Abstract: A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

Abstract: The present invention discloses a method and a composition for removing metal sulfide scale present on the surface of a metal, said method comprising: providing a liquid composition comprising: a chelating agent and a counterion component selected from the group consisting of: sodium gluconate; gluconic acid; tetrasodium EDTA; EDTA; propylenediaminetetraacetic acid (PDTA); nitrilotriacetic acid (NTA); N-(2-hydroxyethyl) ethylenediaminetriacetic acid (HEDTA); diethylenetriaminepentaacetic acid (DTPA); hydroxyethyliminodiacetic acid (HEIDA); cyclohexylenediaminetetraacetic acid (CDTA); diphenylaminesulfonic acid (DPAS); ethylenediaminedi(o-hydroxyphenylacetic) acid (EDDHA); glucoheptonic acid; gluconic acid; oxalic acid; malonic acid; succinic acid; glutaric acid; adipic acid; pimelic acid; suberic acid; azelaic acid; sebacic acid; phthalic acid; terephthalic acid; aconitic acid; carballylic acid; trimesic acid; isocitric acid; citric acid; L-glutamic acid-N,N-diacetic acid (GLDA); salts thereof; and mixtur

Abstract: A substrate processing method includes a process of cooling a substrate to below a freezing point of a processing liquid using a cooling fluid brought into contact with the substrate opposite. While the substrate is cooled to below the freezing point of the processing liquid, a droplet of processing liquid is dispensed onto a surface of the substrate at a specified location of a foreign substance. The droplet then forms a frozen droplet portion at the specified location. The frozen droplet portion is then thawed.

Abstract: A system and method for selectively manually controlling an autonomous floor cleaner includes an autonomous floor cleaner and a remote control device, such as a smartphone. The smartphone can have a downloaded application for controlling one or more functions of the cleaning robot, including manually directing the movement of the cleaning robot.

Abstract: A method includes cleaning a wafer with a brush element where the brush element collects particles from the wafer during the cleaning process. The brush element is immersed in a first cleaning liquid. An ultrasonic or megasonic vibration is applied to the first cleaning liquid. The ultrasonic or megasonic vibration causes the particles to dislodge from the brush element into the first cleaning liquid. The particles contaminate the first cleaning liquid.

Abstract: A household dishwasher includes a washing compartment, an activatable unit arranged in the washing compartment, a control device configured to actuate the activatable unit, an optical sensor configured to acquire an optical sensor signal of the washing compartment, and a communication unit for bidirectional communication with a remote server. The communication unit transmits the acquired optical sensor signal to the remote server and receives a control command from the remote server for actuating the activatable unit and to forward the received control command to the control device.

Abstract: A substrate processing method is provided, which includes: a substrate holding step of causing a substrate holding unit to hold a substrate; an ozone-containing hydrofluoric acid solution supplying step of supplying an ozone-containing hydrofluoric acid solution containing ozone dissolved therein a hydrofluoric acid solution to one major surface of the substrate held by the substrate holding unit; a brush-cleaning step of cleaning the one major surface of the substrate by bringing a cleaning brush into contact with the one major surface of the substrate after the ozone-containing hydrofluoric acid solution supplying step; and an ozone water supplying step of supplying ozone water to the one major surface of the substrate before start of the brush-cleaning step after the ozone-containing hydrofluoric acid solution supplying step or in the brush-cleaning step.

Abstract: A diverter valve for an appliance having water containing filamentous materials such as hair or string provides a low turbulence conduit (48) interconnecting an inlet (18) and multiple outlets (22a) reducing dead space and opportunities for filamentous materials to catch or collect. The conduit may be contained in a rotating spool (40) within a watertight housing (34) allowing simplified gasketing augmented by an ability to turn on and off waterflow separately, for example, with the valve or pump.

Abstract: A dishwasher appliance having a camera assembly. The dishwasher appliance is configured for obtaining an image of the door, determining the position of the door relative to a tub of the appliance; and using the position of the door in one or more dishwashing operations.

Abstract: A method of processing a plurality of substrates includes immersing the plurality of substrates into a bath solution contained in a bath chamber; generating gas bubbles in the bath solution; projecting light from a light source toward the bath chamber; generating light sensor data by capturing light emanating off the bath chamber after interacting with the gas bubbles with a light sensor; and converting the light sensor data into a metric for the bath solution.

Abstract: A method of reprocessing a surgical instrument includes converting force associated with a flow of fluid used during reprocessing of a surgical instrument to a drive force to drive an input drive member of a transmission mechanism of the instrument.

Abstract: There is provided a technique that includes: processing a substrate in a process vessel by supplying a processing gas to the substrate and exhausting the processing gas from an exhaust part including an exhaust pipe and a pump; cleaning an interior of the exhaust part by supplying a first cleaning gas from a supply port installed in the exhaust pipe directly into the exhaust pipe; and cleaning an interior of the process vessel by supplying a second cleaning gas into the process vessel, wherein a frequency of performing the act of cleaning the interior of the exhaust part is set higher than a frequency of performing the act of cleaning the interior of the process vessel.

Abstract: A plasma purge method that is performed after dry cleaning in a process container and before applying a deposition process to a substrate includes: (a) activating and supplying a first process gas containing Cl2 in the process container; and (b) activating and supplying a second process gas containing H2 and O2 in the process container.

Abstract: A method includes performing a first post Chemical Mechanical Polish (CMP) cleaning on a wafer using a first brush. The first brush rotates to clean the wafer. The method further includes performing a second post-CMP cleaning on the wafer using a second brush. The second brush rotates to clean the wafer. The first post-CMP cleaning and the second post-CMP cleaning are performed simultaneously.

Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.

Abstract: A method for creating a three-dimensional (3D) mark in a protective coating including at least one of a TBC and a bond coating over a metal part, is provided. The method may include positioning a mask over the protective coating, the mask including an opening pattern therein; and performing an abrasive waterjet process on the protective coating using the mask. The abrasive waterjet erodes a first portion of the protective coating exposed through the first opening pattern to create the 3D mark. The mask is removed, leaving the 3D mark in the protective coating. The 3D mark only partially penetrates through the protective coating. A metal part may include a metal body, a protective coating over the metal body, and the 3D mark in the protective coating, is also provided. The 3D mark in the protective coating may include an opening having a width of between 30 and 300 micrometers.

Abstract: A nano-indent process for creating a single photon emitter in a two-dimensional materials platform comprising the steps of providing a substrate, providing a layer of polymer, providing a layer of two-dimensional material, utilizing a proximal probe, applying mechanical stress to the layer of two-dimensional material and to the layer of polymer, deforming the layer of two-dimensional material and the layer of polymer, and forming a nano-indent in the two-dimensional material. A single photon emitter in a two-dimensional materials platform comprising a substrate, a deformable polymer film, a two-dimensional material, and a nano-indent in the two-dimensional material.

Abstract: A gas ejection apparatus ejects gas by use of a compressor that compresses the gas, and the gas ejection apparatus includes a detector and a microcomputer. The detector detects a signal relating to an ejection target device. The microcomputer controls the compressor to change a number of times of ejection of the gas in accordance with an amount of time elapsing between a detection of the signal by the detector and a next detection of the signal by the detector.

Abstract: An automotive surface is cleaned by applying an effective amount of a cleaning composition comprising a) at least one hydrocarbon solvent in an amount from about 3 weight percent to about 20 weight percent of the composition, b) at least one thickener/rheology modifier in an amount from about 0.01 weight percent to about 3 weight percent, c) at least one silicone fluid has a viscosity ranging from about 500 to about 20,000 centistokes at 25° C., present in an amount from about 0.1 weight percent to about 3 weight percent, d) at least one wetting agent in an amount from about 0.001 to about 2%, e) at least one hydrophobic additive in an amount from about 0.1 to about 3%, and f) water in an amount from about 60 weight percent to about 85 weight percent to the automotive surface with an application implement.

Abstract: A method and safety device for a vehicle wash tunnel with a support structure with two parallel rails for the placement, by means of corresponding carriages, of the arms of an arch which incorporates a horizontal brush capable of linear movement along the arms of the arch and the rails. The safety device includes a rotation shaft, for fastening the arms of the arch to the carriages, and an extendable cylinder, spaced from the rotation shaft, which joins each carriage to the corresponding arch, such that the arch can rotate with respect to the carriages, and the extension of the extendable cylinder causes the rotation of the arch.