Abstract: The invention is intended to establish means for manufacturing MB2 single crystals and to provide a useful superconductive material (wire rod and so forth) taking advantage of anisotropic superconductive properties thereof. A mixed raw material of Mg and B or a precursor containing MgB2 crystallites, obtained by causing reaction of the mixed raw material of Mg and B, kept in contact with hexagonal boron nitride (hBN), is held at a high temperature in the range of 1300 to 1700° C. and under a high pressure in the range of 3 to 6 GPa to cause reaction for forming an intermediate product, thereby growing the MB2 single crystals having anisotropic superconductive properties via the intermediate product.

Abstract: The present invention relates to epitaxial, electrically conducting and mechanically robust, cubic nitride buffer layers deposited epitaxially on biaxially textured substrates such as metal and alloys. The invention comprises of a biaxially textured substrate with epitaxial layers of nitrides. The invention also discloses a method to form such epitaxial layers using a high rate deposition method as well as without the use of forming gases. The invention further comprises epitaxial layers of oxides on the biaxially textured nitride layers. In some embodiments the article further comprises electromagnetic devices which may be super conducting properties.

Abstract: The object of this invention is to employ a solder alloy comprising tin/lead/silver in order to provide a wider solidification range and achieve balance between the surface tensions of both side of a small leadless component. The expanded solidification range slows the melting and wetting time so as to balance the surface tension of the molten solder, and in turn reduces the tombstoning frequency. The preferred Ag concentration is 0.2-0.5% in weight, the more preferred Ag concentration is 0.3-0.4% in weight. For reflow soldering of small leadless components, the pastes made with the alloy compositions of Sn62.6Pb37Ag0.4 and Sn63Pb36.6Ag0.4 results in improvements in tombstoning.

Abstract: The present invention concerns the improvement of the supercurrent carrying capabilities, i.e. the increase of critical current densities, of bicrystalline or polycrystalline superconductor structures, especially of high-Tc superconductors. By providing an appropriate predetermined dopant profile across the superconductor structure, in particular within or in the vicinity of the grain boundaries, the space-charge layers at the grain boundaries are reduced and thereby the current transport properties of the superconductor significantly improved. Simultaneously, the influence of magnetic fields on the critical current densities is significantly reduced, which in turn enhances the overall supercurrent carrying capabilities while keeping the supercurrent transport properties of the grains at good values.

Abstract: A rim member 120 forming an entrance 110 and a plate 11 (21) are friction stir welded by moving a rotary tool 200 along the rim member 120. The rotary tool 120 is tilted along the direction of movement. Welding is started at right block 120R, and when the tool reaches corner portion P5 between the right block 120R and a center block 120C, the tool 200 is pulled out of the rim member 120 and plate 11 (21). Next, the tool is tilted toward the direction of movement along center block 120C. Thereafter, the tool is lowered and inserted to position, and friction stir welding is restarted. According to the invention, the direction of the rotary tool is not changed while the tool is inserted to the rim member 120. This prevents generation of excessive friction heat, and thereby realizes a good weld.

Abstract: A self-aligned process for fabricating a corrosion-resistant conductive pad on a substrate, and a structure that includes an interconnect to allow a terminal connection to the pad. The process generates a metallic layer on an initially exposed metal layer. The metallic layer is electrically conductive and corrosion resistant. The process includes providing a substrate having a metal layer with an exposed surface, depositing a second metal layer on the exposed surface, annealing the substrate to alloy a portion of the metal layer that includes the exposed surface and a portion of the second metal layer, and removing the unalloyed portion of the second metal layer. An alternative process includes providing a metal layer on the substrate, and electroless plating a corrosion-resistant metal or alloy on the metal layer. The alternative process may additionally include electroless plating a second corrosion-resistant metal on the corrosion-resistant metal or alloy.

Abstract: A wire bonding apparatus including a capillary, which allows a tip end of a bonding wire to protrude from the bottom, and a discharge electrode, which generates a spark between the electrode and the tip end of the wire by an electrical discharge; and auxiliary electrodes being disposed so as to surround the area between the tip end of the wire and the tip end of the discharge electrode. The end portion of the spark on the wire side is guided onto the axial line of the portion of the wire that protrudes from the capillary by the electric fields from the auxiliary electrodes, and the end portion of the spark on the discharge electrode side is guided onto the axial line of the discharge electrode. Dissociated ions are adsorbed on the auxiliary electrodes, preventing the discharge electrode from being contaminated.

Abstract: A method for friction stir welding using liquid cooling. The method includes the steps of moving a pin tool across a welding location, spraying a cooling liquid in a localized manner from a cooling ring moving with the pin tool onto a trailing region and onto lateral regions of the welding location adjacent to the pin tool, and blowing cooling gas from a gas jet moving with the pin tool from a front of the pin tool against the pin tool and against the cooling liquid emerging from the cooling ring. In addition, a friction stir welding and cooling device includes a pin tool configured to move across a welding location and a cooling ring at least partially encircling the pin tool. The cooling ring is configured to move simultaneously with the pin tool across the welding location and includes a plurality of nozzles configured to spray a cooling liquid.

Abstract: The present invention utilizes magnesium diboride (MgB2) or (Mg1-xMx)B2 as a superconductivity thin film which can be applied to a rapid single flux quantum (RSFQ) circuit. A method for manufacturing a superconductor incorporating therein a superconductivity thin film, begins with preparing a single crystal substrate. Thereafter, a template film is formed on top of the substrate, wherein the template has a hexagonal crystal structure. The superconductivity thin film of MgB2 or (Mg1-xMx)B2 is formed on top of the template film. If Mg amount in the superconductivity thin film is insufficient, Mg vapor is flowed on the surface of the superconductivity thin film while a post annealing process is carried out at the temperature ranging from 400° C. to 900° C.

Abstract: An improved apparatus and method for the prevention of deformation and buckling of metal plates during welding processes is disclosed. The improved apparatus and method are used to apply pressure to a welded seam created between two metal plates during the welding process. Pressure is applied to the area of the plates surrounding the welded seam until the welded seam has sufficiently cooled to prevent deformation and buckling of the metal plates.

Abstract: A method of manufacturing a semiconductor device comprises: a first step of interposing a thermosetting anisotropic conductive material 16 between a substrate 12 and a semiconductor chip 20; a second step in which pressure and heat are applied between the semiconductor chip 20 and the substrate 12, an interconnect pattern 10 and electrodes 22 are electrically connected, and the anisotropic conductive material 16 is spreading out beyond the semiconductor chip 20 and is cured in the region of contact with the semiconductor chip 20; and a third step in which the region of the anisotropic conductive material 16 other than the region of contact with the semiconductor chip 20 is heated.

Abstract: A method of producing a washcoated monolith catalyst utilizing a dual sol binder system, wherein the binder system is a blend of an alumina sol and a silica sol and wherein the ratio of the alumina to the silica in the dual sol binder system is from about 6:1 to about 1:3.

Abstract: The invention relates to an interconnection between two overlapping end sections of metallic strips (10, 20) in which a quick and economical interconnetion should be produced. To this end, the invention provides that several annular welds (30) are provided in the overlapping area (15) which are situated at a distance from the face ends of both strips (10, 20).

Abstract: Disclosed are different titanium aluminide (Ti—Al) honeycomb panel structures formed from a gamma-based Ti—Al (&ggr;-Ti—Al) or orthorhombic Ti—Al (O—Ti—Al) honeycomb core brazed to a &ggr;-Ti—Al or O—Ti—Al facing sheet(s), where a metal braze filler foil containing copper and one or more other metals is used to join the faying surface of the honeycomb core and the faying surface of the facing sheet(s). The structures and method of the invention are useful where high strength, lightweigth materials are required, such as in aircraft and other aerospace-related applications.

Abstract: A fluxer applies powdered flux to an object. The fluxer includes an enclosure that defines a chamber where the object is fluxed. The enclosure includes an inlet for receiving the object into the chamber prior to application of the flux and an outlet for discharging the object from the chamber after the flux has been applied. A conveyor extends through the enclosure for traversing the object into and out of the chamber. The fluxer also includes a hopper for storing the flux and an applicator in fluid communication with the hopper for applying the flux to the object. A flux recovery system is in fluid communication with the chamber to introduce and maintain a negative pressure within the chamber. As a result, excess flux is retained within the enclosure. This excess flux can then be recovered and recycled to the hopper.

Abstract: An article including a substrate, a layer of an inert oxide material upon the surface of the substrate, a layer of an amorphous oxide or oxynitride material upon the inert oxide material layer, a layer of an oriented cubic oxide material having a rock-salt-like structure upon the amorphous oxide material layer, and a layer of a SrRuO3 buffer material upon the oriented cubic oxide material layer is provided together with additional layers such as a HTS top-layer of YBCO directly upon the layer of a SrRuO3 buffer material layer. With a HTS top-layer of YBCO upon at least one layer of the SrRuO3 buffer material in such an article, Jc′s of up to 1.3×106 A/cm2 have been demonstrated with projected IC's of over 200 Amperes across a sample 1 cm wide.

Abstract: A method for securing a metallic substrate (24) to a metallic housing (26). The method may include: firing a first solderable coating (64) to an edge (60) of the metallic substrate (24); firing a second solderable coating (64) to a groove (62) of the metallic housing (26); joining the edge (60) of the metallic substrate (24) to the groove (62) of the metallic housing (26) to form a joint (66) at the first solderable coating and the second solderable coating; applying a solder (68) to the joint (66); and solder bonding the metallic substrate (24) to the metallic housing (26) to provide a hermetic seal at the joint (66). There is also an electronic control module that incorporates the method.

Abstract: The object of the present invention is to provide an oxide superconducting conductor having superior strength and superconductor characteristics, and its production method.

Abstract: After a reducing gas is mixed with an inert gas by a mixer, a resultant mixed gas is heated by a heater and made to a hot mixed gas which is dehumidified and dried and the temperature of which is increased. The mixed gas is injected to a subject from an injection port formed in a soldering iron, and thereby soldering is performed by heating and melting solder with the soldering iron in the atmosphere of the mixed gas.

Abstract: An oxide superconductor of the present invention characterized in that it comprises: a substrate 1 made of metals having a high melting temperature; at least one oxide intermediate layer 2 and 3 which is formed on at least one surface of the substrate 1; and a thick film oxide superconductor layer 5 which is formed on the oxide intermediate layer 2 and 3 the liquid phase epitaxial method in which the substrate 1 provided with the oxide intermediate layer 2 and 3 is put into a solution 7 containing the elements comprising an oxide superconductor layer, and is then pulled out from the solution 7.