Abstract: A DIN rail mounted enclosure for a relay, electronic control, sensing or other such similar device having a single lever for rapid one-handed engagement or disengagement with a DIN rail. A component housing cover secures readily to a base which includes lip or hook capturing members on its bottom surface for engagement of standard DIN rail. A circuit board structure is incorporated for the mounting of a face plate panel and control member.

Abstract: An apparatus for containing electrical components for sensing or measuring magnetic fields includes a tubular member made of a ferrous material such as austenitic stainless steel or aluminum. The tubular member is capable of receiving electric components therein for measuring magnetic fields. A cap made of a non-ferrous metal is affixed to one end of the tubular member and the electrical components are placed within the tubular member in close proximity with the inner surface of the cap. The tubular member is positioned in proximity to a rotor shaft or the like to enable the electrical components therein to measure magnetic fields to sense the rate and/or direction of rotation.

Abstract: A multi-layer structure for shielding electromagnetic energy in a data processing equipment enclosure. The multi-layer structure includes a first layer formed of a first material having a first set of electromagnetic properties and a textured surface and at least one further layer stacked behind the first layer and formed of at least one further material having a second set of electromagnetic properties, the second set of electromagnetic properties being different than the first set. The first and further layer are configured to absorb the electromagnetic energy and dissipate the energy as heat within the multi-layer structure.

Abstract: A modular, stackable insulating structure for a very high-voltage coaxial cable comprises at least three interspaced insulating tubes accommodating an inner conductor and an outer conductor of the coaxial cable. A plurality of ribs extending essentially radially along the longitudinal axis of the structure provide the spacing between adjacent tubes. The ribs are disposed in an optimized manner such that relatively effective zig-zag insulating paths are created between the inner and the outer conductors. The structure comprises cooling means.The insulating structure may be used for the transmission of electromagnetic pulses (power peaks) at voltages in the order of megavolts with rise times in the order of picoseconds.

Abstract: The present invention provides enclosures for protecting equipment, particularly electrical equipment, from electromagnetic interference. The enclosure includes at least two EMI-shielding portions which, when assembled, at least partially enclose a piece of equipment to be shielded. The first EMI-shielding portion of the enclosure is provided with a first interlocking element. The first interlocking element is integrally formed with the first EMI-shielding portion. A second EMI-shielding portion of the enclosure includes a second integrally-formed interlocking element. The first and second interlocking elements connect the first and second EMI-shielding portions of the enclosure such that electromagnetic energy is not transferred through the connected first and second interlocking elements at a substantially greater rate than through the remaining portions of the enclosure.

Abstract: An insulated electric wire for high-voltage direct current comprising a conductor having thereon an insulation layer including a polyethylene resin composition, and a sheath layer provided on the-outer periphery of the insulation layer. The sheath layer includes a flame retardant resin composition including a polyvinylchloride grafted polyolefin resin. The flame retardant resin composition contains either (i) a lead compound stabilizer and a hydrotalcite or (ii) a lead compound stabilizer and a phosphorous ester compound.

Abstract: A package is provided for an integrated circuit comprising a dielectric body enclosing the integrated circuit chip having a plurality of conductive terminal members extend through the dielectric body. The dielectric body includes a magnetic shielding layer for shielding electromagnetic radiation from the integrated circuit. The magnetic shielding layer comprises a material having a high magnetic permeability and a high resistivity, so that the dielectric body absorbs electromagnetic radiation at frequencies generated by the integrated circuit and thereby attenuates electromagnetic emissions from the integrated circuit. Suitable materials having a high dielectric constant and high magnetic permeability include ferrites. Conveniently a shielding layer of ferrimagnetic material comprising a ferrite plate may be applied to surfaces of a conventional plastic or ceramic packaging material.

Abstract: An electronic package having improved electrical properties in which a plastic Quad Flat Pack is provided with upper and lower metallic plates encased in the plastic body and overlapping at least a portion of the length of the encased portion of the leads whereby the self and mutual inductance of the package is reduced. A ceramic Quad Flat Pack is provided with metal plates attached to the mating surfaces of the ceramic cover component and the ceramic base component so that at least a portion of the enclosed portion of the leads which are electrically connected to the electronic component inside the components is overlapped on the top and bottom by the metallic plates.

Abstract: A conformal shield (10) includes a conformal shield base (15), and a conductive layer (16). The conformal shield base (10) has a first conformable insulating material (12) having a characteristic softening point at a first temperature. A second conformable insulating material (14), which has a characteristic softening point at temperature higher than the first temperature, is overlaid on the first conformable insulating material (12). The conductive layer (16) is disposed on the conformal shield base (15) to form the shield (10).

Abstract: A coaxial line assembly in a package which houses a high frequency element. The assembly includes a metal wall having a hole extending through the metal wall. The metal wall has a step at substantially an intermediate portion of the hole to define a smaller diameter, inner hole portion opened to the inside of the package and a larger diameter, outer hole portion opened to the outside of the package. A lead for transmitting a high frequency signal passes through the hole and is hermetically sealed in the outer hole portion by glass filled in the outer hole portion. A sealing plate closes an opening of the inner hole portion at the step, the lead extending through the sealing plate. The sealing plate is made of a dielectric material having a dielectric constant near to that of the glass and a melting point higher than that of the glass.

Abstract: Improved RF shielding is disclosed. The shielding provides a joint seal that can eliminate the soldering, and the screws and gaskets, otherwise required for securing RF shield caps and walls to reduce EMI. Conductive shield caps that can be simply snap fit against the groundplane are also disclosed.

Abstract: A tantalum capacitor chip and lead terminals respectively connected to two electrodes of the chip are molded in resin. A portion of the lead terminal, not molded in the resin is bent at a tip side and at a base side. The resin is provided with a structure in which its upper half is longer than its lower half at both sides. The base side portion of the portion not molded in the resin, of each of the lead terminals is curved downward with a predetermined radius of curvature, and an inwardly bent portion is formed on the tip side of the base side curved portion of the protruding portion.

Abstract: Plural kinds of metal wiring patterns on which a lid is to be put are formed on a package body. The wiring patterns connected to an IC chip are changed depending upon the size of the lid which is put on the package body. Either of an IC chip operated by a single power supply and an IC chip operated by positive and negative power supplies can be packaged without changing the wiring patterns in the package.

Abstract: A sealable, latchable door assembly for use with a hand-held, portable electronic device that has a housing adapted to removably receive a memory card in a receiving chamber through an opening. The door assembly includes a door shaped and sized to removably cover and seal the opening in the housing to retain and protect the memory card. The door has an engaging face adapted to sealably engage the housing around the opening. A connecting member attached to the door is slidably mounted within the housing to allow the door assembly to be slid between an extended, disengaged position and a retracted position with the door in a closed, sealed position. A latch attached to the door is adapted to releasably engage the housing to secure the door in the closed, sealed position. A hinge connected between the door and the connecting member enables the door to be pivoted downward to an open position to allow uninhibited passage of the memory card through the opening in the housing.

Abstract: In contrast to the conventional automated bonding system, an electronic device (10) is mounted within a surrounding ring frame (12, 14) of insulating material by means of a plurality of individually applied tapes or ribbons (16) of electrically conductive material. A protective coating (18) may be applied to the assembly after bonding.

Abstract: A duct for connecting an electrical device insulated with gas with a terminal location located in atmospheric air, the duct has a gas filled bushing insulator, at least one tubular field control electrode located inside the bushing insulator, at least one insulating tube having an end facing a potential-guiding region of the duct, the at least one field control electrode being formed by a conducting portion on the end of the at least one insulating tube, a bushing conductor around which the at least one insulating tube is arranged coaxially, the insulating tube having a ground potential-side end, and a holder which holds the insulating tube at the ground potential-side end outside a region loaded with high field intensity.

Abstract: An electronic device (10) having a shielded housing (20) with an integrated light pipe (19 & 21) includes a substantially clear housing, a portion of which is arranged and constructed to form the integrated light pipe and plating (23), selectively applied to the substantially clear housing, to provide for effective electromagnetic interference shielding and to allow for sufficient light into the integrated light pipe.

Abstract: Described is a plastic encapsulated electronic device having an integrated circuit unit, a lead frame and a plastic material encapsulating the IC unit and portions of the leads into a sealed package. Each of the leads includes an inner portion adjacent the IC unit, an outer portion laying in a different plane than the inner portion, and a central portion interconnecting the inner and the outer portions. The plastic enclosure is so formed that the outer portion of each lead, except for its lowermost flat surface and a short outermost section, is embedded in the plastic material. The bottom surface of the plastic enclosure is substantially coplanar with the lowermost flat surface of each lead. The short outermost portion of the outer lead portion extends beyond the plastic material for testing purposes. This arrangement provides for a robust encapsulation of the leads avoiding the prior problems of the prior art.

Abstract: An electrical shielding chamber has six electrically conductive rigid walls in electrical contact with each other. A first wall forms a first door and a second wall forms a second door, each of which is selectively attachable to at least three other walls. The chamber is collapsible for forming a substantially flat package, and expandable for forming a substantially electrically-shielded compartment.

Abstract: There is provided a leadframe having a plurality of coplanar electrically conductive leads. At least one metallic guard is bonded to the leads with a dielectric layer disposed between the metallic guard and the leads. The metallic guard has good adhesion to a polymer molding resin such that when the leadframe structure is encased in a molding resin, delamination is minimized. By restricting delamination, the ingress of water and water soluble contaminants to an integrated circuit device is inhibited.