Abstract: A semiconductor memory device includes a transmission circuit and a control circuit. The transmission circuit is configured to obtain write data and transmit that into a memory cell array according to the external clock signal when the chip selection signal is asserted. The control circuit is configured to control the transmission circuit to transmit first write data into the memory cell array when the chip selection signal changes from assertion to negation during the input period of the first write data, according to the external clock signal.

Abstract: A method for execution by a Dynamic Random Access (DRAM) cell processing circuit, includes charging a bit-line operably coupled to a plurality of DRAM cells of a DRAM memory device, including a current DRAM cell, at a first voltage to pre-charge the parasitic capacitance between ground and the bit-line to a second voltage, where the second voltage is between a logic 1 voltage and a logic 0 voltage. The method continues by sensing a voltage change on the bit-line based on a difference between a voltage stored on a DRAM cell capacitor of the current DRAM cell and the second voltage and outputting a read output voltage that is generated based on the sensed voltage change. The method then continues by supplying, while outputting the read output voltage, the read output voltage to the bit-line to refresh the voltage stored in the DRAM cell capacitor of the current DRAM cell.

Abstract: Disclosed herein are related to a memory array. In one aspect, the memory array includes a first set of memory cells including a first subset of memory cells and a second subset of memory cells. In one aspect, the memory array includes a first switch including a first electrode connected to first electrodes of the first subset of memory cells, and a second electrode connected to a first global line. In one aspect, the memory array includes a second switch including a first electrode connected to first electrodes of the second subset of memory cells, and a second electrode connected to the first global line.

Abstract: Apparatuses and methods for trimming input buffers based on identified mismatches. An example apparatus includes an input buffer having a first input stage circuit configured to receive a first signal, a second input stage circuit configured to receive a second signal, and an output stage coupled to the first and second input stage circuits and configured to provide an output signal. The first input stage circuit includes serially-coupled transistor pairs that are each coupled between the output stage and a bias voltage. Each of the plurality of serially-coupled transistors pairs are selectively enabled in response to a respective enable signal. The apparatus further including a trim circuit coupled to the first input stage circuit and comprising a plurality of programmable components. The trim circuit is configured to be programmed to provide the respective enable signals based on a detected transition voltage offset relative to a target transition voltage.

Abstract: A semiconductor memory device is provided. The semiconductor memory device can suppress increases in power consumption. As a result, damage to the data normally caused by row problems can be prevented. The semiconductor memory device includes a control unit. The control unit controls the time interval for refreshing the memory. If the frequency of a read/write access requirement to the memory during a predetermined period is higher, then the control unit shortens the interval between memory refresh operations.

Abstract: The present invention discloses a wordline driver circuit for a random-access memory (RAM), which can reduce leakage during power down mode. The circuit includes a pre-driver stage on header and footer. The pre-driver stage includes a strap buffer defining a header and comprising a first switch connecting a first set of wordlines to a first voltage. The pre-driver stage includes an input-output buffer defining a footer and comprising a second switch connecting a second set of wordlines to a second voltage. In the pre-driver stage, the strap buffer further includes a third switch connecting the second set of wordlines to the first voltage and a fourth switch connecting the first set of wordlines to the second voltage.

Abstract: Apparatuses, systems, and methods for direct refresh management (DRFM) commands. A controller provides a DRFM command to a memory along with a row address. A command decoder of the memory provides an activate command and then a pre-charge command along a signal line to a bank. During a tRP time after the pre-charge command before a next activate command, a DRFM sampling command is provided along the signal line which causes the address to be latched in a DRFM latch. Responsive to a later DRFM service command, one or more wordlines based on the address in the DRFM latch are refreshed.

Abstract: A semiconductor device includes an input control signal generation circuit configured to generate an input control signal when performing an internal operation and configured to adjust a time point at which the input control signal is generated, based on whether a frequency of a clock corresponds to a preset frequency range. The semiconductor device includes an output control signal generation circuit configured to generate an output control signal after a latency elapses when performing the internal operation. The semiconductor device includes a pipe latch circuit configured to latch input data based on the input control signal and configured to output the latched input data as output data based on the output control signal.

Abstract: A processing device is provided which includes a processor and a data storage structure. The data storage structure comprises a data storage array comprising a plurality of lines. Each line comprises at least one A latch configured to store a data bit and a clock gater. The data storage structure also comprises a write data B latch configured to store, over different clock cycles, a different data bit, each to be written to the at least one A latch of one of the plurality of lines. The data storage structure also comprises a plurality of write index B latches shared by the clock gaters of the lines. The write index B latches are configured to store, over the different clock cycles, combinations of index bits having values which index one of the lines to which a corresponding data bit is to be stored.

Abstract: A method of detecting, by a nonvolatile memory system, a defective memory cell block from among memory cell blocks, includes performing, after performing an erase operation, a read operation on at least some memory cells included in a target memory cell block based on an off-cell detection voltage that is different from a read reference voltage that distinguishes an off-cell on which no data is written from an on-cell on which data is written; counting a number of hard off-cells having a higher threshold voltage than the off-cell detection voltage from among the memory cells based on a result of performing the read operation; and identifying whether the target memory cell block is a defective memory cell block based on the number of counted hard off-cells.

Abstract: An electronic device includes a pre-charge control circuit configured to generate first and second pre-charge signals with pulses that are selectively generated based on a first and second output control signals that are generated during a read operation, and a data processing circuit configured to pre-charge one of first and second internal nodes based on the first and second pre-charge signals, latch internal data based on first and second input control signals, and output data that is generated from the latched internal data to an external device based on the first and second output control signals. The data is generated from the internal data that is transmitted through one of the first and second internal nodes.

Abstract: Provided are a digital phase interpolator, a clock signal generator, and a volatile memory device including the clock signal generator. The clock signal generator includes an internal signal generator configured to generate a first internal signal and a second internal signal, which mutually have a phase difference, based on an external clock signal, a first phase interpolator configured to interpolate the first internal signal with the second internal signal in response to a first control signal and generate a first interpolation signal, a second phase interpolator configured to interpolate the first internal signal with the second internal signal in response to a second control signal and generate a second interpolation signal, and a selector configured to select any one of the first interpolation signal and the second interpolation signal in response to a selection signal and output the selected interpolation signal as an internal clock signal.

Abstract: An apparatus may include a first inverter and a second inverter cross-coupled between a first node and a second node to store a signal state represented by complementary voltages at the first node and the second node. The apparatus may further include a first path defined by the second inverter that includes an impedance element to resist a flow of charge suitable to change the signal state. The apparatus may further include the first inverter and a third inverter selectively cross-coupled between the first node and the second node to store a received signal state represented by the complementary voltages at the first node and the second node responsive to an assertion of a write enable signal.

Abstract: Systems, apparatuses, and methods related to memory activation timing management are described herein. In an examples, memory activation timing management can include receiving a first command associated with a set of memory cells, activating the set of memory cells to perform a memory access responsive to the first command, pre-charging the set of memory cells associated with the first command, receiving a second command associated with the set of memory cells, determining that the set of memory cells associated with the first command is a recently activated set of the plurality of sets of memory cells, imparting a delay, and applying a sensing voltage to the set of memory cells associated with the second command to perform a memory access responsive to the second command.

Abstract: According to an embodiment of the present disclosure, a memory device for a logic-in-memory may include a cell array including a plurality of ternary memory cells, a row decoder configured to select at least one ternary memory cell from among the plurality of ternary memory cells, and a page buffer configured to provide a first value to the at least one ternary memory cell and latch a third value obtained by performing a logic operation on the first value and a second value stored in the at least one ternary memory cell and/or the second value.

Abstract: Methods, systems, and devices for cell data bulk reset are described. In some examples, a write pulse may be applied to one or more memory cells based on an associated memory device transitioning power states. To apply the wire pulse, a first subset of digit lines may be driven to a first voltage and a plate may be driven to a second voltage or a third voltage. While the digit lines and plate are driven to the respective voltages, one or more word lines may be driven to the second voltage or the third voltage. In some instances, the digit lines may be selected (e.g., driven) according to a pattern.

Abstract: A refresh circuit includes: a signal generation module, configured to generate an inversion signal and a carry signal based on a refresh command; an adjustment unit, configured to generate, if a first refresh signal and a second refresh signal are generated based on the refresh command, an inversion adjustment signal according to the inversion signal, and generate, if only the first refresh signal is generated based on the refresh command, the inversion adjustment signal according to an inversion signal corresponding to a first refresh signal generated based on a current refresh command, and generate the inversion adjustment signal only according to an inversion signal corresponding to a second refresh signal generated based on a next refresh command; and a counting module, configured to generate a first output signal and a second output signal, and invert the first output signal based on the inversion adjustment signal.

Abstract: Memories having a controller configured to perform methods during programming operations including apply a first voltage level to a data line selectively connected to a selected memory cell selected, apply a lower second voltage level to a select gate connected between the data line and the memory cell, decrease the voltage level applied to the data line from the first voltage level to a third voltage level while continuing to apply the second voltage level to the select gate, increase the voltage level applied to the select gate from the second voltage level to a fourth voltage level after the voltage level of the data line settles to the third voltage level, and apply a programming voltage to the memory cell after increasing the voltage level applied to the select gate to the fourth voltage level.

Abstract: A semiconductor package includes an external power supply node, a current monitoring node, and a plurality of semiconductor dies. Each semiconductor die of the plurality of semiconductor dies includes a first circuit and a second circuit. The first circuit is configured to supply a first operating current to that semiconductor die from the external power supply node. The second circuit is configured to measure the first operating current and output the measured first operating current to the current monitoring node. The measured first operating current from each semiconductor die of the plurality of semiconductor dies is summed on the current monitoring node.

Abstract: Apparatuses, systems, and methods for main sketch and slim sketch circuits for address tracking. The main sketch circuit receives a row address and changes selected count values in a first storage structure based on hash values generated based on the row address. Those count values are compared to a first threshold, and if that threshold is exceeded, a slim sketch circuit also receives the row address and changes selected count values in a second storage structure based on hash values generated based on the row address. Based on the selected count values from the first storage structure, the second storage structure, or combinations thereof, the row address may be determined to be an aggressor address.