Patents Examined by Christopher Atkinson
  • Patent number: 6892795
    Abstract: A regenerator matrix for effecting the transfer of heat between two counter-flowing air streams separated in part by face seals. The matrix includes strips of material wound about an axis so as to provide a plurality of layers. The matrix also includes embossments located on at least some of the layers and providing interlayer spaces between at least some of the layers, such that the interlayer spaces extend through the matrix substantially parallel to the axis. The embossments have a uniform height and include primary and secondary embossments. The primary embossments extend substantially parallel to the axis to divide the interlayer spaces into gas passageways and substantially resist circumferential gas leakage between the gas passageways. The primary embossments are also for aligning with the face seals to prevent circumferential gas leakage between the two counter-flowing air streams, and are successively spaced so that at most two successive primary embossments will align with the face seals.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: May 17, 2005
    Assignee: AirXchange, Inc.
    Inventor: Donald F. Steele
  • Patent number: 6848500
    Abstract: The invention discloses an apparatus for reducing peak temperatures and thermal excursions, of semiconductor devices, particularly in pulsed power applications. The apparatus comprises thermally coupling Phase Change Material (PCM) to the dissipating semiconductor device. PCM absorbs heat and stays at a constant temperature during its phase change from solid to liquid. The PCM melting point is chosen so that it is just below the temperature the device would otherwise achieve. When the device approaches the maximum temperature, the PCM melts, drawing heat from the device and lowering the device's peak temperature. As the device stops dissipating, after its pulse period, the PCM material solidifies releasing the heat it absorbed. The apparatus lowers the peak temperature by absorbing heat when the device is dissipating.
    Type: Grant
    Filed: March 11, 1999
    Date of Patent: February 1, 2005
    Assignee: Skyworks Solutions, Inc.
    Inventors: Abdolreza Langari, Seyed Hassan Hashemi
  • Patent number: 6823931
    Abstract: A hydrogen gas cooled hydrogen storage element which includes a hydrogen storage alloy material in which hydrogen flow channels are provided. The flow channels provide pathways through the hydrogen storage material to allow for high speed hydrogen gas flow. A portion of the high speed hydrogen flow is stored within the storage material which releases its heat of hydride formation. The remainder of the hydrogen flows through the hydrogen storage material at a sufficient mass flow rate to remove the heat of hydride formation. The unit also includes an encapsulant to prevent any loose particles of the storage material from becoming entrained in the high flow rate hydrogen.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: November 30, 2004
    Assignee: Energy Conversion Devices, Inc.
    Inventors: Ned T. Stetson, Arthur Holland, Trevor Stephenson
  • Patent number: 6776220
    Abstract: Heat dissipating apparatus for use in dissipating heat produced by electronic components of a spacecraft. The heat dissipating apparatus comprises first and second radiator panels each having an outer panel faceskin 18 and inner panel faceskin. A heat pipe matrix is disposed between outer and inner panel faceskins of each radiator panel, and a honeycomb core is disposed between the inner and outer panel faceskins that surrounds the heat pipe matrix. A transverse panel interconnects the first and second radiator panels. A plurality of crossing heat pipes extend between and thermally couple to the heat pipe matrices of the first and second radiator panels. The plurality of crossing heat pipes extend outside the plane of the transverse panel.
    Type: Grant
    Filed: August 19, 1999
    Date of Patent: August 17, 2004
    Assignee: Space Systems/Loral, Inc
    Inventors: Lenny Low, Chris Goodman
  • Patent number: 6749013
    Abstract: A heat sink comprising (a) a plate-shaped heat pipe including an upper plate member and a lower plate member to form a hermetically sealed cavity, and a working fluid enclosed therein, and (b) at least one heat radiating fin integrally formed with the upper plate member on an outer surface of the upper plate member.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: June 15, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Masami Ikeda, Yuichi Kimura
  • Patent number: 6745825
    Abstract: A sealed plate type metallic heat pipe is disclosed having multiple independent through holes which run through the inside of the heat pipe. All of the through holes are connected in fluid communication at each end. A working fluid is disposed in the through holes and a wire or a wire mesh is disposed in at least one of the through holes.
    Type: Grant
    Filed: November 14, 2000
    Date of Patent: June 8, 2004
    Assignee: Fujitsu Limited
    Inventors: Yoshio Nakamura, Jun Niekawa, Hisao Enomoto, Yasushi Kojima, Naoya Yamazaki, Masahiro Mogi
  • Patent number: 6745830
    Abstract: A heat pipe loop includes a first heat pipe section having a first temperature and a second heat pipe section having a second temperature higher than the first temperature. The first heat pipe section is a condenser and the second heat pipe section is an evaporator. A vapor line connects an upper portion of the first heat pipe section with an upper portion of the second heat pipe section. A liquid line connects a lower portion of the first heat pipe section with a lower portion of the second heat pipe section. In one embodiment, the first heat pipe section is disposed at a first elevation and the second heat pipe section is disposed at a second elevation higher than the first elevation. A pump directs liquid from the first heat pipe section to the second heat pipe section through the liquid line.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: June 8, 2004
    Inventor: Khanh Dinh
  • Patent number: 6745824
    Abstract: A heat dissipation device includes a heat sink (20), heat pipes (30), a frame (40), and a fan (50). Each heat pipe has a lower first connecting portion (32) and an upper second connecting portion (34). The heat sink includes a base (21), and parallel fins (27) attached on the base. The base includes a top plate (25), and defines a hermetically sealed chamber. Apertures (23) are defined in one side wall (22) of the base, the apertures receiving the first connecting portions. Through holes (29) are transversely defined through the fins, the through holes receiving the second connecting portions. The frame includes an upper plate (41), and two side plates (47). Two arms (49) of each side plate secures the frame on the heat sink. In operation, working liquid in the chamber transfers heat to the top plate and to the second connecting portions by phase transition.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: June 8, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Chun-Chi Chen, Winsan Peng
  • Patent number: 6745822
    Abstract: A regenerator 24 formed of concentric layers of regenerator foil 61 assembled with unbonded joints 68 and 70 inside a generally cylindrical space 74 and method of inserting and installing foil 60 using foil rolling apparatus 16 and foil installation apparatus 22 employing an inflatable bladder 94 to press foil 60 against the wall of generally cylindrical space 74.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: June 8, 2004
    Inventor: Matthew P. Mitchell
  • Patent number: 6739386
    Abstract: A heat exchanger including a core having a plurality of flat tubes with fins between adjacent tubes, the tubes each having flat side walls connected by front and rear walls defining a flow path, all of the walls extending longitudinally between opposite tube ends with the tube side walls defining a first height. First tube end portions in the tube ends of a plurality of the plurality of flat tubes include flat side walls flared apart to define a second height greater than the first height. Second tube end portions in the tube ends of the plurality of the plurality of flat tubes include a longitudinally extending cut through the front and rear walls with the flat side walls flared apart to define a third height greater than the second height. The side walls of adjacent tubes are secured together at the tube ends, and headers connect to the tube front and rear walls at the first and second tube end portions whereby the headers communicate with the tube flow paths.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: May 25, 2004
    Assignee: Modine Manufacturing Company
    Inventors: Bernhard Lamich, Viktor Brost
  • Patent number: 6736201
    Abstract: The invention provides an improved heat exchanger and/or fluid mixing means which comprises a bonded stack of plates, the stack comprising at least one group of main perforated plates, wherein at least two adjacent plates of the group of main perforated plates have their perforations aligned in rows with continuous ribs between adjacent rows, and the adjacent plates are aligned whereby the rows of perforations in one plate overlap in the direction of the rows with the rows of perforations of an adjacent plate and the ribs of adjacent plates lie in correspondence with each other to provide discrete fluid channels extending across the plates, a channel corresponding to each row of perforations, the channels together forming one or more fluid passageways across the plates and the passageway(s) in the group of main perforated plates being separated from passageway(s) in any adjacent group of perforated plates by an intervening plate.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: May 18, 2004
    Assignee: Chart Heat Exchangers Limited
    Inventors: Brian Keith Watton, Keith Thomas Symonds, Steven Paul Symonds
  • Patent number: 6736200
    Abstract: The present invention provides a heat-exchanging method for an easily polymerizable compound which method effectively prevents polymerization in a heat exchanger to enable a long-term stable heat exchange when an easily polymerizable liquid compound (for example, acrylate ester) or an easily polymerizable compound-containing liquid (for example, aqueous acrylic acid solution) is heat-exchanged. A vertical spiral type heat exchanger with a fluid path space of not less than 6 mm is used as a heat exchanger to carry out the heat exchange under conditions where the average liquid flow rate is not less than 0.2 m/sec and where the liquid residence time is not more than 100 seconds.
    Type: Grant
    Filed: December 23, 2000
    Date of Patent: May 18, 2004
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Kazuto Okazaki, Yukihiro Matsumoto, Sei Nakahara, Hiroo Iwato
  • Patent number: 6732786
    Abstract: A heat dissipation device is mounted to an edge of a circuit board for removing heat from an electronic device mounted on the circuit board. The heat dissipation device includes a contact pad made of thermally conductive material and positioned on the electronic device. A top-and-bottom fan structure includes a casing defining an air passage in fluid communication with a front opening to which a heat sink is mounted and top and bottom openings to which top and bottom fans are respectively mounted. Heat pipes extend between the contact pad and the heat sink. Air is sucked into the casing by the fans and flows through the air passage to the heat sink for carrying heat away from the heat sink. The casing is mounted to an edge of the circuit board with the top and bottom fans respectively located above and below the circuit board. Side openings are defined in the casing for discharging air into upper and lower sides of the circuit board for simultaneously cooling the upper and lower sides of the circuit board.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: May 11, 2004
    Assignee: Taiwan TriGem Information Co., Ltd.
    Inventor: Kuo-Shao Lee
  • Patent number: 6729383
    Abstract: A pin array is connectively disposed between a surface region of a heat sink and a surface region of an entity to be cooled. Cooling fluid flows between the heat sink's surface region and the entity's surface region, the fluid flowing adjacent each surface region and through the space occupied by the pins, the fluid thereby being agitated by the pins. Frequent inventive practice attributes the pins with supportability of the entity. The pins can be made to be thermally nonconductive, the heat transfer thus being primarily founded on thermally convective principles involving the cooling fluid, the invention thus being effective in the absence of significant heat conduction from the entity to the heat sink. Typical inventive practice prescribes that a given array is patterned in an orderly fashion, all pins therein are parallel and each pin therein has the same cross-sectional geometry; however, there can be disparity between or among pins in any or all such respects.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: May 4, 2004
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Michael J. Cannell, Roger Cooley, Richard W. Garman, Geoffrey Green, Peter N. Harrison, Joseph D. Walters
  • Patent number: 6725912
    Abstract: A wind tunnel and a heat exchanger for use in the wind tunnel. The heat exchanger is a plate-fin type heat exchanger having at least one heat exchanger unit with an inflow end and an outflow end, and air flow section and a coolant flow section. The air flow section includes fins generally aligned with the air flow through the exchanger and the coolant flow section includes fins defining a coolant passageway.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: April 27, 2004
    Assignee: Aero Systems Engineering, Inc.
    Inventors: Thomas G. Moll, Carl E. Jauch, C. Lynn Marksberry
  • Patent number: 6725908
    Abstract: Among four plate 21 to 24 that make up a refrigerant container, an intermediate plate 22 in contact with a heat receiving plate 21 is so provided with semi-annular peripheral channels 221 that they surround a boiling area of a refrigerant and, at the same time, is provided with straight channels 222 extending from the peripheral channels 221 to the boiling area over substantially all around the circumference of the peripheral channels 221. According to this structure, even if the refrigerant container is used in a tilted position, a liquid refrigerant that has condensed completely is supplied to the boiling area through the straight channels 222 provided on the floor within the refrigerant container, after being stored in the lowest position of the refrigerant container through the peripheral channels 221 provided on the floor within the refrigerant container.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: April 27, 2004
    Assignee: Denso Corporation
    Inventor: Kazutaka Suzuki
  • Patent number: 6725906
    Abstract: The present heat dissipation device is provided with a fan frame and a blade structure. The fan frame includes an air inlet, an air outlet, and a curved portion. The air inlet has a non-circular indentation in the vicinity of the curved portion corresponding to the airflow passage. This indentation effectively increases the airflow amount and static pressure of the airflow expelled from the heat dissipation device.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: April 27, 2004
    Assignee: Delta Electronics Inc.
    Inventors: Tsu-Liang Lin, Bor Haw Chang, Yu-Hung Huang, Wen-Shi Huang
  • Patent number: 6722423
    Abstract: A highly efficient heat sink, comprised of a seat, a heat insulation plate, a heat conduction plate and heat dispersion plates. The heat insulation plate and the heat conduction plate are respectively extended from both ends of the seat, the heat insulation plates and heat conduction plate are each curved inward to form heat dispersion plates. An air conduction outlet is provided where the heat dispersion plate is respectively connected to the heat insulation plate and heat conduction plate, and an air vent is provided in the inner side to allow air circulation on each plane of the heat dispersion plate, the heat insulation plate and the conduction plate without heat accumulation inside the sink.
    Type: Grant
    Filed: September 12, 2000
    Date of Patent: April 20, 2004
    Inventor: Wen-Chen Wei
  • Patent number: 6719038
    Abstract: A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: April 13, 2004
    Assignee: Celestica International Inc.
    Inventors: John Bird, Ralph I. Larson, Lyne Doré North, Paul Bussiere, Amy Allen
  • Patent number: 6719039
    Abstract: A liquid-cooled heat sink is provided having a cooling housing including a peripheral side wall extending from the perimeter of a bottom wall and a lid sized to engage the peripheral side wall so as to form a chamber. A fluid inlet port and a fluid outlet port are defined through the lid, and disposed in fluid communication with the chamber. In one embodiment, a plurality of pins project outwardly from the bottom wall so as to be positioned within the chamber and arranged in a staggered pattern. The pins include an end that engages the undersurface of the lid. In an alternative embodiment, a corrugated fin having a plurality of corrugations is positioned within the chamber so that at least one of the corrugations engages the bottom wall and at least one of the corrugations engages the under surface of the lid.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: April 13, 2004
    Assignee: Thermal Corp.
    Inventors: Douglas P. Calaman, Matthew J. Connors