Abstract: Superconducting cables and magnetic devices are disclosed.

Abstract: An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.

Abstract: A method and an apparatus for spraying materials onto a substrate to produce a coating thereon is described which allows very thick layers of complex metal oxides to be produced. The apparatus and method are particularly suitable for producing superconducting coatings.

Abstract: Methods and articles for controlling the surface of an alloy substrate for deposition of an epitaxial layer. The invention includes the use of an intermediate layer to stabilize the substrate surface against oxidation for subsequent deposition of an epitaxial layer.

Abstract: The slurry for carrying zeolite of the present invention is slurry for attaching zeolite to a carrier and comprises zeolite and an organic emulsion binder dispersed in water. This slurry for carrying zeolite has viscosity not excessively high in spite of a large content of zeolite and binder and has a pH at which the zeolite and binder are stable. The slurry therefore can be stored for a long time in a stable manner.

Abstract: A fully transposed composite superconductor can be especially used for AD devices and contains subconductors composed according to the Roebel bar principle and containing TC superconducting material. Superconductors are provided, that can be laterally bent in the plain of their width B so that the bending radius R is more than 100 times the width B and the bending zone length Hsue et al. '352 publication is more than 20 times the width B. The device for producing the conductor includes devices disposed in series for combining, bending, assembling to a Roebel bar, and fixating the subcontractors.

Abstract: A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

Abstract: Soldering apparatus designed to apply soldering, by means of jetting out streams of molten solder, which is gathered in a solder bath, to a piece to be soldered carried in a predetermined direction. While jetting out molten solder from the solder bath, a drive means in the apparatus supplies drive for setting the relative position between the end of the jet-stream nozzle and the piece and a control means also available outputs control signals matching a predetermined condition to the drive means to carry out micro-adjustment of the jet-stream nozzle in short time with high accuracy. At the same time, remote operation can also be performed.

Abstract: A polycrystalline thin film B consisting mainly of oxide crystal grains 20 which have a crystal structure of a Type C rare earth oxide represented by one of the formulas Y2O3, Sc2O3, Nd2O3, Sm2O3, Eu2O3, Gd2O3, Tb2O3, Dy2O3, Ho2O3, Er2O3, Yb2O3, Lu2O3, and Pm2O3 formed on a film forming surface of a polycrystalline substrate A wherein grain boundary inclination angles between the corresponding crystal axes of different crystal grains in the polycrystalline thin film along a plane parallel to the film forming surface of the polycrystalline substrate are controlled within 30 degrees.

Abstract: While one preform (A) is being shaped between two dies (4, 11), another preform (B) is being prepared by heating in a compartment (14) on a lower die (5) similar to the preceding one (4). When the preform (A) has been shaped, a mobile section (3) of the furnace is lifted to release the upper die (11) and make it possible to place the new preform (B) and its lower die (5) beneath it. Thus, when one preform has been shaped, the following one is already prepared by heating.

Abstract: The invention relates to an article with an improved buffer layer architecture comprising a substrate having a metal surface, and an epitaxial buffer layer on the surface of the substrate. The epitaxial buffer layer comprises at least one of the group consisting of ZrO2, HfO2, and compounds having at least one of Ca and a rare earth element stabilizing cubic phases of ZrO2 and/or HfO2. The article can also include a superconducting layer deposited on the epitaxial buffer layer. The article can also include an epitaxial capping layer between the epitaxial buffer layer and the superconducting layer. A method for preparing an epitaxial article comprises providing a substrate with a metal surface, depositing on the metal surface an epitaxial buffer layer comprising at least one material selected from the group consisting of ZrO2, HfO2, and compounds having at least one of Ca and a rare earth element stabilizing cubic phases of at least one of ZrO2 and HfO2.

Abstract: A wire bonding method, a bump forming method and a bump which are capable of preventing contact of a wire with a substrate or a conductive lead after the wire is bonded to a bump, and which are capable of preventing generation of bending in the wire during bonding of the wire to the bump are disclosed. When a first conductor and a second conductor are wire bonded, a bump is previously formed on the second conductor by ball bonding. An inclined surface is formed on an upper end of the bump by moving a capillary along a predetermined path to operate the capillary. First bonding of a wire to the first conductor is carried out, then the wire is looped from the first conductor to the bump, and second bonding of the wire onto the inclined surface of the bump is carried out.

Abstract: Copper or excess copper is added to one or more layers of a superconducting composite structure to reduce migration of copper form a copper based superconducting layer.

Abstract: The method of preparing an oxide superconducting wire comprises steps of preparing a wire by coating raw material powder for a Bi—Pb—Sr—Ca—Cu—O based oxide superconductor including a 2223 phase with a metal and heat treating the wire in a pressurized atmosphere containing oxygen in a prescribed partial pressure, and the total pressure of the pressurized atmosphere is at least 0.5 MPa. The pressure heat treatment apparatus comprises a pressure furnace storing and heat treating a target in a pressurized atmosphere, a pressure regulator for measuring the total pressure in the pressure furnace, an oxygen concentration meter for measuring the oxygen concentration in the pressure furnace and a controller for controlling the oxygen partial pressure in the pressure furnace in response to the total pressure measured by the pressure regulator and the oxygen concentration measured by the oxygen concentration meter.

Abstract: A method for forming a thermoelement for a thermoelectric cooler is provided. In one embodiment a first substrate having a plurality of pointed tips separated by valleys wherein the substrate is covered by a metallic layer, portions of the metallic layer is covered by an insulator, and other portions of the metallic layer are exposed is formed. The other portions of the metallic layer that are exposed are covered with a thermoelectric material overcoat. A second substrate of thermoelectric material is then fused to the pointed tip side of the first substrate by, for example, heating the back of the first substrate to melt the thermoelectric material overcoat or by passing current through the pointed tips to induce Joule heating and thereby melt the thermoelectric material overcoat.

Abstract: There is provided a reinforced superconducting tape. The reinforced tape includes a superconducting tape containing a superconducting ceramic material, a first metal reinforcing layer having a greater coefficient of thermal expansion than that of the superconducting tape, and a second metal reinforcing layer having a greater modulus of elasticity than the superconducting tape and the first reinforcing layer.

Abstract: A machining device comprising five axial kinetic coordinate systems that can be controlled simultaneously, three axes of which are linear moving axes and two axes of which are rotary axes, with one axis of the five axes being provided with a tool rotating function, whereby said machining device is equipped with a cutting tool 51 and a friction stir welding tool 52. The current value observed when a large-diameter portion of said tool 52 contacts the work object is set in advance, and by observing the torque current of the rotary shaft of the tool 52 during friction stir welding, the insertion depth of the tool 52 can be controlled by maintaining the observed torque current above the preset current value, thus providing a good weld. A single device can provide both the cutting and the welding. Thus, it is possible to reduce equipment cost, installation space, plant area, lead time and production cost.

Abstract: A machining device comprising five axial kinetic coordinate systems that can be controlled simultaneously, three axes of which are linear moving axes and two axes of which are rotary axes, with one axis of the five axes being provided with a tool rotating function, whereby said machining device is equipped with a cutting tool 51 and a friction stir welding tool 52. The current value observed when a large-diameter portion of said tool 52 contacts the work object is set in advance, and by observing the torque current of the rotary shaft of the tool 52 during friction stir welding, the insertion depth of the tool 52 can be controlled by maintaining the observed torque current above the preset current value, thus providing a good weld. A single device can provide both the cutting and the welding. Thus, it is possible to reduce equipment cost, installation space, plant area, lead time and production cost.

Abstract: In heat bonding method and device, first and second marks (MA, MB) formed on the film carrier (52) are measured before performing heat bonding of outer leads (54) formed on a film carrier (52) to electrodes (58) formed on a transparent plate (56), where an expansion amount of the film carrier (52) is changed according to a condition of the heat bonding. A distance between the measured marks (MA, MB) is then obtained. The condition for the heat bonding is determined based on this distance. The heat bonding is performed under this condition determined.

Abstract: A method of manufacturing a transducer used in sensing or generating magnetic fields in a position detector wherein the transducer has a substrate and a conductor fixed to the substrate in a predetermined pattern. A wire laying device controllably lays wire onto the substrate so as to form the predetermined pattern. Relative movement is caused between the laying device and the substrate, and the wire is bonded to the substrate as it is laid thereon.