Hua Wu
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Patent number: 10157791Abstract: An integrated circuit structure includes a substrate, a metal ring penetrating through the substrate, a dielectric region encircled by the metal ring, and a through-via penetrating through the dielectric region. The dielectric region is in contact with the through-via and the metal ring.Type: GrantFiled: September 19, 2014Date of Patent: December 18, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Hao Tsai, En-Hsiang Yeh, Chuei-Tang Wang
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Patent number: 10139634Abstract: There is provided a display apparatus including a light guide system that includes a light-incident portion including a light-incident curved surface on which image light beams as non-parallel light beams are incident and a light-reflective curved surface which reflects the image light beams such that the image light beams are converted into parallel light beams, and a light guide portion being a portion in which a plurality of partial reflection layers are disposed in parallel. The light guide portion is filled with a parallel light flux emitted from the light-incident portion. The light-incident portion is formed of a first transparent member, the portion in which the partial reflection layers are formed is formed of a second transparent member which is surface-bonded to the first transparent member via a bonding surface, and the bonding surface is inclined in the same direction as that of the partial reflection layer.Type: GrantFiled: March 15, 2018Date of Patent: November 27, 2018Assignee: SEIKO EPSON CORPORATIONInventors: Hayato Matsuki, Takashi Takeda
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Patent number: 10141707Abstract: A fiber laser system includes a fiber laser connector having a housing to terminate a fiber that generates a laser beam. A chamber extends internally along a length of the housing. A light trap includes a plurality of threads formed along a wall of the chamber to trap light reflected back to the fiber laser connector in response to an application of the laser beam to a workpiece.Type: GrantFiled: May 16, 2017Date of Patent: November 27, 2018Assignee: NLIGHT, Inc.Inventors: Scott R. Karlsen, Walter R. Sanders
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Patent number: 10139581Abstract: Provided is a patch panel (11) on which a plurality of mounting frames (1A,1B), to which various kinds of adapters including a LC adapter (Q1) and a SC adapter (Q2) for electrical or optical communication, and a modular adapter (Q3) for telephone are attached by appropriately combining the adapters, are mounted in an insertable manner through a window opening (12) from the front side of the patch panel (11). The patch panel (11) is provided with a window frame (12) set to a predetermined length dimension so that the mounting frames (1A,1B) having a port specification different from one another can be mounted in a mixed manner in array by a reasonable number.Type: GrantFiled: April 10, 2018Date of Patent: November 27, 2018Assignee: SANWA DENKI KOGYO CO., LTD.Inventors: Nobuo Ishimine, Masanori Sato
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Patent number: 10132161Abstract: An embodiment of a method of manufacturing a fiber optic cable includes selecting a cable support structure configured to support an optical fiber sensor, adhering the optical fiber sensor to the cable support structure by applying a temporary adhesive, and installing a protective layer around the cable support structure and the temporarily adhered optical fiber sensor. The method further includes removing a bond between the optical fiber sensor and the temporary adhesive, wherein removing the bond includes injecting a debonding material into a space formed between the cable support structure and the protective layer, and injecting a permanent adhesive into the space, the permanent adhesive configured to immobilize the optical fiber sensor relative to the protective layer and allow strain to be transferred from the protective layer to the optical fiber sensor.Type: GrantFiled: April 24, 2018Date of Patent: November 20, 2018Assignee: BAKER HUGHES, A GE COMPANY, LLCInventors: Ajit Balagopal, Juan P. Franco, Paul F. Wysocki
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Patent number: 10132700Abstract: An FBG strain sensor for measuring strains to curved surfaces, includes a fiber which is fixed between two securing elements whose undersides are designed as adhesive surfaces, the optical fiber and these securing elements being embedded in a protective compound which consists of a soft silicone rubber or a plastic that has comparable mechanical properties, and the fiber being embedded between an upper and a lower thin sliding film or a sliding tube that consists of Teflon or of a plastic which has a low friction coefficient comparable to Teflon, the underside of the lower sliding film or the lower external surface-line of the sliding tube lying in a plane with the adhesive surfaces of the securing elements.Type: GrantFiled: November 15, 2012Date of Patent: November 20, 2018Assignee: HOTTINGER BALDWIN MESSTECHNIK GMBHInventors: Jochen Maul, Tobias Kipp, Bernd Günther
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Patent number: 10126499Abstract: An electro-optic device may include a photonic chip having an optical grating coupler at a surface. The optical grating coupler may include a first semiconductor layer having a first base and first fingers extending outwardly from the first base. The optical grating coupler may include a second semiconductor layer having a second base and second fingers extending outwardly from the second base and being interdigitated with the first fingers to define semiconductor junction areas, with the first and second fingers having a non-uniform width. The electro-optic device may include a circuit coupled to the optical grating coupler and configured to bias the semiconductor junction areas and change one or more optical characteristics of the optical grating coupler.Type: GrantFiled: June 30, 2015Date of Patent: November 13, 2018Assignees: STMICROELECTRONICS SA, STMICROELECTRONICS (CROLLES 2) SASInventors: Jean-Robert Manouvrier, Jean-Francois Carpentier, Patrick Lemaitre
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Patent number: 10126514Abstract: Fiber optic equipment that supports independently translatable fiber optic modules and/or fiber optic equipment trays containing one or more fiber optic modules is disclosed. In some embodiments, one or more fiber optic modules are disposed in a plurality of independently translatable fiber optic equipment trays which are received in a tray guide system. In this manner, each fiber optic equipment tray is independently translatable within the guide system. One or more fiber optic modules may also be disposed in one or more module guides disposed in the fiber optic equipment trays to allow each fiber optic module to translate independently of other fiber optic modules in the same fiber optic equipment tray. In other embodiments, a plurality of fiber optic modules are disposed in a module guide system disposed in the fiber optic equipment that translate independently of other fiber optic modules disposed within the module guide system.Type: GrantFiled: January 24, 2017Date of Patent: November 13, 2018Assignee: Corning Optical Communications, LLCInventors: Terry Lee Cooke, David Lee Dean, Jr., Tory Allen Klavuhn, Juan Garcia Martinez, Elmer Mariano Juarez, Manuel Alejandro Lopez Sanchez, Juan Miguel Gonzalez Covarrubias
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Patent number: 10126512Abstract: The present disclosure relates to an integrated chip having differential coupling elements that couple electromagnetic radiation having a frequency outside of the visible spectrum between a silicon substrate and a dielectric waveguide overlying the silicon substrate. In some embodiments, the integrated chip has a dielectric waveguide disposed within an inter-level dielectric (ILD) material overlying a semiconductor substrate. A differential driver circuit generates a differential signal having a first transmission signal component at a first output node and a complementary second transmission signal component at a second output node. A first transmission electrode located along a first side of the dielectric waveguide receives the first transmission signal component from the first output node, and a second transmission electrode located along a second side of the dielectric waveguide receives the complementary second transmission signal component from the second output node.Type: GrantFiled: April 22, 2015Date of Patent: November 13, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chewn-Pu Jou, Tien-I Bao
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Patent number: 10120139Abstract: Disclosed is a fiber inserting apparatus comprising: a fiber clamp; a ferrule clamp opposite to the fiber clamp; and a clamp control controlling relative movement of the fiber clamp and the ferrule clamp on the rails, wherein a fiber inserting operation is performed based on the relative movement towards each other between the fiber clamp and the ferrule clamp. The fiber inserting apparatus may further comprise a straightening section comprising a chamber, elongated slots extending in a fiber inserting direction, a first drive for driving the chamber in a first direction so that the elongated slots move close to and away from the end of the bare fiber, and a second drive driving the chamber to move backwards and forwards in the fiber inserting direction, wherein the elongated slots are in communication with the chamber and a pressure in the chamber is smaller than that in the elongated slots when inserting the fiber.Type: GrantFiled: September 1, 2014Date of Patent: November 6, 2018Assignee: ADC Telecommunications (Shanghai) Distribution Co., Ltd.Inventors: Hang Lee, Zongshen Leng, Yongjun Yuan, Chuanwu Chen
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Patent number: 10120153Abstract: Fiber optic equipment that supports independently translatable fiber optic modules and/or fiber optic equipment trays containing one or more fiber optic modules is disclosed. In some embodiments, one or more fiber optic modules are disposed in a plurality of independently translatable fiber optic equipment trays which are received in a tray guide system. In this manner, each fiber optic equipment tray is independently translatable within the guide system. One or more fiber optic modules may also be disposed in one or more module guides disposed in the fiber optic equipment trays to allow each fiber optic module to translate independently of other fiber optic modules in the same fiber optic equipment tray. In other embodiments, a plurality of fiber optic modules are disposed in a module guide system disposed in the fiber optic equipment that translate independently of other fiber optic modules disposed within the module guide system.Type: GrantFiled: January 23, 2017Date of Patent: November 6, 2018Assignee: Corning Optical Communications, LLCInventors: Terry Lee Cooke, David Lee Dean, Jr., Tory Allen Klavuhn, Juan Garcia Martinez, Elmer Mariano Juarez, Manuel Alejandro Lopez Sanchez, Juan Miguel Gonzalez Covarrubias