Abstract: The present disclosure provides a method for extreme ultraviolet lithography (EUVL) process. The method includes loading a binary phase mask (BPM) to a lithography system, wherein the BPM includes two phase states and defines an integrated circuit (IC) pattern thereon; setting an illuminator of the lithography system in an illumination mode according to the IC pattern; configuring a pupil filter in the lithography system according to the illumination mode; and performing a lithography exposure process to a target with the BPM and the pupil filter by the lithography system in the illumination mode.

Abstract: A field manipulator to provide high resolution control of position in the XY plane and/or focus control. The field manipulator includes a plate located between the patterning device and the substrate. Control of the XY position is provided by tilting of the plate, while control of the focus position may be provided by localized deformation of the plate. Both adjustments may be performed by one or more actuators that act upon one or more edges of the plate. In an embodiment, two substantially parallel plates are provided and focus control can be provided by changing the spacing between them. A liquid may be provided between the plates which may be temperature controlled to adjust the focus by changing the refractive index of the liquid.

Abstract: A layout pattern decomposition method includes following steps. A layout pattern is received. The layout pattern includes a plurality of features, and an edge-to-edge space is respectively defined in between two adjacent features. A sum of a width of the edge-to-edge space and a width of the feature on a left side of the edge-to-edge space and a sum of the width of the edge-to-edge space and a width of the feature on a right side of the edge-to-edge space are respectively calculated. The sums and a predetermined value are respectively compared. When any one of the sums is smaller than the predetermined value, the two features on the two sides of the edge-to-edge space are colored by a first color and alternatively a second color. The features including the first color are assigned to a first pattern and the features including the second color to a second pattern.

Abstract: The present disclosure provides a lithography system comprising a radiation source and an exposure tool including a plurality of exposure columns densely packed in a first direction. Each exposure column includes an exposure area configured to pass the radiation source. The system also includes a wafer carrier configured to secure and move one or more wafers along a second direction that is perpendicular to the first direction, so that the one or more wafers are exposed by the exposure tool to form patterns along the second direction. The one or more wafers are covered with resist layer and aligned in the second direction on the wafer carrier.

Abstract: A lithographic apparatus injects gas between a reticle (MA) and reticle blades (REB-X, REB-Y) to protect the reticle from contamination. The gas may be injected either into the space defined between the reticle and the closest pair of reticle blades, or into the space defined between the two pairs of reticle blades.

Abstract: A power supply for providing HV power to a lithography illumination source comprising a HV power source arranged to provide the HV power, a HV power transmission line arranged to transmit the HV energy from the HV power source and one or more RF terminations provided on one or more of an input end of the transmission line or an output end of the transmission line. The one or more RF terminations terminate the transmission line to reduce reflection of RF energy at the end of the transmission line.

Abstract: A projection exposure apparatus for microlithography for the production of semiconductor components includes at least one optical assembly with at least one optical element which can be actuated in a mechanically controlled manner is mounted in a structure. For carrying out the mechanical actuation, a control signal transmission device and/or an energy transmission device are/is provided, which introduce(s) no parasitic mechanical effects into the optical assembly at least during specific operating states of the projection exposure apparatus.

Abstract: An exposure apparatus includes a liquid immersion member including a first member and a second member and configured to form a liquid immersion space of the liquid, a driving apparatus configured to move the second member with respect to the first member; and a controller configured to control the driving apparatus. The controller controls the driving apparatus so that a first operation of the second member in a first movement period of the substrate between exposure termination of a first shot region and exposure start of a second shot region is different from a second operation of the second member in a second movement period of the substrate between exposure termination of a third shot region and exposure start of a fourth shot region, the first and second shot regions being included in the same row, the third and fourth shot regions being arranged in different rows.

Abstract: A projection objective includes at least four curved mirrors, which include a first curved mirror that is a most optically forward mirror and a second curved mirror that is a second most optically forward mirror, as defined along a light path. In addition, an intermediate lens element is disposed physically between the first and second mirrors, the intermediate lens element being a single pass type lens. The objective forms an image with a numerical aperture of at least substantially 1.0 in immersion.

Abstract: The invention concerns an arrangement for thermal actuation of a mirror in a microlithographic projection exposure apparatus, wherein the mirror has an optical effective surface and at least one access passage extending from a surface of the mirror, that does not correspond to the optical effective surface, in the direction of the effective surface, wherein the arrangement is designed for thermal actuation of the mirror via electromagnetic radiation which is propagated in the access passage, wherein the arrangement further has at least one heat radiating mechanism which produces the electromagnetic radiation which is propagated in the access passage, and wherein the heat radiating mechanism is actuable along the access passage.

Abstract: A radiation source (SO) suitable for providing a beam of radiation to an illuminator of a lithographic apparatus. The radiation source comprises a nozzle (128) configured to direct a stream of fuel droplets along a trajectory (140) towards a plasma formation location (212). The radiation source is configured to receive a first amount of radiation (205) such that, in use, the first amount of radiation is incident on a fuel droplet at the plasma formation location. The first amount of radiation transfers energy to the fuel droplet to generate a radiation generating plasma that emits a second amount of radiation (132). The radiation source further comprises an alignment detector having a first sensor arrangement (122) and a second sensor arrangement (134). The first sensor arrangement is configured to measure a property of a third amount of radiation (205a) that is indicative of a focus position of the first amount of radiation.

Abstract: An exposure apparatus exposes an upper surface of a substrate with exposure light through liquid, and includes an optical member that has an emitting surface from which the exposure light is emitted; and a substrate holding apparatus having a holding portion that releasably holds a lower surface of the substrate, and an upper surface provided around the holding portion. The upper surface of the substrate holding apparatus is configured such that the upper surface of the substrate holding apparatus and the upper surface of the substrate held by the holding portion are substantially in a plane. The upper surface of the substrate holding apparatus has a jagged edge portion. The substrate is held by the holding portion such that an edge portion of the substrate held by the holding portion is located along the jagged edge portion of the upper surface of the substrate holding apparatus.

Abstract: An exposure apparatus including a projection system configured to project a plurality of radiation beams onto a target; a movable frame that is at least rotatable around an axis; and an actuator system configured to displace the movable frame to an axis away from an axis corresponding to the geometric center of the movable frame and to cause the frame to rotate around an axis through the center of mass of the frame.

Abstract: An exposure apparatus configured to project each of a plurality of radiation beams onto a respective location on a target, the plurality of radiation beams forming a desired dose pattern via a plurality of spot exposures, the nominal position of a characteristic point in the dose distribution of each of the spot exposures lying at points defining a first grid. The apparatus has, or is provided data from, a controller configured to: calculate a target intensity value for each of the plurality of radiation beams to expose the target to the desired dose pattern, the calculation using as input a rasterized representation of the desired dose pattern, the rasterized representation including a dose value defined at each of a plurality of points on a second grid, the first and second grids having the same geometry, and control the exposure apparatus to emit beams with the target intensity values.

Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

Abstract: A projection objective includes at least four curved mirrors, which include a first curved mirror that is a most optically forward mirror and a second curved mirror that is a second most optically forward mirror, as defined along a light path. In addition, an intermediate lens element is disposed physically between the first and second mirrors, the intermediate lens element being a single pass type lens. The objective forms an image with a numerical aperture of at least substantially 1.0 in immersion.

Abstract: The present invention provides methods and apparatus for facilitating the start up of a fuel droplet stream generator. During a start-up phase the fuel droplet stream generator is positioned so that the fuel droplets re emitted downwardly whereby gravity assists in the establishment of the stream. The droplets are monitored using a visualization system and once the stream is determined to have the desired characteristics the stream generator is moved to a second position of steady state use in which the droplet stream is emitted in a horizontal direction.

Abstract: A table for a lithographic apparatus, the table having a catchment opening formed in an upper surface of the table, the catchment opening in fluid communication through the table with the environment of the table at a drain opening in a surface of the table other than the upper surface.

Abstract: A projection objective includes at least four curved mirrors, which include a first curved mirror that is a most optically forward mirror and a second curved mirror that is a second most optically forward mirror, as defined along a light path. In addition, an intermediate lens element is disposed physically between the first and second mirrors, the intermediate lens element being a single pass type lens. The objective forms an image with a numerical aperture of at least substantially 1.0 in immersion.

Abstract: In order to determine whether an exposure apparatus is outputting the correct dose of radiation and its projection system is focusing the radiation correctly, a test pattern is used on a mask for printing a specific marker onto a substrate. This marker is then measured by an inspection apparatus, such as a scatterometer, to determine whether there are errors in focus and dose and other related properties. The test pattern is configured such that changes in focus and dose may be easily determined by measuring the properties of a pattern that is exposed using the mask. The test pattern may be a 2D pattern where physical or geometric properties, e.g., pitch, are different in each of the two dimensions. The test pattern may also be a one-dimensional pattern made up of an array of structures in one dimension, the structures being made up of at least one substructure, the substructures reacting differently to focus and dose and giving rise to an exposed pattern from which focus and dose may be determined.