Patents Examined by Christopher Horgan
-
Patent number: 5525758Abstract: A bus bar of a branch joint box, which is formed by punching a metal sheet into a preset pattern of a circuit and is formed, at a predetermined location of the circuit, with a tab to be plated with metal having excellent electrical conductivity such that a connector of a wiring harness is connected to the tab through plug-in, including a separate bus bar portion which is formed by punching a separate metal sheet and includes the tab; wherein after the tab of the separate bus bar portion has been plated with the metal, the separate bus bar portion is inserted into a predetermined portion of the bus bar so as to be mounted on the bus bar.Type: GrantFiled: May 17, 1993Date of Patent: June 11, 1996Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Kazunori Kurata
-
Patent number: 5522132Abstract: An improved surface mount package and method of making such a package is provided. A conventional surface mount package is modified by fabricating a U-shaped via around the lead via to form a quasi-coaxial transmission line through the insulating substrate. This permits the electrical impedance in the conductive elements of the surface mount package to be controlled to reduce insertion loss and return loss, and to improve isolation. The surface mount package includes a lead frame, and a gold plate to which an integrated circuit in the package is attached. The package is sealed with a ring-frame and a lid. Ground vias connecting the lead-frame to the plate through the substrate may also be included. The present package is designed by modelling the various elements of the package as a coaxial transmission line, a co-planar waveguide, and a single lead in a trough transmission line in combination.Type: GrantFiled: November 29, 1994Date of Patent: June 4, 1996Assignee: St Microwave Corp., Arizona OperationsInventor: Carmelo J. Mattei
-
High dielectric layer-containing alumina-based wiring substrate and package for semiconductor device
Patent number: 5521332Abstract: A package for a semiconductor device comprising (i) a high dielectric layer composed of an alumina particles, a high permittivity-imparting agent in particles selected from (a) W or Mo, (b) Re and (c) zirconia and a glass plase comprising alumina and at least one component selected from silica, alkaline earth metal components, and rare earth device components present in their grain boundaries, (ii) a pair of electrode layers comprising as a main component a metal selected from W and Mo provided on both sides of the high dielectric layer, and (iii) insulation layers composed of alumina particles and a glass phase composed of alumina and at least one component selected from silica, alkaline earth metal components and rare earth device components, the insulation layers being provided so as to sandwich the electrode layers and the dielectric layer.Type: GrantFiled: June 7, 1995Date of Patent: May 28, 1996Assignee: Kyocera CorporationInventors: Kunihide Shikata, Takeshi Kubota, Akira Furusawa -
Patent number: 5519168Abstract: A corrosion resistant electromagnetic interference shielding material for electronic enclosures is provided. The corrosion resistant composite material comprises a metallized, highly conductive porous polymeric material, laminated between two layers of corrosion resistant composite materials, incorporating ground lugs. The highly conductive material intercepts an electromagnetic interference signal and grounds the signal through the ground lugs provided in the outer composite shell. This invention is particularly useful where a lightweight, corrosion resistant electronic enclosure is required.Type: GrantFiled: October 12, 1993Date of Patent: May 21, 1996Inventor: William M. Owens
-
Patent number: 5519479Abstract: Image fixing device for use in electrophotographic apparatus, capable of suppressing gloss of fixed toner image, thus stably producing images of high quality and high level of fixing intensity over a long period of time. The fixing device has a fixing roller and a pressing roller which are contacted with each other and rotate to form therebetween a nip through which a paper supporting unfixed toner image is passed to have the toner image fixed to the paper. The fixing roller has a cylindrical core having fine irregularities formed on its surface and a surface layer made of a resin. The surface of the cylindrical core has a greater elastic modulus than that of the surface layer.Type: GrantFiled: August 22, 1995Date of Patent: May 21, 1996Assignees: Hitachi, Ltd., Hitachi Koki Co., Ltd.Inventors: Ryuuichi Shimizu, Tsuneaki Kawanishi, Toshiya Satoh, Teruaki Mitsuya, Takashi Suzuki
-
Patent number: 5514833Abstract: Normally a cathode ray monitor cannot be employed in a chamber which is shielded against high-frequency interference because of the disturbances in the otherwise shielded chamber produced by the operation of the cathode ray monitor. A display arrangement employing a cathode ray monitor is disclosed, which can be used in a shielded chamber, including a projection picture tube disposed outside of the shielded chamber, a projection disposed inside of the shielded chamber, and an optical imaging arrangement disposed in the beam path between the projection picture tube and the projection screen, the beam path extending through a light-transmissive port in a wall of the shielded chamber.Type: GrantFiled: May 6, 1994Date of Patent: May 7, 1996Assignee: Siemens AktiengesellschaftInventor: Rainer Kuth
-
Patent number: 5512709Abstract: A gasket is disclosed for shielding from electromagnetic emissions and interference (EMI) that exhibits excellent characteristics of recovery, bending, and tangential compression over a wide range of frequencies. The gasket includes a knitted core of monofilament synthetic polymer yarns, and a circular warp knitted sheath over the monofilament knitted core, with the sheath being sufficiently conductive to provide shielding from electromagnetic interference over a wide range of frequencies.Type: GrantFiled: August 23, 1994Date of Patent: April 30, 1996Inventors: Andrew D. Jencks, John DiGioia
-
Patent number: 5512710Abstract: A package is disclosed that incorporates recessed test vias into a circuit substrate. The test vias are preferably formed at the time of substrate manufacture with little additional cost and offer access to electrical test points after hermetic sealing of the package without competing for lead sites on an otherwise crowded package exterior. The vias are preferably recessed below the surface of the substrate and may be backfilled with insulation to prevent unintended contact. Alternatively, the vias may be incorporated into the side of a package used for mounting to a motherboard, in which case the vias will be sealed at the time of package mounting. In still another instances, the vias may be left accessible or filled with a material that is easily removed for later test and service.Type: GrantFiled: August 21, 1992Date of Patent: April 30, 1996Assignee: CTS CorporationInventor: Donald R. Schroeder
-
Patent number: 5510577Abstract: The invention disclosed herein is for an improved electrical connector assembly used on couplers and program modules in marine streamers used in offshore seismic exploration. In particular, the invention disclosed herein is comprised of a deformable seal ring with a plurality of holes formed therein through which pass individual conductor wires through which are transmitted signals from various hydrophones disposed along the marine streamer. Deformable nipples are disposed on each side of the seal disk 16 around each of the openings extending through the seal disk. The seal disk and nipples are deformed around the conductor wires passing through the openings in the seal disk through use of a compression disk and spring which provides dynamic spring loading of the seal disk-conductor wire interface, thereby maintaining the integrity of the seal established between those components.Type: GrantFiled: March 15, 1993Date of Patent: April 23, 1996Assignee: I/O Exploration Products (U.S.A.), Inc.Inventor: Michael A. Corrigan
-
Patent number: 5510575Abstract: A window wall for shielded enclosures is provided for use in a large opening in a shielded enclosure that preserves the shielding integrity of the shielded enclosure and that is easy to install. The window wall includes a frame having a frame perimeter received within a shielded enclosure window opening in electrical conductive engagement with the shielded enclosure. The frame includes a selected number of horizontal muntins and vertical mullions defining a plurality of clear window openings. A window unit frame is received in each clear window opening supported by and electrically connected to the frame. A pair of spaced apart radio frequency shielding continuous screens span each window opening and are supported by the window unit frame. Each screen is formed of electrically conductive mesh material and is mechanically and electrically connected with the window unit frame, thereby providing continuous electrical contact with the shielded enclosure.Type: GrantFiled: November 26, 1993Date of Patent: April 23, 1996Assignee: The Curran CompanyInventor: Joseph C. Weibler
-
Patent number: 5510578Abstract: A cable assembly for connection between an audio amplifier and a loudspeaker in which a plurality of insulated electrical signal-conducting wires, or conductors are bundled together. The conductors are formed into two groups, one of which is connected between the positive terminals of the amplifier and the loudspeaker and the other of which is connected between the negative terminals of the amplifier and loudspeaker. The number of conductors and the diameter of each conductor is chosen and the design is such that the characteristic impedance of the cable assembly is within the range of the impedance of the loudspeaker. As a result a significant reduction in ringing and/or blurring of complex musical transient signals caused by reflections attributable to the mismatch between the characteristic impedance of the cable and the input impedance of the loudspeaker is achieved.Type: GrantFiled: June 30, 1995Date of Patent: April 23, 1996Inventor: John H. Dunlavy
-
Patent number: 5510878Abstract: The present invention is characterized by an image bearing member, a toner carrying member for directing toner to the image bearing member and a magnet disposed within the toner carrying member, and in that the image bearing member and the magnet are positioned by a common positioning member. With above construction, it is possible to provide a process cartridge and an image forming system, which can remarkably the accuracy of attachment positions of an image bearing member and a magnet, thus remarkably enhancing the image quality.Type: GrantFiled: April 4, 1995Date of Patent: April 23, 1996Assignee: Canon Kabushiki KaishaInventors: Shinya Noda, Kazumi Sekine, Tadayuki Tsuda, Isao Ikemoto, Kazushi Watanabe, Yoshikazu Sasago, Kazunori Kobayashi, Shinichi Sasaki
-
Patent number: 5510574Abstract: An electric shielding metal shell having two symmetrical rectangular-shaped metal casings connected together to hold a receptacle and an electric wire covered within a braided earthed robe, so that the braided earthed robe with the electric wire extends out of said metal casings through a wire hole in the metal casings. The metal casings each have a respective unitary, open loop-like binding strip extending around the wire hole in either direction that are connected to each other to hold the braided earthed tube and the electric wire. The tail of either binding strip is inserted into a locating hole on the opposite binding strip and the hook of either binding strip is received in one of a series of retaining holes on the opposite binding strip.Type: GrantFiled: January 6, 1994Date of Patent: April 23, 1996Assignee: Hsing Chau Industrial Co., Ltd.Inventor: Peter Wu
-
Patent number: 5508138Abstract: Image fixing device for use in electrophotographic apparatus, capable of suppressing gloss of fixed toner image, thus stably producing images of high quality and high level of fixing intensity over a long period of time. The fixing device has a fixing roller and a pressing roller which are contacted with each other and rotate to form therebetween a nip through which a paper supporting unfixed toner image is passed to have the toner image fixed to the paper. The fixing roller has a cylindrical core having fine irregularities formed on its surface and a surface layer made of a resin. The surface of the cylindrical core has a greater elastic modulus than that of the surface layer.Type: GrantFiled: September 28, 1994Date of Patent: April 16, 1996Assignees: Hitachi, Ltd., Hitachi Koki Co., Ltd.Inventors: Ryuuichi Shimizu, Tsuneaki Kawanishi, Toshiya Satoh, Teruaki Mitsuya, Takashi Suzuki
-
Patent number: 5506373Abstract: In a preferred embodiment, an enclosure for an electronic module containing an electronic component having upper and lower surfaces, the enclosure including: a top cover shield overlying, and substantially covering, in closely spaced relationship, the upper surface of the electronic component; a bottom cover shield underlying, and substantially covering, in closely spaced relationship, the lower surface of the electronic component; and the top and bottom cover shields being cojoined so as to substantially enclose the electronic component.Type: GrantFiled: July 9, 1993Date of Patent: April 9, 1996Assignee: Magnavox Electronic Systems CompanyInventor: Arden L. Hoffman
-
Patent number: 5504272Abstract: An image forming method in which a toner-carrying member for carrying a specific magnetic toner is placed adjacent a latent image-bearing member for carrying an electrostatic latent image so as to form a developing region of a predetermined gap size. The magnetic toner on the toner-carrying member forms a toner layer of a regulated thickness smaller than the above-mentioned gap. An asymmetric bias is applied to the magnetic toner so as to cause the magnetic toner from the toner-carrying member to be conveyed to the latent image-bearing member thereby to develop the electrostatic latent image.Type: GrantFiled: May 20, 1994Date of Patent: April 2, 1996Assignee: Canon Kabushiki KaishaInventors: Masaki Uchiyama, Hirohide Tanikawa, Yasutaka Akashi, Masaaki Taya, Makoto Unno
-
Patent number: 5502287Abstract: This invention relates to multi-component assemblies comprising a plurality of substantially parallel insulated conductors and or cables at least one of which is wrapped in a flexible affixment means thereby enabling the wrapped component to be secured to a support substrate.Type: GrantFiled: March 10, 1993Date of Patent: March 26, 1996Assignee: Raychem CorporationInventor: Phu D. Nguyen
-
Patent number: 5496967Abstract: A package for holding at least one integrated circuit (IC) chip includes an IC chip, a lead frame, and a ceramic relay substrate with a wiring pattern. Respective portions of the wiring pattern are connected to the IC chip and the lead frame by respective bonding wires. The substrate includes at least one green tape with at least part of the wiring pattern thereon, and formed by printing a metal paste on the green tape and then firing it. An opening may be provided in the green tape to receive the IC chip. The assembly, which includes the IC chip, the substrate, and part of the leads of the lead frame, is sealed in a resin molding using a molding technique.Type: GrantFiled: December 28, 1993Date of Patent: March 5, 1996Assignee: Kabushiki Kaisha Sumitomo Kinzoku CeramicsInventors: Shizuki Hashimoto, Nobuhiro Nishijima
-
Patent number: 5484959Abstract: The present invention provides a method and apparatus for fabricating thermally and electrically improved electronic integrated circuits by laminating one or more lead frames to a standard integrated circuit package such as, for example, thin small outline package (TSOP). The lead frame laminated to the package enhances thermal conduction of heat from the integrated circuit package. A heat spreader may also be utilized to improve heat transfer and can be further used as a ground plane to improve signal quality by reducing electrical circuit noise. Achieving improved thermal transfer characteristics from an integrated circuit package results in better dissipation of heat from the integrated circuit package and results in more reliable operation thereby. Using standard commercially available integrated circuit packages such as TSOP allows economical and rapid fabrication of thermally and electrically superior electronic circuits for applications that demand high reliability and performance.Type: GrantFiled: December 11, 1992Date of Patent: January 16, 1996Assignee: Staktek CorporationInventor: Carmen D. Burns
-
Patent number: 5483024Abstract: The invention discloses a high density semiconductor package. In one embodiment, two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.Type: GrantFiled: October 8, 1993Date of Patent: January 9, 1996Assignee: Texas Instruments IncorporatedInventors: Ernest J. Russell, Daniel A. Baudouin, Duy-Loan T. Le, James Wallace