Patents Examined by Christopher Horgan
  • Patent number: 5602363
    Abstract: A DIN rail mounted enclosure for a relay, electronic control, sensing or other such similar device having a single lever for rapid one-handed engagement or disengagement with a DIN rail. A component housing cover secures readily to a base which includes lip or hook capturing members on its bottom surface for engagement of standard DIN rail. A circuit board structure is incorporated for the mounting of a face plate panel and control member.
    Type: Grant
    Filed: September 7, 1993
    Date of Patent: February 11, 1997
    Assignee: Watlow/Winona, Inc.
    Inventor: Theodore T. Von Arx
  • Patent number: 5589664
    Abstract: An apparatus for containing electrical components for sensing or measuring magnetic fields includes a tubular member made of a ferrous material such as austenitic stainless steel or aluminum. The tubular member is capable of receiving electric components therein for measuring magnetic fields. A cap made of a non-ferrous metal is affixed to one end of the tubular member and the electrical components are placed within the tubular member in close proximity with the inner surface of the cap. The tubular member is positioned in proximity to a rotor shaft or the like to enable the electrical components therein to measure magnetic fields to sense the rate and/or direction of rotation.
    Type: Grant
    Filed: September 21, 1993
    Date of Patent: December 31, 1996
    Assignee: Temper Corporation
    Inventor: John E. Rode
  • Patent number: 5583318
    Abstract: A multi-layer structure for shielding electromagnetic energy in a data processing equipment enclosure. The multi-layer structure includes a first layer formed of a first material having a first set of electromagnetic properties and a textured surface and at least one further layer stacked behind the first layer and formed of at least one further material having a second set of electromagnetic properties, the second set of electromagnetic properties being different than the first set. The first and further layer are configured to absorb the electromagnetic energy and dissipate the energy as heat within the multi-layer structure.
    Type: Grant
    Filed: December 30, 1993
    Date of Patent: December 10, 1996
    Assignee: Lucent Technologies Inc.
    Inventor: Thomas A. Powell
  • Patent number: 5569876
    Abstract: A modular, stackable insulating structure for a very high-voltage coaxial cable comprises at least three interspaced insulating tubes accommodating an inner conductor and an outer conductor of the coaxial cable. A plurality of ribs extending essentially radially along the longitudinal axis of the structure provide the spacing between adjacent tubes. The ribs are disposed in an optimized manner such that relatively effective zig-zag insulating paths are created between the inner and the outer conductors. The structure comprises cooling means.The insulating structure may be used for the transmission of electromagnetic pulses (power peaks) at voltages in the order of megavolts with rise times in the order of picoseconds.
    Type: Grant
    Filed: May 17, 1993
    Date of Patent: October 29, 1996
    Inventor: Andrew S. Podgorski
  • Patent number: 5565656
    Abstract: The present invention provides enclosures for protecting equipment, particularly electrical equipment, from electromagnetic interference. The enclosure includes at least two EMI-shielding portions which, when assembled, at least partially enclose a piece of equipment to be shielded. The first EMI-shielding portion of the enclosure is provided with a first interlocking element. The first interlocking element is integrally formed with the first EMI-shielding portion. A second EMI-shielding portion of the enclosure includes a second integrally-formed interlocking element. The first and second interlocking elements connect the first and second EMI-shielding portions of the enclosure such that electromagnetic energy is not transferred through the connected first and second interlocking elements at a substantially greater rate than through the remaining portions of the enclosure.
    Type: Grant
    Filed: November 30, 1994
    Date of Patent: October 15, 1996
    Assignee: Lucent Technologies Inc.
    Inventor: Behzad D. Mottahed
  • Patent number: 5563375
    Abstract: An insulated electric wire for high-voltage direct current comprising a conductor having thereon an insulation layer including a polyethylene resin composition, and a sheath layer provided on the-outer periphery of the insulation layer. The sheath layer includes a flame retardant resin composition including a polyvinylchloride grafted polyolefin resin. The flame retardant resin composition contains either (i) a lead compound stabilizer and a hydrotalcite or (ii) a lead compound stabilizer and a phosphorous ester compound.
    Type: Grant
    Filed: March 5, 1993
    Date of Patent: October 8, 1996
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Hiroshi Hayami
  • Patent number: 5561265
    Abstract: A package is provided for an integrated circuit comprising a dielectric body enclosing the integrated circuit chip having a plurality of conductive terminal members extend through the dielectric body. The dielectric body includes a magnetic shielding layer for shielding electromagnetic radiation from the integrated circuit. The magnetic shielding layer comprises a material having a high magnetic permeability and a high resistivity, so that the dielectric body absorbs electromagnetic radiation at frequencies generated by the integrated circuit and thereby attenuates electromagnetic emissions from the integrated circuit. Suitable materials having a high dielectric constant and high magnetic permeability include ferrites. Conveniently a shielding layer of ferrimagnetic material comprising a ferrite plate may be applied to surfaces of a conventional plastic or ceramic packaging material.
    Type: Grant
    Filed: October 4, 1994
    Date of Patent: October 1, 1996
    Assignee: Northern Telecom Limited
    Inventors: Boris I. Livshits, Kevin E. Harpell
  • Patent number: 5559306
    Abstract: An electronic package having improved electrical properties in which a plastic Quad Flat Pack is provided with upper and lower metallic plates encased in the plastic body and overlapping at least a portion of the length of the encased portion of the leads whereby the self and mutual inductance of the package is reduced. A ceramic Quad Flat Pack is provided with metal plates attached to the mating surfaces of the ceramic cover component and the ceramic base component so that at least a portion of the enclosed portion of the leads which are electrically connected to the electronic component inside the components is overlapped on the top and bottom by the metallic plates.
    Type: Grant
    Filed: October 11, 1995
    Date of Patent: September 24, 1996
    Assignee: Olin Corporation
    Inventor: Deepak Mahulikar
  • Patent number: 5557074
    Abstract: A coaxial line assembly in a package which houses a high frequency element. The assembly includes a metal wall having a hole extending through the metal wall. The metal wall has a step at substantially an intermediate portion of the hole to define a smaller diameter, inner hole portion opened to the inside of the package and a larger diameter, outer hole portion opened to the outside of the package. A lead for transmitting a high frequency signal passes through the hole and is hermetically sealed in the outer hole portion by glass filled in the outer hole portion. A sealing plate closes an opening of the inner hole portion at the step, the lead extending through the sealing plate. The sealing plate is made of a dielectric material having a dielectric constant near to that of the glass and a melting point higher than that of the glass.
    Type: Grant
    Filed: December 8, 1994
    Date of Patent: September 17, 1996
    Assignees: Fujitsu Limited, Shinko Electric Industries Co., Ltd.
    Inventors: Takaharu Miyamoto, Fumio Miyagawa, Yoji Ohashi, Tamio Saito
  • Patent number: 5557064
    Abstract: A conformal shield (10) includes a conformal shield base (15), and a conductive layer (16). The conformal shield base (10) has a first conformable insulating material (12) having a characteristic softening point at a first temperature. A second conformable insulating material (14), which has a characteristic softening point at temperature higher than the first temperature, is overlaid on the first conformable insulating material (12). The conductive layer (16) is disposed on the conformal shield base (15) to form the shield (10).
    Type: Grant
    Filed: April 18, 1994
    Date of Patent: September 17, 1996
    Assignee: Motorola, Inc.
    Inventors: Ileana Isern-Flecha, Thomas J. Swirbel, Robert W. Pennisi, Danny E. Ross, Adolph Naujoks, Angelita Alarcon
  • Patent number: 5557063
    Abstract: Improved RF shielding is disclosed. The shielding provides a joint seal that can eliminate the soldering, and the screws and gaskets, otherwise required for securing RF shield caps and walls to reduce EMI. Conductive shield caps that can be simply snap fit against the groundplane are also disclosed.
    Type: Grant
    Filed: January 3, 1994
    Date of Patent: September 17, 1996
    Assignee: Lucent Technologies Inc.
    Inventor: Behzad D. Mottahed
  • Patent number: 5554823
    Abstract: A tantalum capacitor chip and lead terminals respectively connected to two electrodes of the chip are molded in resin. A portion of the lead terminal, not molded in the resin is bent at a tip side and at a base side. The resin is provided with a structure in which its upper half is longer than its lower half at both sides. The base side portion of the portion not molded in the resin, of each of the lead terminals is curved downward with a predetermined radius of curvature, and an inwardly bent portion is formed on the tip side of the base side curved portion of the protruding portion.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: September 10, 1996
    Assignee: Rohm Co., Ltd.
    Inventor: Miki Hasegawa
  • Patent number: 5554822
    Abstract: A sealable, latchable door assembly for use with a hand-held, portable electronic device that has a housing adapted to removably receive a memory card in a receiving chamber through an opening. The door assembly includes a door shaped and sized to removably cover and seal the opening in the housing to retain and protect the memory card. The door has an engaging face adapted to sealably engage the housing around the opening. A connecting member attached to the door is slidably mounted within the housing to allow the door assembly to be slid between an extended, disengaged position and a retracted position with the door in a closed, sealed position. A latch attached to the door is adapted to releasably engage the housing to secure the door in the closed, sealed position. A hinge connected between the door and the connecting member enables the door to be pivoted downward to an open position to allow uninhibited passage of the memory card through the opening in the housing.
    Type: Grant
    Filed: November 10, 1993
    Date of Patent: September 10, 1996
    Assignee: Intermec Corporation
    Inventors: David Gilpin, John M. Bishay
  • Patent number: 5554824
    Abstract: Plural kinds of metal wiring patterns on which a lid is to be put are formed on a package body. The wiring patterns connected to an IC chip are changed depending upon the size of the lid which is put on the package body. Either of an IC chip operated by a single power supply and an IC chip operated by positive and negative power supplies can be packaged without changing the wiring patterns in the package.
    Type: Grant
    Filed: December 30, 1992
    Date of Patent: September 10, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masahiro Ueda, Shuichi Matsue
  • Patent number: 5550323
    Abstract: In contrast to the conventional automated bonding system, an electronic device (10) is mounted within a surrounding ring frame (12, 14) of insulating material by means of a plurality of individually applied tapes or ribbons (16) of electrically conductive material. A protective coating (18) may be applied to the assembly after bonding.
    Type: Grant
    Filed: October 26, 1993
    Date of Patent: August 27, 1996
    Assignee: LSI Logic Corporation
    Inventor: Trevor C. Gainey
  • Patent number: 5548084
    Abstract: An electronic device (10) having a shielded housing (20) with an integrated light pipe (19 & 21) includes a substantially clear housing, a portion of which is arranged and constructed to form the integrated light pipe and plating (23), selectively applied to the substantially clear housing, to provide for effective electromagnetic interference shielding and to allow for sufficient light into the integrated light pipe.
    Type: Grant
    Filed: October 4, 1993
    Date of Patent: August 20, 1996
    Assignee: Motorola, Inc.
    Inventor: James L. Tracy
  • Patent number: 5548081
    Abstract: A duct for connecting an electrical device insulated with gas with a terminal location located in atmospheric air, the duct has a gas filled bushing insulator, at least one tubular field control electrode located inside the bushing insulator, at least one insulating tube having an end facing a potential-guiding region of the duct, the at least one field control electrode being formed by a conducting portion on the end of the at least one insulating tube, a bushing conductor around which the at least one insulating tube is arranged coaxially, the insulating tube having a ground potential-side end, and a holder which holds the insulating tube at the ground potential-side end outside a region loaded with high field intensity.
    Type: Grant
    Filed: November 30, 1993
    Date of Patent: August 20, 1996
    Assignee: Kommandidgesellschaft Ritz Messwandler GmbH & Co.
    Inventor: Peter Rost
  • Patent number: 5548087
    Abstract: Described is a plastic encapsulated electronic device having an integrated circuit unit, a lead frame and a plastic material encapsulating the IC unit and portions of the leads into a sealed package. Each of the leads includes an inner portion adjacent the IC unit, an outer portion laying in a different plane than the inner portion, and a central portion interconnecting the inner and the outer portions. The plastic enclosure is so formed that the outer portion of each lead, except for its lowermost flat surface and a short outermost section, is embedded in the plastic material. The bottom surface of the plastic enclosure is substantially coplanar with the lowermost flat surface of each lead. The short outermost portion of the outer lead portion extends beyond the plastic material for testing purposes. This arrangement provides for a robust encapsulation of the leads avoiding the prior problems of the prior art.
    Type: Grant
    Filed: May 7, 1993
    Date of Patent: August 20, 1996
    Assignee: AT&T Corp.
    Inventor: Donald W. Dahringer
  • Patent number: 5545847
    Abstract: A housing for a CATV circuit board has exterior cable pores and stations for connection to a circuit board. Flexible coaxial leads allow any port to be connected to selected one of a number of stations. The stations may be composed of a horizontal flexible lead and a vertical terminal for the circuit board. The position of the station may vary within a preset tolerance to facilitate connection to the circuit board. End sections may be provided at the ports and provided with means for separating or combining the RF and AC signals. A tray for seating in the housing and for receiving the circuit board may be shaped to ground the outer conductor from a station and forms also the ground for the circuit board.
    Type: Grant
    Filed: August 26, 1992
    Date of Patent: August 13, 1996
    Assignee: J. E.Thomas Specialties Limited
    Inventors: Kenneth W. Lynes, Zdenek Nepovim
  • Patent number: 5545850
    Abstract: There is provided a leadframe having a plurality of coplanar electrically conductive leads. At least one metallic guard is bonded to the leads with a dielectric layer disposed between the metallic guard and the leads. The metallic guard has good adhesion to a polymer molding resin such that when the leadframe structure is encased in a molding resin, delamination is minimized. By restricting delamination, the ingress of water and water soluble contaminants to an integrated circuit device is inhibited.
    Type: Grant
    Filed: January 13, 1995
    Date of Patent: August 13, 1996
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Paul R. Hoffman