Abstract: The present invention concerns the improvement of the supercurrent carrying capabilities, i.e. the increase of critical current densities, of bicrystalline or polycrystalline superconductor structures, especially of high-Tc superconductors. By providing an appropriate predetermined dopant profile across the superconductor structure, in particular within or in the vicinity of the grain boundaries, the space-charge layers at the grain boundaries are reduced and thereby the current transport properties of the superconductor significantly improved. Simultaneously, the influence of magnetic fields on the critical current densities is significantly reduced, which in turn enhances the overall supercurrent carrying capabilities while keeping the supercurrent transport properties of the grains at good values.

Abstract: An apparatus and method for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode includes a contact surface wherein a fluid is deposited on the contact surface prior to the welding process. The fluid may be applied in different ways, including providing an aperture in the contact surface of the sonotrode. In addition, the sonotrode may be cooled below the dew point of the surrounding atmosphere thus causing moisture to form on the contact surface of the sonotrode. Cooling the sonotrode to a temperature above the dew point also reduces sonotrode adhesion during the ultrasonic welding process.

Abstract: Articles to be brazed are preheated to an increased temperature in a preheating process and the temperature of the articles to be brazed is measured. Conversion data obtained and stored for different combinations of articles to be brazed is referred to on the basis of the measured temperature and a time for which brazing filler metal supply nozzles are kept in a wait state is set on the basis of the conversion data to define the timing for supplying the brazing filler metal wires (S40). A heating burner moves forward and then a timer starts counting the time for which the nozzles are kept in the wait state (S42). When the nozzle wait timer has counted the set time and expired, the brazing filler metal supply nozzles move forward and supply the wires to braze the articles (S43 to 45). In this way, the articles to be brazed, heated by the heating burner, are at an increased temperature suitable for brazing at the time when the brazing filler metal wires are supplied.

Abstract: A rod material made of Ti alloy has a larger diameter portion at the end, which is joined with the end of material made of Ti—Al intermetallic compound, by friction welding, to form a poppet valve for an internal combustion engine. Instead of providing such larger diameter portion, the end of the material made of Ti—Al intermetallic compound may be heated to facilitate joining.

Abstract: There is provided a method of hermetically sealing electronic parts, comprising the step of bonding a base having semiconductor devices mounted thereon and a cap together via a solder. The solder is composed, by weight, of 78% or more but less than 79.5% Au, and the balance Sn. It is particularly preferred that the bonding is performed with the use of a solder composition composed, by weight, of 78% or more but 79% or less Au, and the balance Sn as the solder and furthermore through plating the cap with gold.

Abstract: A process for preparing a reforming catalyst comprises incorporating a group IA alkali metal from an aqueous alkaline solution into a zeolitic material by means of ion exchange to form an alkali metal-modified zeolitic support material, which is dried, calcined and combined with an inorganic oxide. The combination is dried and calcined to form a stable inorganic oxide/zeolitic catalyst support which is impregnated with a Group VIII metal by ionic exchange to form an impregnated inorganic oxide/zeolitic catalyst support which is dried, calcined and reduced from a naphtha reforming catalyst.

Abstract: A high temperature superconductor film which is Y—Ba—Cu—O-based and formed on a dielectric substrate 10, and has a Cu composition ratio to the Ba near the upper surface of the film which is higher than a Cu composition ratio to the Ba inside the film. The YBCO-based high temperature superconductor film is formed with a Cu composition on the film surface maintained higher with respect to the stoichiometric composition, whereby the Cu oxide can be easily produced while the production of the yttrium oxides can be depressed. The yttrium oxides cannot be easily produced, which makes it difficult for pores and crystal strains to be generated while the Cu oxide functions as a flux for advancing the crystal growth, whereby the YBCO-based high temperature superconductor film can have good film quality and single crystal. The superconducting elements can be formed of the YBCO-based high temperature superconducting film of such good film quality.

Abstract: Concave portions and convex portions are formed on a peripheral surface of a thin metal sheet by applying a pressing force thereto while the metal sheet is being embossed; pores are each formed on an apex of each of the concave portions and convex portions and burrs each projecting outward from a peripheral edge of each of the pores are generated by the pressing force; the metal sheets having the concave portions and convex portions formed thereon are layered on each other; the burr at the apex of each convex portion of a lower-layer metal sheet is interlocked with the burr at the apex of each concave portion of an upper-layer metal sheet adjacent to the lower-layer metal sheet to integrate the metal sheets with each other; and an active substance is charged into spaces between the upper-layer metal sheet and the lower-layer metal sheet through an aperture at the apex of each of the concave portions and convex portions.

Abstract: A solder reflow system is disclosed that includes a substrate, a solder pad disposed upon the substrate, an optical component disposed upon the solder pad, and a laser positioned above the substrate with laser output focused sufficiently close to the solder pad to reflow the solder when the laser is powered. Also disclosed is a method for reflowing a solder joint, including: providing an optical component assembly including a substrate, a solder pad disposed upon the substrate, solder disposed upon the solder pad, and an optical component disposed upon the solder pad; providing a laser; positioning the laser above the substrate with laser output focused sufficiently close to the solder pad, instead of directly over the solder pad; and powering the laser, thereby transferring energy through the substrate into the solder pad, and reflowing the solder.

Abstract: A flux supply device comprises a liquid replenishing portion containing a liquid flux for replenishment, a liquid holding portion connected to the lower end of the liquid replenishing portion with a first electromagnetic valve provided therebetween, and a liquid supply portion connected to the lower end of the liquid holding portion with a second electromagnetic valve provided therebetween. The lower end of the liquid supply portion is located in a flux storage tank in which a mixed gas is generated. A gas blow-in pipe for supplying a combustible gas is also located in the flux storage tank. The first electromagnetic valve and the second electromagnetic valve are controlled in given timing so that one opens and closes and then the other opens and closes, alternately and repeatedly. This prevents the pressure variation in the flux storage tank from affecting the liquid replenishing portion and the surface level of the liquid flux in the flux storage tank is kept unchanged.

Abstract: A method and apparatus (20) for ultrasonic bonding or other processing can include a rotatable ultrasonic horn member (28) and a rotatable axle member (34). The axle member is operatively joined to the horn member (28), and can provide a node plane (38). An isolation member (42) can be operatively joined to the axle member (34), and may have a location that is operatively proximate the node plane (38) of the axle member (34). In a particular aspect, the isolation member (42) can exhibit high rigidity. In a further feature, the isolation member (42) is capable of bending under a horn-life range of sonic frequencies to provide an operative component of motion along a radial direction (102), and an operative component of motion along an axial direction (100) of the isolation member.

Abstract: A friction stir welding tool for welding high-strength materials with one or more of the following features: 1) a curved transition geometry structure at the shoulder face and probe interface; 2) a tool material selected on the basis of an ultimate tensile strength determined at or above the temperature of the tool processing temperature; 3) a compressive stress at the point of crack fatigue introduced by mechanical or chemical means; and 4) a threaded probe with a) a major to minor thread diameter ratio that increases toward the distal end of the probe and/or b) with a curved thread root.

Abstract: Disclosed is a catalytic promoter for fluid catalytic cracking of hydrocarbons, comprising a HZSM-5 zeolite in an amount of 5-65 wt % based on the total weight of the catalytic promoter, said zeolite being modified with Zn and at least one element selected from the group consisting of P, Ga, Al, Ni and rare earth elements, the combined amount of said modifying elements being 0.01-10.37 wt % based on total weight of said modified HZSM-5 zeolite. A reduced olefin content in gasoline from catalytic cracking process, an increased gasoline octane number and an increased lower olefin yield can be obtained using said catalytic promoter.

Abstract: A guard catalyst, comprising an alumina support and molybdenum and/or tungsten and nickel and/or cobalt supported on the alumina support, wherein the total ammonia integral adsorption heat of said alumina support does not exceed 25 J/g, the percentage taken up by the ammonia integral adsorption heat of the ammonia differential adsorption heat greater than 100 kJ/mol does not exceed 10% of the total ammonia integral adsorption heat. Compared to the catalysts of the prior art, the guard catalyst has higher catalytic activity, less coke deposit, lower reduction rate of pore volume, better stability of activity, and higher strength.

Abstract: Self-aligning combination of a substrate with a chip is provided, using reverse patterns of raised recesses and raised shapes on the respective substrate and chip surfaces. High-force contact bump production is avoided. Reliable contact between a chip and substrate is achieved, with minimized skewing after chip placement.

Abstract: A method and system for making a monolithic intermetallic structure are presented. The structure is made from lamina blanks which comprise multiple layers of metals which are patternable, or intermetallic lamina blanks that are patternable. Lamina blanks are patterned, stacked and registered, and processed to form a monolithic intermetallic structure. The advantages of a patterned monolithic intermetallic structure include physical characteristics such as melting temperature, thermal conductivity, and corrosion resistance. Applications are broad, and include among others, use as a microreactor, heat recycling device, and apparatus for producing superheated steam. Monolithic intermetallic structures may contain one or more catalysts within the internal features.

Abstract: The bonding position between a bonding wire and an electrode is maintained accurately, an ultrasonic horn is mounted to a bonding machine by the attachment portions of support portions situated at minimum vibration amplitude points equally distant from a capillary in opposite directions in such a manner that it is supported on both sides, and the ultrasonic horn, capillary and bonding work portion are vibrated by ultrasonic waves to bond the end portion of the bonding wire.

Abstract: A friction stir welding tool is provided for joining together workpieces utilizing friction stir welding processes. The inventive tool includes a support body rotatable about a first axis and having a distal end defining a shoulder. A rotatable pin extends from the distal end of the support body downward and away from the shoulder. The shoulder of the support body includes at least one section that is tapered, with the taper extending downward toward the pin.

Abstract: A wire bonding device in accordance with the present invention is provided, which comprises: an XY table (2), a first holding member (8) supported by the XY table (2), a camera (9) supported by the first holding member (8), a second holding member (5) supported by the XY table (2), a capillary (7) held by the second holding member (5), a stationary base (3) for securing an object of bonding (4) in position, and a driving amount calculating unit (13) for computing the driving amount of the XY table (2) on the basis of the positional deviation of the camera (9) with respect to the origin of the XY table (2) due to temperature change in the first holding member (8) and the positional deviation of the capillary (7) with respect to the origin of the XY table (2) due to temperature change in the second holding member (5).

Abstract: An epitaxial article and method for forming the same includes a substrate having a textured surface, and an electrochemically deposited substantially single orientation epitaxial layer disposed on and in contact with the textured surface. The epitaxial article can include an electromagnetically active layer and an epitaxial buffer layer. The electromagnetically active layer and epitaxial buffer layer can also be deposited electrochemically.