Abstract: A method of controlling an air blowing apparatus includes: determining whether there is precipitation through a rain sensor by a controller; determining whether the air blowing apparatus is in an automatic mode in a precipitation condition by the controller; determining a vehicle speed when the air blowing apparatus is in the automatic mode in the precipitation condition; and setting power and a spray angle of the air blowing apparatus by comparing a rainfall received from the rain sensor to a stored rainfall by the controller. Setting the power and the spray angle of the air blowing apparatus includes compensating the spray angle and a spray amount by measuring a flow speed and a flow angle of rainwater through the rain sensor by the controller.

Abstract: A method for the surface treatment of flat products made of aluminium alloys. The method includes pickling the flat product, in particular for degreasing the flat product. The method includes carrying out a colour measurement on the surface of the flat product to determine at least one measured colour value after pickling the flat product. The method includes generating output information on the basis of the at least one measured colour value. The output information is indicative of compliance with at least one rule for the measured colour value and outputting or triggering the output of the output information. The invention further relates to a device for the surface treatment of flat products made of aluminium alloys and to a use of a colorimeter which is configured to determine at least one measured colour value in a surface treatment of flat products made of aluminium alloys.

Abstract: Systems and methods for rinsing beverage residue from a mechanical interface between threads of a bottle and threads of a bottle cap is described. The bottle cap may include a sealable coating to create a seal against a rim of the bottle. The bottle cap may also include passages to allow pressurized water to be injected into an upper inner region of the bottle cap. The pressurized water is prevented from entering the bottle due to the seal between the rim of the bottle and the sealable coating of the bottle cap. Therefore, the pressurized water is caused to escape through the mechanical thread interface toward a lower inner region of the bottle cap where the water escapes from the cap at atmospheric pressure.

Abstract: A processing solution containing solvent and solute is supplied onto a substrate (9). The processing solution transforms into a particle retention layer as a result of at least part of the solvent being volatilized from the processing solution and causing the processing solution to solidify or harden. The particle retention layer is removed from the substrate (9) by supplying a removal liquid onto the substrate (9). A solute component contained in the particle retention layer is insoluble or poorly soluble in the removal liquid, whereas the solvent is soluble. The solute component contained in the particle retention layer has the property of being altered to become soluble in the removal liquid when heated to a temperature higher than or equal to an alteration temperature. The removal liquid is supplied after the formation of the particle retention layer, without undergoing a process of alternating the solute component.

Abstract: A substrate processing method includes a first process of supplying an etching liquid to a peripheral portion of a substrate while rotating the substrate having a metal polycrystalline film formed on a front surface thereof; a second process of supplying a rinse liquid to a portion of the substrate closer to a center side of the substrate than a supply position of the etching liquid in the first process while rotating the substrate; a third process of supplying the etching liquid to the peripheral portion of the substrate while rotating the substrate; a fourth process of supplying the rinse liquid to a portion of the substrate closer to the center side of the substrate than a supply position of the etching liquid in the third process while rotating the substrate; and a fifth process of drying the substrate after the fourth process.

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

Abstract: A substrate processing method includes a processing liquid supplying step of supplying a processing liquid to a patterned surface of a substrate having the patterned surface with projections and recesses, a processing film forming step of solidifying or curing the processing liquid supplied to the patterned surface to form, so as to follow the projections and the recesses of the patterned surface, a processing film which holds a removal object present on the patterned surface and a removing step of supplying a peeling liquid to the patterned surface to peel the processing film from the patterned surface together with the removal object, thereby removing the processing film from the substrate, while such a state is kept that the removal object is held by the processing film.

Abstract: The invention relates to a method for pickling steel sheets 8, the steel sheets being continuously dipped in a pickling bath 1, containing a pickling solution 10, the bath being connected to a treatment unit including a recirculation tank 3, circulators 12 and 13, a continuous entering flow 11 of the solution being fed into an ultrafiltration device 2 from the recirculation tank 3 and two flows exiting the ultrafiltration device, one filtered exiting flow 21 being then fed back inside the recirculation tank 3 and one unfiltered flow 22, the treatment unit including no storage tank.

Abstract: Semiconductor devices made by forming hard mask pillars on a surface of a substrate, forming sacrificial spacers on a first side of each hard mask pillar and a second side of each hard mask pillar. The open gaps may be formed between adjacent sacrificial spacers. The semiconductor devices may also be formed by etching the hard mask pillars to form pillar gaps, etching gate trenches into the substrate through the open gaps and the pillar gaps, forming a gate electrode within the gate trenches, implanting channels and sources in the substrate below the sacrificial spacers, forming an insulator layer around the sacrificial spacers, etching the sacrificial spacers to form contact trenches within the substrate, and filling the contact trenches with a conductive material to form contacts.

Abstract: A system for cleaning, repairing, and/or replacing damaged shaker screens is disclosed. The system may comprise a shale shaker with a replaceable shaker screen, at least one camera, and a computer processor. The camera is positioned to capture images of the shale shaker screen and the processor is capable of receiving said images from the camera. The processor is configured to analyze the images and detect damaged regions of the shale shaker screen. The processor is also configured to determine when a screen is damaged above a pre-defined threshold. Certain embodiments allow for the automatic cleaning, repair, and/or replacement of the shaker screen.

Abstract: Rigid bars to be placed upstanding at the opposite sides of a windshield and a plurality of flexible strands connected between the bars in laterally spaced apart relationship.

Abstract: A dishwashing appliance includes a tub defining a wash chamber therein for receipt of articles for washing, a heating element, a sump positioned at a bottom of the wash chamber for receiving fluid from the wash chamber, a drain pump in communication with the sump, and a temperature sensor. Methods of operating the dishwashing appliance may include filling the sump with a liquid and heating the liquid by activating the heating element. Such methods also may include measuring a temperature of a liquid in the sump with the temperature sensor and comparing the measured temperature of the liquid to a minimum drain temperature threshold. Such methods may include draining the liquid from the sump after the measured temperature is equal to or greater than the minimum drain temperature threshold, such as immediately after heating the liquid.

Abstract: A device cleaning system cycles a fluid by a clogged or non-functioning device to remove the substances that are built-up on it. The fluid could be heated to facilitate removal and it is considered of importance to use a fluid that is safe environmentally. A clean and functioning verification device is run in the system to compare readings from the non-functioning device. The system is intended to run until the provide similar readings.

Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

Abstract: A bevel portion treatment agent composition of the present invention is a bevel portion treatment agent composition containing a silylating agent, which is used for treating a bevel portion of a wafer, in which a surface modification index Y and a surface modification index Z measured by a predetermined procedure have a characteristic of satisfying 0.5?Y/Z?1.0.

Abstract: A declogging assembly (20) is configured for use with a suction conduit (10). The suction conduit has a head (14) at a first end (15) and a vacuum tube connection (16) at a second end (17). The assembly includes a body (30). The body defines a first aperture (32), a second aperture (34), and a third aperture (36). The assembly also includes a plug (40) disposed within the body (30). The plug has a surface (42) configured to contact the head (14) of the suction conduit (10) so as to move the plug from a first position, in which the first aperture (32) is in fluid communication with the second aperture (34), to a second position, in which the first aperture (32) is in fluid communication with the third aperture (36). The assembly (20) also includes a biasing member (50) configured to bias the plug into the first position.

Abstract: A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

Abstract: The present invention relates to a method for treating the surface of a wafer with multiple liquids, comprising rotating the surface of the wafer and discharging different liquid streams onto the rotating surface in a sequence from separate outlets, wherein the discharge of liquid streams which are contiguous in the sequence overlaps during a transition phase, and wherein during the transition phase the liquid streams merge after exiting said outlets to form a merged liquid stream before impacting the rotating surface. The invention also provides a liquid dispensing device incorporating a housing holding two or more liquid delivery tubes, wherein the tubes' outlets are inwardly angled towards one another, such that in use liquid streams delivered from the outlets of the two or more liquid delivery tubes merge to form a merged liquid stream.

Abstract: A sucker rod cleaning system includes an inductive heating device, a feed mechanism, a first support and a second support. An electromagnet of inductive heating device includes a wire coil head that is configured to inductively heat a sucker rod positioned within a heating zone. The feed mechanism is configured to feed a sucker rod through the heating zone in a feed direction. The first support is positioned on an upstream side of the wire coil head, and is configured to support a portion of a sucker rod as it is fed through the heating zone by the teed mechanism. The second support is positioned on a downstream side of the wire coil head, and is configured to support a portion of a sucker rod as it is fed through the heating zone by the feed mechanism.

Abstract: There is provided a method of cleaning a film forming apparatus conducted after a film forming process by supplying a source gas and a reaction gas to produce a reaction product into a processing container to form a film of the reaction product on a substrate. The method includes: controlling, in the film forming process, a first film deposited in the processing container and a second film deposited in a source gas supply part to become different kinds of films; performing, after the film forming process, a cleaning process by supplying a cleaning gas having an etching selection ratio of the second film to the first film being greater than 1 so as to etch and remove the second film; and performing, after the cleaning process, a surface control process of making a surface state of the first film close to a state before the cleaning process was performed.