Abstract: An electromagnetic shielding and/or containing heatsink with venting capabilities, comprising a heatsink block, an aperture, and a thermal coupler, is disclosed. The heatsink comprises a thermally conductive material. The aperture is coupled to the heatsink block and allows a thermal carrier to pass from a first side of the heatsink block to a second side of the heatsink block. The aperture is sized to prevent at least a first electromagnetic frequency lower than a cutoff frequency from passing through the aperture. The thermal coupler is coupled to the heatsink block and couples the heatsink block to a heat source.

Abstract: A flat type heat pipe for mounting a heating power element, which is capable of forming an optionally shaped heat transferring path with high accuracy, which is of a thin type and to which fins are easily attached. The flat type heat pipe includes at least two aluminum plates substantially in parallel with each other and brazed to each other so as to form a heat transferring path therebetween. The flat type heat pipe also includes an operating liquid which fills the heat transferring path. Because the heat transferring path 25 is formed by means of press molding, punching, laser beam machining, or cutting various shapes of heat transferring paths can be formed finely and with high accuracy. The flexible flat type heat pipe can be made thin, which allows for a variety of uses. Grooves and wicks can be disposed in the heat transferring path, thereby improving the heat conductivity. Because the surface is flat, the fins can be easily attached thereto, thereby a satisfactory radiation effect can be obtained.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: The present invention provides an integrated cooling device employing heat pipes for cooling an electronic component and a method of manufacturing the same. In one embodiment, the integrated cooling device includes a plate couplable to and supportable by the electronic component. The plate has at least one channel therein that presents an enhanced surface area. The cooling device further includes a sealed heat pipe having a heat-receiving portion fitted within the channel such that the enhanced surface area in contact with the heat pipe experiences an increased thermal communication between the plate and the heat pipe. The heat pipe also has a heat-removing portion that is distal from the heat receiving portion. Inside the heat pipe, a fluid, initially located in the heat-receiving portion of the heat pipe as a liquid, receives heat and evaporates to form a vapor that travels to the heat-removing portion.

Abstract: A motor vehicle combined heat exchanger has a tube bank linked to two manifolds and divided into an oil cooler having tubes for oil, and a condenser having tubes for a cooling fluid. The two types of tubes are different and possess respective hydraulic diameters related by the following inequality: 0.8 mm2≦DHa×DHb≦3.00 mm2 where the hydraulic diameter (DH) of a tube is defined by the formula DH=4S/P, in which S designates the area of the internal cross-section of the tube (expressed in mm2) and P the internal perimeter, or “wet perimeter”, of the tube (expressed in mm).

Abstract: A heat-dissipating device for dissipating internal heat generated from the heat-dissipating device is provided. The heat-dissipating device includes a motor having a rotator and a stator for causing the rotator to rotate, and a fan connected with the rotator and having a hub having a slot and a plurality of holes thereon for rotating and dissipating the heat.

Abstract: The present invention provides an improved heat transfer surface. The improved heat transfer comprises: a surface covered with fin convolutions. The fin convolutions have fin tips extending from the surface. The fin tips have a first plurality of notches and a second plurality of notches wherein the first notches and the second notches are of different sizes.

Abstract: A geometrical streamline flow guiding and heat-dissipating structure is formed by a heat-transferring seat, a heat-dissipating device and a fan. The heat-transferring seat has at least one heat conductive surface for being connected to the heat source. The heat-transferring seat further has at least one heat-transferring seat for heat dissipation with the radiating surface. The radiating surface has a three dimensional form, i.e. one side of the radiating surface is higher than another side thereof so as to be beneficial to guide the airflow. The heat-transferring seat is covered with the heat-dissipating device having a shape matching with the bottom thereof. The heat-transferring seat is formed by many pieces or is formed by a continuous folded structure, or is formed integrally through die casting, forging or slitting. The heat-dissipating device is buckled to the heat source through a buckle; the heat-dissipating device is connected to the fan.

Abstract: Modular heat sinks utilizing heat pipes to provide a more uniform temperature distribution over a packaged integrated circuit and efficient heat sinking in either free or forced convection environments. The heat sinks utilize both horizontal and vertical heat pipes to transfer heat both horizontally and vertically in the heat sinks. Selection of the number of heat pipes used allows tailoring of the heat sink capabilities for different applications using the same fundamental assemblage of parts. Various embodiments are disclosed.

Abstract: The present invention provides an apparatus comprising a device and a means for heat transfer comprising a hydrofluoroether heat-transfer fluid wherein the heat transfer fluid is 3-ethoxy-perfluoro(2-methylhexane). Another embodiment of the present invention is a method therefor.

Abstract: A heat exchanger and method of assembly for an automotive vehicle includes at least one tube having an internal surface and an external surface, and a composition cladding having at least magnesium applied to the internal surface and external surface of the tube.

Abstract: A portable housing holds a quantity of ice and the melt water from the ice or cooled water or cooled liquid is circulated through a heat exchanger. A blower circulates air from the room through the heat exchanger and back into the room for cooling the room. The housing includes a relatively large chamber for holding the ice and a relatively smaller chamber in which the blower is disposed. Melt water from the ice, or cooled water or cooled liquid, is pumped through the heat exchanger and from the heat exchanger the liquid flows by gravity back to the ice and water chamber.

Abstract: A heat exchanger comprises a plurality of tubes layered with fins intervened between them, header pipes disposed on the end portions of the tubes, and side plates for holding the tube layer, wherein each of the side plates (8) is connected to a side plate insertion hole (10) formed on the header pipe (3) or (4) by inserting its end portion (82) into the side plate insertion hole and forming a taper on the end portion (82) of the side plate (8) to decrease a thickness toward the leading end (82a). The end portions (82) of the side plates (8) are tapered toward the leading ends to decrease a width, contact portions (81a) are formed on the side plate to contact with the outer surface of the header pipes (3), (4), and the contact portions are brazed with the outer surface of the header pipe. Further, a stopper means is formed on the end portions of the side plates to prevent the end portions of the side plates from coming out of the side plate insertion holes (10).

Abstract: A heat exchanger. The heat exchanger includes a first heat dissipation mechanism having a first heat dissipation capacity and a second heat dissipation having a second heat dissipation capacity. At least one heat transfer mechanism thermally couples the first heat dissipation mechanism and the second heat dissipation mechanism to a heat generating component. The heat transfer mechanism has a limited conductivity portion in the thermal path to either the first or the second heat dissipation mechanism.

Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices, and a radiator for radiating the heat of the boiled and vaporized refrigerant. The radiator has an inflow return chamber provided with a small-diameter opening having a diameter smaller than that of the inflow return chamber. The liquid refrigerant of the gas-liquid mixed refrigerant is dammed by the small-diameter opening of the inflow return chamber and the dammed liquid refrigerant is returned through a return passage to the refrigerant tank. Since the liquid refrigerant contained in the gas-liquid mixed refrigerant is suppressed from flowing by means of the small-diameter opening, the gaseous refrigerant can transfer heat directly to the walls of the radiating passages, so that the deterioration of the radiating performance can be prevented.

Abstract: According to the present invention, in an air conditioning apparatus setting a double laminar mode in which inside air and outside air are blown while being partitioned, when the maximum heating state (including the high heating capacity close to the maximum heating operation) is set, a warm air bypass door for introducing warm air directly into a foot opening portion, without being mixed into cool air, functions as a movable partition member for partitioning an air passage at a downstream side of a heating heat exchanger, into an inside air passage and an outside air passage. In this way, it is possible to downsize the air conditioning unit.

Abstract: Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.