Abstract: An optical modulation apparatus includes an optical modulation unit that includes a plurality of ring optical modulators which are coupled in cascade to each other and the ring optical waveguides of which have round-trip lengths different from each other, and a controller that performs, for at least one of the ring optical modulators, first resonance wavelength adjustment control to adjust the resonance wavelength of the ring optical modulator to one input light wavelength, performs second resonance wavelength adjustment control to specify the ring optical modulator that exhibits a minimum current amount required for the adjustment of the resonance wavelength of the ring optical waveguide to the one input light wavelength from among the ring optical modulators and adjust the resonance wavelength of the specified ring optical modulator to the one input light wavelength, and performs modulation driving control for the specified ring optical modulator.

Abstract: A light emitting assembly, a backlight module having the light emitting assembly, and a liquid crystal display (LCD) apparatus having the backlight module are provided. The light emitting assembly includes a rigid circuit board, a plurality of light emitting diode (LED) devices, and a flexible circuit board. The rigid circuit board has a plurality of external circuits isolated from one another. The LED devices are disposed on the rigid circuit board, and each of the external circuits is connected to a corresponding one of the LED devices. The flexible circuit board has a plurality of connecting lines, and each of the connecting lines is connected to at least two of the external circuits, so as to serially connect the LED devices that are connected to the external circuits.

Abstract: A high-order polarization conversion device configured of a planar optical waveguide, includes: a substrate; a lower clad disposed on the substrate; a core including a lower core and an upper core, the lower core being disposed on the lower clad and having a fixed height in a rectangular sectional shape, the upper core being formed of the same material as the lower core and having a fixed height in a rectangular sectional shape that is disposed continuously on the lower core; and an upper clad that is disposed on the core and the lower clad and is formed of the same material as the lower clad. The high-order polarization conversion device performs high-order polarization conversion between TE1 of the start portion and TM0 of the end portion.

Abstract: A cable that includes a first optical fiber in a center, a first layer with a plurality of metal wires and a stainless steel tube surrounding the first optical fiber, a second optical fiber inside the stainless steel tube, and a second layer with a plurality of metal wires surrounding the first layer, wherein the first optical fiber is directly exposed to the outside environment.

Abstract: Provided are a slimmer liquid crystal display (LCD) and a display apparatus set having the same. The LCD includes: a liquid crystal panel having sides; a light guide plate (LGP) which is overlapped by the liquid crystal panel; a container accommodating the LGP; a printed circuit board (PCB) which is disposed between the LGP and a sidewall of the container along one of the sides of the liquid crystal panel, and which is configured to provide an image signal to the liquid crystal panel; and a light source which is disposed between the LGP and a sidewall of the container along another one of the sides of the liquid crystal panel, and which is configured to provide light to the liquid crystal panel.

Abstract: The invention relates to a fiber optic measuring apparatus and a related method which includes a number of sensors which are integrated in a cable and detect a mechanical load, a temperature and/or corrosive gases, characterized in that the sensors are supplied with light from a source and the sensors form a fiber optic network.

Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a III-V material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermitically seals the chip in the platform.

Abstract: Apparatus including: an optical waveguide bundle including a plurality of optical waveguides substantially aligned along a waveguide bundle axis, each optical waveguide having a longitudinal core configured to transmit light; a plurality of the optical waveguides each including a Bragg reflector, the Bragg reflectors configured to couple light incident from a direction substantially transverse to the waveguide bundle axis into the optical waveguides in a propagating mode in the longitudinal cores; and each of a plurality of longitudinal cores being in optical communication with an optical detector configured to detect light transmitted in the longitudinal cores.

Abstract: The present invention provides a multi-channel transceiver module comprising a unitary housing having a first channel body and a second channel body. Each channel body includes a male plug end and a receptacle plug end. A bridge member is provided for joining the first and second bodies. The bridge members disposed at the receptacle end. A gap is provided between the plug ends of each channel body. The gap extends from each plug end to the bridge member to partially divide each channel so that each plug end is insertable within a separate receptacle cage.

Abstract: A cable that includes a first optical fiber in a center, a first layer with a plurality of metal wires and a stainless steel tube surrounding the first optical fiber, a second optical fiber inside the stainless steel tube, and a second layer with a plurality of metal wires surrounding the first layer, wherein the first optical fiber is directly exposed to the outside environment.

Abstract: A method and apparatus for controlled displacement, rotation and deformation of parts of a fiber optic collimator so as to provide multiple degrees of adjustment freedom that are decoupled one from another, for adjusting the path of a light beam, comprising: an output elongate hollow node for passing a light beam therethrough and towards a lens, and an elongate hollow base node having separate top and bottom parts connected to each other by opposed ends of a plurality of flexible rods that restrict the relative movement between the top and bottom parts of the base node to substantially only translational parallel movement. Opposed portions of the top and bottom parts of the base node each include a respective screw and an opposed slanted surface, which upon interaction, develop a shearing force which is applied to the top and bottom parts of the base node and cause a translational parallel relative movement therebetween.

Abstract: Disclosed is a liquid-crystal display device comprising a polarizing plate comprising a polarizing element and a thermoplastic-resin film which comprises a lactone ring-having polymer and satisfies the following formulas (I) and (II): (I) 0=|Re(630)|=10, and |Rth(630)|=25 (II) |Re(400)?Re(700)|=10, and |Rth(400)?Rth(700)|=35 wherein Re(?) means retardation (nm) in plane at a wavelength ? nm; and Re(?) means retardation (nm) along the thickness direction at a wavelength ? nm.

Abstract: The present invention relates to an optical waveguide comprising a lower cladding layer, a patternized core layer and an upper cladding layer, wherein a striking part for positioning is provided in one end part thereof, and an optical path turning mirror face is formed in a position different from a striking part-forming end part in the above core layer. Capable of being provided are an optical waveguide and an optoelectronic circuit board each having a simple configuration in which an optical device is not mounted on an optical wiring part or an optoelectronic composite wiring part and capable of connecting an optical device with a core of an optical waveguide in an optical wiring part (optical waveguide) or an optoelectronic composite wiring part (optoelectronic circuit board) at a high position accuracy and an optical module comprising an optical waveguide or an optoelectronic circuit board and a connector.

Abstract: Disclosed is a liquid-crystal display device comprising a polarizing plate comprising a polarizing element and a thermoplastic-resin film which comprises a lactone ring-having polymer and satisfies the following formulas (I) and (II): (I) 0=|Re(630)|=10, and |Rth(630)|=25 (II) |Re(400)?Re(700)|=10, and |Rth(400)?Rth(700)|=35 wherein Re(?) means retardation (nm) in plane at a wavelength ? nm; and Re(?) means retardation (nm) along the thickness direction at a wavelength ? nm.

Abstract: A waterproof user interface panel includes an electronic display assembly having a touch or presence-sensitive surface.

Abstract: An optical printed circuit board is provided. The optical printed circuit board includes an insulation member, an optical fiber disposed in the insulation member and having opposite end portions exposed to a side of the insulation member, and at least one supporting member provided with a guide portion coupled to the opposite end portions of the optical fiber and guiding bending of the optical fiber.

Abstract: Methods of exposing conductive vias of semiconductor devices may comprise conformally forming a barrier material over conductive vias extending from a backside surface of a substrate. A self-planarizing isolation material may be formed over the barrier material. An exposed surface of the self-planarizing isolation material may be substantially planar. A portion of the self-planarizing isolation material, a portion of the barrier material, and a portion of protruding material of the conductive vias may be removed to expose the conductive vias. Removal of the self-planarizing isolation material, the barrier material, and the conductive vias may be stopped after exposing at least one laterally extending portion of the barrier material.

Abstract: A semiconductor substrate includes a semiconductor chip and an interconnect substrate. The interconnect substrate has an interconnect region between a first main surface formed with plural orderly arranged first and second signal electrodes connected to the semiconductor chip, and a second main surface. The interconnect region has a core substrate, interconnect layers formed on both surfaces thereof, plural first through holes and plural first vias that pass through the interconnect layer on the side of the first main surface for forming impedance matching capacitances. Each first through hole is connected to a first signal interconnect at a position spaced part from the first signal electrode by a first interconnect length and each first via is connected to the second signal interconnect at a position spaced apart from the second signal electrode by a second interconnect length that is substantially equal with the first interconnect length.

Abstract: A liquid crystal display is provided that includes: a first substrate; a second substrate facing the first substrate; a switching element disposed on the first substrate; a pixel electrode connected to the switching element; a common electrode disposed on the second substrate; a liquid crystal layer disposed between the first substrate and the second substrate; an alignment layer disposed on at least one of the pixel electrode and the common electrode; and alignment aids in at least one of the liquid crystal layer and the alignment layer. The pixel electrode includes a first cutout, the common electrode includes a second cutout, and the first cutout and the second cutout are alternately arranged.

Abstract: The amount of gold required for bonding a semiconductor die to an electronic package is reduced by using a sheet preform tack welded to the package prior to mounting the die. The preform, only slightly larger than a semiconductor die to be attached to the package, is placed in the die bond location and tack welded to the package at two spaced locations.