Patents Examined by Christopher Horgan
  • Patent number: 5483024
    Abstract: The invention discloses a high density semiconductor package. In one embodiment, two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.
    Type: Grant
    Filed: October 8, 1993
    Date of Patent: January 9, 1996
    Assignee: Texas Instruments Incorporated
    Inventors: Ernest J. Russell, Daniel A. Baudouin, Duy-Loan T. Le, James Wallace
  • Patent number: 5477008
    Abstract: There are provided polymer plugs for sealing the vent hole of an adhesively sealed electronic package. The polymer vent hole plug is selected to be either an ultraviolet curable polymer or a thermosetting polymer resin. One effective vent hole plug is a cylindrical plug having a diameter under 1.4 millimeters formed from a UV-curable epoxy.
    Type: Grant
    Filed: March 19, 1993
    Date of Patent: December 19, 1995
    Assignee: Olin Corporation
    Inventors: Anthony M. Pasqualoni, Deepak Mahulikar, Francis S. Jewell, Paul R. Hoffman, George Brathwaite, Richard McNabb, German Ramirez
  • Patent number: 5477009
    Abstract: A multichip electronic module comprising a base for holding various components and a lid for sealing the module, is temporarily closed by a reworkable seal made from a thermoplastic material. The seal is hermetic so that the module can be tested under ambient conditions approximating actual use. If the module fails the functional test, the lid is easily removed for repair. The thermoplastic material is located in a special grove near the periphery of the base or lid next to the mating surfaces which form part of a final seal for the module. After a module has been repaired, the lid is finally soldered or welded to the base using portions of these mating surfaces which are free of the thermoplastic material. There is no need to remove the thermoplastic material used for the temporary seal.
    Type: Grant
    Filed: March 21, 1994
    Date of Patent: December 19, 1995
    Assignee: Motorola, Inc.
    Inventors: Walter H. Brendecke, Kenneth H. Schmidt
  • Patent number: 5473110
    Abstract: A surface-compliant, removable and reusable EMI shielding cover for attenuating EMI emanation from openings in a shielding structure. An electrically conductive sheet or web is held over an opening in the shielding structure by an associated magnetic sheet, which is attracted to the metal shielding structure. The electrically conductive sheet or web, and the magnetic sheet are made of flexible material so that physical protrusions or non-planar surfaces on the shielding structure do not prevent the resulting EMI shielding cover from making complete contact around the periphery of an opening which is to be shielded. The conductive sheet and magnetic sheet can be made into a single composite EMI shield by applying an adhesive layer between the conductive sheet and the magnetic sheet.
    Type: Grant
    Filed: March 7, 1995
    Date of Patent: December 5, 1995
    Assignee: Unisys Corporation
    Inventor: Duane C. Johnson
  • Patent number: 5473112
    Abstract: A method is used to shield a data line in a first metal layer from electrical probe. A first shielding line is placed directly over the data line. The first shielding line is within a second metal layer which is above the first metal layer. In the preferred embodiment, a second shielding line is placed on a first side of the data line. The second shielding line is in the first metal layer. Also, a third shielding line is placed on a second side of the data line. The third shielding line is also in the first metal layer. Also in the preferred embodiment, the first shielding line, the second shielding line and the third shielding line are all connected to Vss.
    Type: Grant
    Filed: September 13, 1993
    Date of Patent: December 5, 1995
    Assignee: VLSI Technology, Inc.
    Inventor: Bryan C. Doi
  • Patent number: 5473109
    Abstract: An RF-shielding multicomponent metallic or metal-coated circuit housing (W, D) contains a printed circuit board (L), and a plug (S) which is connected to plug terminals (P) provided in the printed circuit board (L). A housing section (W) has a bay (E/B) which has metallic or metal-coated walls (B) which are at housing potential in the assembled state of the housing (W, D) and in which (E/B) the plug (S) is mounted. The bay (E/B) is open at one side face (M), the "open side face" (M), facing the inside (Q) of the housing, the bay (E/B) having edges (C) situated in a single plane and facing the open side face. The open side face (M) is covered by the printed circuit board (L) in the assembled state of the housing (W, D).
    Type: Grant
    Filed: April 22, 1993
    Date of Patent: December 5, 1995
    Assignee: Siemens Aktiengesellschaft
    Inventors: Christian Plankl, Robert Gruber, Josef Dirmeyer
  • Patent number: 5473111
    Abstract: An EMI protected enclosure and method of manufacture thereof. The enclosure is plastic and has an electromagnetic interference shield member disposed therein to protect the electronic parts or electronic equipment from electromagnetic interference. The electromagnetic interference shield member is exposed at the edges of the enclosure and can be formed into an electrical connector or otherwise connected to provide a ground for the enclosure. In the manufacturing method, the securing and shaping of the electromagnetic interference shield member by the closure of the molding dies eliminates the need for any pre-forming of the electromagnetic interference shield member.
    Type: Grant
    Filed: September 14, 1993
    Date of Patent: December 5, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshiyuki Hattori, Mutuo Hatayoshi
  • Patent number: 5471014
    Abstract: An electrical conductor (100) is provided that is insulated with at least one layer of fibrous material (16') and has free-flowing powdered mica (8) disposed about an electrical conductor (2'). Insulated conductor (100) combines high temperature resistance with flexibility and is preferably made by a fluidized bed and/or electrostatic deposition or spray process.
    Type: Grant
    Filed: March 24, 1993
    Date of Patent: November 28, 1995
    Inventor: Edward A. Green
  • Patent number: 5471011
    Abstract: A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.
    Type: Grant
    Filed: May 26, 1994
    Date of Patent: November 28, 1995
    Assignee: AK Technology, Inc.
    Inventor: William H. Maslakow
  • Patent number: 5468915
    Abstract: A fiberglass insulated conductor referenced by numeral (100) is provided for which at least one fiberglass layer (6') in close proximity to the electrical conductor (2) has been treated with a solution operative upon heat aging to render the treated fibers sufficiently frangible to break and eliminate stringing during the process of stripping the fiberglass from conductor (2). Another embodiment referenced by numeral (300) illustrates that one or both an electrically insulative tape or extruded layer (38) may be disposed intermediate the electrical conductor (36) and a surrounding fiberglass layer (40).
    Type: Grant
    Filed: March 24, 1993
    Date of Patent: November 21, 1995
    Inventor: Edward A. Green
  • Patent number: 5466885
    Abstract: Magnetically shielding structure in which by combining magnetically shielding members of various qualities with each other, its magnetically shielding capability is made to improve, and the greatly lower magnetic field than an externl one can be realized effectively. For this purpose, by providing a cylindrical magnetically shielding body made of a superconductive material manifesting Meissner effect and high permeability members of a predetermined sizes of various shapes, and by combining them variously with each other leaving spaces betwen them, magnetic inductions are made to generate in the high permeability members, and a penetrating magnetic field is made to be shorted magnetically.
    Type: Grant
    Filed: July 21, 1994
    Date of Patent: November 14, 1995
    Assignee: Furukawa Denki Kogyo Kabushiki Kaisha
    Inventor: Daiichi Irisawa
  • Patent number: 5466887
    Abstract: A resin-packaged electronic component is provided which comprises an electronic element enclosed in a thermosetting resin package having a mounting face. The resin package is provided with at least one stress concentrating portion extending substantially in parallel to the mounting face and contained in an imaginary plane extending between the electronic element and the mounting face.
    Type: Grant
    Filed: August 23, 1994
    Date of Patent: November 14, 1995
    Assignee: Rohm Co. Ltd.
    Inventor: Miki Hasegawa
  • Patent number: 5461196
    Abstract: A unitized integrally fused multilayer circuit package having a substrate, walls disposed on the substrate to form a central circuit package cavity, and circuit traces contained in the walls.
    Type: Grant
    Filed: December 2, 1992
    Date of Patent: October 24, 1995
    Assignee: Hughes Aircraft Company
    Inventors: Kathleen Virga, Terry Cisco, Joseph N. Owens, Craig Shoda
  • Patent number: 5455386
    Abstract: There is disclosed an adhesively sealed electronic package in which a compensation apparatus is provided for excess adhesive. As a result, excess adhesive does not extend beyond the package perimeter, squeeze-out, or travel along the inner lead fingers interfering with wire bonding. The compensation is a chamfer on the peripheral edges and/or interior edges of the package base component and cover component.
    Type: Grant
    Filed: January 14, 1994
    Date of Patent: October 3, 1995
    Assignee: Olin Corporation
    Inventors: George A. Brathwaite, German J. Ramirez, Michael A. Holmes, Paul R. Hoffman, Dexin Liang
  • Patent number: 5455663
    Abstract: An image forming apparatus includes a cylindrical image bearing member, an image forming device for forming an image on the image bearing member, a transfer unit for performing first image transfer of the image on the image bearing member to a recording material at a transfer position, and a movable recording material carrying unit for conveying the recording material to the transfer position while carrying the recording material in order to perform the first image transfer. The recording material carrying unit further carries and conveys the recording material in order to perform second image transfer to the recording material after the first image transfer. The apparatus also includes a conveying unit for conveying the recording material to the recording material carrying unit.
    Type: Grant
    Filed: June 21, 1994
    Date of Patent: October 3, 1995
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masahiro Inoue, Nobuhiko Takekoshi
  • Patent number: 5455384
    Abstract: A method of producing a high frequency module comprises the steps of connecting leads to a circuit board, covering the circuit board with an insulating member such that the leads protrude from the insulating member, cutting off portions of the leads protruding from the insulating member having been molded, forming a metal film on the entire periphery of the insulating member, and removing the metal film around the leads to thereby form electrodes which are separate from the other portions of the metal film. The metal film is formed by evaporation, spraying or plating while the portions of the metal film around the leads are removed by chemical etching or machining. Further, the leads are connected to the circuit board on the same surface as electronic parts. The circuit board is covered with the insulating member in a rectangular parallelepiped configuration. The electrodes individually extend from the sides where the leads are present to the surface contiguous with the sides.
    Type: Grant
    Filed: March 25, 1994
    Date of Patent: October 3, 1995
    Assignee: NEC Corporation
    Inventor: Masaki Ichihara
  • Patent number: 5455387
    Abstract: An electronic package with a semiconductor chip, a lead frame, a metal casing, and a redistribution interposer. The chip is mounted on the interposer and wirebonded to first ends of redistribution leads of the interposer. The redistribution leads have second ends orientated in a general flipped orientation relative to their corresponding first ends. The second ends are wirebonded to pads of the lead frame. The interposer allows smaller chips to be used in the package without changing the lead frame. The interposer also allows the chip to be flip-mounted in the package without changing the lead frame or casing, this allows redirection of the chip's thermal path.
    Type: Grant
    Filed: July 18, 1994
    Date of Patent: October 3, 1995
    Assignees: Olin Corporation, Cyrix Corporation, International Business Machines Corporation
    Inventors: Paul R. Hoffman, Keshav B. Prasad, Thomas Caulfield, Sean T. Crowley
  • Patent number: 5451716
    Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.
    Type: Grant
    Filed: September 9, 1994
    Date of Patent: September 19, 1995
    Assignee: Rohm Co., Ltd.
    Inventors: Miki Hasegawa, Yasuo Kanetake
  • Patent number: 5450178
    Abstract: In an image-forming apparatus, in which an electrostatic latent image on a photoconductive drum is developed by a toner accommodated in a container, a periodical exchange of carrier in a container is necessary. A method thereof includes steps of fitting a cartridge to the container, discharging all of an old mixture of toner and carrier from the container to the lower chamber, transferring fresh carrier from the carrier compartment into the container, and further, transferring fresh toner from the toner compartment into the container until a predetermined initial color density of the mixture is obtained.
    Type: Grant
    Filed: December 27, 1994
    Date of Patent: September 12, 1995
    Assignee: Fujitsu Limited
    Inventors: Masato Kawashima, Mamoru Watanabe, Masanao Nagakura, Hideyuki Nanba
  • Patent number: 5450184
    Abstract: A cleaning blade for electrophotography has a blade body having a rubbery elasticity and a coating layer covering the surface of the blade body. The coating layer is composed of lubricating particles and a binder resin having a lubricability and a wear resistance. The blade body extends parallel to an axis of the latent image support.
    Type: Grant
    Filed: October 22, 1993
    Date of Patent: September 12, 1995
    Assignee: Canon Kabushiki Kaisha
    Inventors: Noriyuki Yanai, Masahiro Watabe