Patents Examined by Christopher Atkinson
  • Patent number: 6637501
    Abstract: The present heat dissipation device is provided with a fan frame and a blade structure. The fan frame includes an air inlet, an air outlet, and a curved portion. The air inlet has a non-circular indentation in the vicinity of the curved portion corresponding to the airflow passage. This indentation effectively increases the airflow amount and static pressure of the airflow expelled from the heat dissipation device.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: October 28, 2003
    Assignee: Delta Electronics Inc.
    Inventors: Tsu-Liang Lin, Bor Haw Chang, Yu-Hung Huang, Wen-Shi Huang
  • Patent number: 6634417
    Abstract: A liquid receptacle for rapidly lowering the temperature of a liquid contained therein to a warm range suitable for human contact and maintaining the liquid in the warm range for an extended period of time includes an inner vessel with an open upper end and a closed lower end and a wall connecting the upper and lower end. An insulated outer shell is spaced from the inner vessel to define an interstitial chamber between the inner vessel and the outer shell. A phase change material occupies the chamber and regeneratively absorbs thermal energy from the liquid to cool the liquid and then releases the thermal energy back to the liquid to maintain the temperature of the liquid.
    Type: Grant
    Filed: April 6, 1998
    Date of Patent: October 21, 2003
    Inventor: J. Bruce Kolowich
  • Patent number: 6631754
    Abstract: Provided is a novel regenerative heat exchanger and a method for heating a gas in the heat exchanger. The regenerative heat exchanger features a chamber separated into a plurality of annular concentric spaces, including: a first, inner annular space defining a hot collection chamber; a second, outer annular space concentric to and around the first space defining a cold collection chamber; and a third annular space defining a heat exchange zone concentric to and between the first and second spaces. The heat exchange zone contains a particulate heat transfer material. The third space is supported on the inside by a concentrically disposed hot grid, and the external diameter of the third annular space is less than about double the internal diameter of the third annular space. The invention has particular applicability to the feeding of hot blast to a blast furnace in the iron making industry.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: October 14, 2003
    Assignee: L'Air Liquide Societe Anonyme a Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procedes Georges Claude
    Inventors: Marc Bremont, Karin Tynelius-Diez, Nicolas Perrin, Philippe Queille, Joël Pierre, Michel Poteau
  • Patent number: 6631755
    Abstract: A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase change material and is in contact with the heat pipe. When heat quantities generated by the system are greater than a predefined reasonable thermal target, heat in excess of the thermal target is temporarily absorbed into the heat storage through the melting of the PCM. When the heat quantities generated by the system are again less than the thermal target, the PCM re-freezes, releasing the stored heat to be dissipated normally.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: October 14, 2003
    Assignee: Compal Electronics, Inc.
    Inventors: Shao-Tsu Kung, Chen-Hua Liu
  • Patent number: 6626233
    Abstract: A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is connected to the top of the processor and power supply and has an s-bend to accommodate the differing heights of the processor and power supply. Heat from the higher heat generating processor may be transferred by the base and dissipated by the fins above the power supply.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: September 30, 2003
    Assignee: Thermal Corp.
    Inventor: Matthew Joseph Connors
  • Patent number: 6622780
    Abstract: In order to regenerate the heat exchanger material located in the various segments of a housing section (2) of a regenerative post-combustion device (1), air is heated in the combustion chamber (8) of this post-combustion device (1) by a burner (9), is directly removed from the combustion chamber (8), is adjusted to the desired regeneration air temperature using fresh air, and is returned to the inlet (4) of the thermal post-combustion device (1). The outlet (10) of the thermal post-combustion device (1) remains closed during this operation. The rotary distributor (5) of the thermal post-combustion device (1) rotates during this process which is continued until all segments of the heat exchanger material are heated to a temperature at which the contaminants absorbed by the heat exchanger materials are released and combusted in the combustion chamber (8).
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: September 23, 2003
    Assignee: Eisenmann Maschinenbau KG
    Inventor: Walter Pötzl
  • Patent number: 6622782
    Abstract: On a fastening element for securing a thermal conducting bag filed with liquid comprising a frame a number individual resilient tongues are attached. Such an arrangement obtains that a pad or bag filled with liquid securely can be positioned in the frame at the same time as the individually resilient tongues maintains the flexible characteristics of the pad filled with liquid.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: September 23, 2003
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventor: Ake Malhammar
  • Patent number: 6619384
    Abstract: A heat pipe having a woven-wire wick and a straight fine-wire wick is disclosed. The heat pipe can be easily manufactured and improve a thermal performance of the heat pipe. The heat pipe includes a pipe container; a straight fine-wire wick located in the pipe container, wherein the straight fine-wire wick has a porosity; a woven-wire wick having a plurality of groups of wires spirally woven to form a substantially cylindrical wick, for contacting the straight fine-wire wick to an inner wall of the pipe container, wherein when the woven-wire wick is forced radially and inwardly in order for the woven-wire wick to be inserted into the pipe container, the woven-wire wick has restoration forces in a radial and outward direction from axis of the woven-wire wick and is tightly contact with the inner wall of the pipe container, and wherein ends of the straight fine-wire wick and the woven-wire wick are fixed to ends of the pipe container.
    Type: Grant
    Filed: March 8, 2002
    Date of Patent: September 16, 2003
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seok-Hwan Moon, Ho Gyeong Yun, Gunn Hwang, Tae Goo Choy, Joong Moo Park
  • Patent number: 6598668
    Abstract: A top cover for an electronic equipment cabinets where the top cover is made of upper and lower synthetic resin panels which are welded at their edges to form an air chamber therebetween. The upper panel is domed while the lower panel has a corrugated like structure. Access ports are provided which may be sealed shut. Rain directing berms are also provided to direct rain to the corners of the cover and away from access doors to a sealed electronic equipment chamber in the cabinet. A lateral air and water exhaust duct extending the width of the cover is provided as a path for exhaust air from a heat exchanger which normally moves in one direction but under high wind conditions may move in the opposite direction and for allowing the passage of rain water from one side of the cabinet to the opposite side.
    Type: Grant
    Filed: April 12, 2000
    Date of Patent: July 29, 2003
    Assignee: Marconi Communications, Inc.
    Inventors: Michael R. Cosley, Julius C. Lockhart
  • Patent number: 6598664
    Abstract: A bypass seal for a rotary regenerative air preheater includes primary and secondary seal leaves that are joined at a single position longitudinally intermediate their first and second sends. The first end portion of the primary seal leaf extends longitudinally beyond the first end of the secondary seal leaf and the second end portion of the secondary seal leaf extends longitudinally beyond the second end of the primary seal leaf. When installed in the air preheater, the first end portion of the primary seal leaf of each bypass seal in one of the seal rings overlaps the second end portion of the secondary seal leaf of an adjacent bypass seal in the seal ring.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: July 29, 2003
    Assignee: Alstom (Switzerland) Ltd
    Inventors: Kurt M. Fierle, Robin B. Rhodes, Charles R. White
  • Patent number: 6578626
    Abstract: A liquid-cooled heat sink is provided having a cooling housing including a peripheral side wall extending from the perimeter of a bottom wall and a lid sized to engage the peripheral side wall so as to form a chamber. A fluid inlet port and a fluid outlet port are defined through the lid, and disposed in fluid communication with the chamber. In one embodiment, a plurality of pins project outwardly from the bottom wall so as to be positioned within the chamber and arranged in a staggered pattern. The pins include an end that engages the undersurface of the lid. In an alternative embodiment, a corrugated fin having a plurality of corrugations is positioned within the chamber so that at least one of the corrugations engages the bottom wall and at least one of the corrugations engages the under surface of the lid.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: June 17, 2003
    Assignee: Thermal Corp.
    Inventors: Douglas P. Calaman, Mathew J. Connors
  • Patent number: 6575230
    Abstract: According to the present invention, a cooling apparatus using boiling and condensing refrigerant, includes a fluid separating plate for separating a high-temperature fluid from a low-temperature fluid, a refrigerant tank disposed on the side of the high-temperature fluid from the fluid separating plate, a refrigerant sealed into the refrigerant tank, a pair of communication pipes, one end of which is communicated with the refrigerant tank hermetically, a condensing portion communicated with the other end of the communication pipes and disposed on the side of the low-temperature fluid from the fluid separating plate, and a heat insulating material as a high-temperature portion-side heat insulating material coated on the outer periphery of the high-temperature-side communication pipe. In this way, it is possible to suppress a heat conduction from a high-temperature portion (high-temperature air) to the high-temperature-side communication pipe.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: June 10, 2003
    Assignee: Denso Corporation
    Inventors: Shigeru Kadota, Kiyoshi Kawaguchi, Tetsuya Takeuti, Kazuo Kobayashi, Takahide Ohara, Masahiko Suzuki, Hajime Sugito, Junichi Semura
  • Patent number: 6554059
    Abstract: In a ceiling embedded type indoor unit for an air conditioner, an wind sound is reduced while preventing a beat sound of blowers with keeping a high air conditioning capacity. In the ceiling embedded type indoor unit provided with a U-shaped heat exchanger which is placed in a casing embedded in a ceiling and is constituted by two side portions and a bottom portion connecting the side portions at one end side, blowers arranged in an inner space of the heat exchanger, a decorative panel mounted to a lower surface of the casing and having two elongated air outlet ports in correspondence to the side portions of the heat exchanger and an air suction port formed between the air outlet ports, and a control apparatus, the control apparatus controls so that the number of rotation of the blower near a valley portion of the U-shaped heat exchanger becomes high and the number of rotation of the blower near the open end of the U-shaped heat exchanger becomes low.
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: April 29, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Yoshiki Hata, Takashi Sano, Shinichi Kosugi
  • Patent number: 6543523
    Abstract: To reduce noise caused by exhausted cooling air as well as to maintain a necessary amount of cooling air of a cooling fan. A cooling fan is positioned behind a radiator. A shroud surrounds an impeller coupled to a motor and a rotating shaft. The shroud has an inlet and an outlet in the shape of a bell mouth. The bell mouth shaped inlet has its front edge spaced from the rear surface of the radiator by a clearance D, and forms a space around its front peripheral edge. A space is formed via the space, and opens around the periphery of the shroud. The ratio A:B is 1:3 to 5, preferably approximately 1:4, where A denotes a difference between maximum and minimum diameters of the bell mouth shaped outlet of the shroud, and B notes a length of the shroud.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: April 8, 2003
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventor: Hiroaki Hasumi
  • Patent number: 6543520
    Abstract: An axial seal plate for an air preheater having a single, unitary structure including a sealing portion disposed intermediate first and second end portions extending orthogonally from the sealing portion. The axial seal plate does not including any welds for joining the end portions to the sealing portion.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: April 8, 2003
    Assignee: Alstom Power N.V.
    Inventors: James R. Larkin, Kevin J. O'Boyle, Michael Zakel
  • Patent number: 6530419
    Abstract: A cooling system for various electronic packages used in electronic equipment such as electronic computers, work stations, word processors, etc. and, particularly, a cooling system capable of efficiently cooling various electronic packages and, particularly, highly dense electronic packages used in electronic equipment without greatly limiting the freedom for designing the electronic equipment as a whole. The cooling system includes a heat radiator (40, 40′, 40″) installed in at least one independent holding portion formed in advance in a housing (30) of the electronic equipment, a heat conducting plate element (36) provided for at least one electronic package in said housing so as to receive heat therefrom, and a heat conducting passage element (38) laid down to conduct heat from the heat conducting plate element to a heat radiator.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: March 11, 2003
    Assignee: Fujitsu Limited
    Inventor: Masahiro Suzuki
  • Patent number: 6527045
    Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices, and a radiator for radiating the heat of the boiled and vaporized refrigerant. The radiator has an inflow return chamber provided with a small-diameter opening having a diameter smaller than that of the inflow return chamber. The liquid refrigerant of the gas-liquid mixed refrigerant is dammed by the small-diameter opening of the inflow return chamber and the dammed liquid refrigerant is returned through a return passage to the refrigerant tank. Since the liquid refrigerant contained in the gas-liquid mixed refrigerant is suppressed from flowing by means of the small-diameter opening, the gaseous refrigerant can transfer heat directly to the walls of the radiating passages, so that the deterioration of the radiating performance can be prevented.
    Type: Grant
    Filed: March 14, 1997
    Date of Patent: March 4, 2003
    Assignee: Denso Corporation
    Inventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki
  • Patent number: 6523605
    Abstract: There is disclosed a heat exchanger made of an aluminum alloy having a radiator part (10) and an oil cooler part (11) in combination and manufactured integrally by the brazing method, wherein a refrigerant tank (13) for covering and sealing the oil cooler part is made of an aluminum alloy, an aluminum alloy containing Si in an amount from more than 7.0 wt % to 12.0 wt %, Fe in an amount from more than 0.05 wt % to 0.5 wt %, Cu in an amount from more than 0.4 wt % to 8.0 wt %, Zn in an amount from more than 0.5 wt % to 10.0 wt %, and the balance of aluminum and inevitable impurities is used as a filler material of brazing sheets that are used for the oil cooler part and are brazed in the tank, and the refrigerant tank is assembled integrally with the radiator part and the oil cooler part by brazing with the brazing material.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: February 25, 2003
    Assignees: The Furukawa Electric Co., Ltd., Denso Corporation
    Inventors: Takeyoshi Doko, Koji Okada, Takeshi Iguchi, Takaaki Sakane, Yoshihiro Kinoshita, Taketoshi Toyama, Akira Uchikawa, Satoshi Nohira, Homare Koutate
  • Patent number: 6520249
    Abstract: High-temperature-side hydrogen storage alloy containers each containing a hydrogen storage alloy are disposed as a heat exchanging portion in high-temperature-side heat exchangers. Low-temperature waste-heat gas generated in a micro gas turbine is imported into the heat exchangers so that direct heat exchange is performed between the waste-heat gas and each of the alloy containers. On the other hand, low-temperature-side hydrogen storage alloy containers each containing a hydrogen storage alloy are disposed as a heat exchanging portion in low-temperature-side heat exchangers. The high-temperature-side alloy containers and the low-temperature-side alloy containers are connected to each other by hydrogen-travelling pipes. Cold heat generated in the low-temperature-side heat exchangers is supplied to a refrigeration output portion.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: February 18, 2003
    Assignee: The Japan Steel Works, Ltd.
    Inventors: Takashi Iwamoto, Hiroyuki Togo, Masamitsu Murai, Ritsu Miura, Koji Hattori, Harunobu Takeda
  • Patent number: 6516871
    Abstract: The thermal performance of the heat transfer element assemblies for rotary regenerative air preheaters is enhanced to provide a desired level of heat transfer and pressure drop with a reduced weight. The heat transfer plates in the assemblies have spaced apart dimples for maintaining plate spacing and oblique undulations with the undulations on adjacent plates preferably extending at opposite oblique angles. The dimples may be on every other plate and alternate between the two sides of the plates or they may be on every plate and all extend to the same side.
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: February 11, 2003
    Assignee: Alstom (Switzerland) Ltd.
    Inventors: Gary Foster Brown, Michael Ming-Ming Chen, Wayne S. Counterman, Donald J. Dugan, Scott Frederick Harting