Abstract: A single bridge magnetic field sensor includes a fluxguide mounted to a surface of a substrate. A bridge unit includes first, second, third, and fourth magnetoresistive elements mounted around the fluxguide and mounted on the surface of the substrate. A switching circuit is electrically connected to two voltage inputs, two grounding terminals, two voltage output terminals, and the four magnetoresistive elements. The switching circuit can proceed with circuit switching according to a magnetic field in each axis direction to be measured, thereby changing electrical connection between the voltage inputs, the grounding terminals, the voltage output terminals, and the four magnetoresistive elements. A measuring unit is electrically connected to the two voltage output terminals and the four magnetoresistive elements.

Abstract: A sense circuit and method for use in measuring the blown or unblown state of fusible links (fuses), particularly in integrated circuits. Embodiments include at least one additional reference resistance to allow for a greater margin of error in determining the actual state of a fuse. By having two or more reference resistances that can be independently selectable, additional combinations of reference resistance values are available to compare against the resistance of a fuse being tested.

Abstract: A corrosion sensor retainer assembly and method for predicting and detecting corrosion within a gas delivery system of a semiconductor substrate processing apparatus. The corrosion sensor retainer assembly comprises a laminate that includes a first insulating layer with a first port and a second insulating layer with a second port, wherein the first port and the second port are configured to retain a seal. The corrosion sensor retainer assembly includes a conductor housed within the laminate. The conductor forms a path that extends around the first port and the second port. At least a portion of the conductor has an exposed surface with a property that changes in the presence of corrosive gas or acid.

Abstract: A method may include applying a first current through the memory element and a first selection component. The memory element and the first selection component may be located along a memory line. The method may also include measuring a first potential difference across the memory line. The method may further include applying a second current through a second selection component, wherein the second selection component is located along a dummy line, and measuring a second potential difference across the dummy line. The method may additionally include determining the resistance of the memory element based on the first potential difference and the second potential difference. The first selection component may be activated and the second selection component may be deactivated to apply the first current. The first selection component may be deactivated and the second selection component may be activated to apply the second current.

Abstract: A PLC or other industrial controller programmed to locate ground faults in a networked high resistance grounded multi-drive system through network communications messaging to automatically place networked motor drives in various operational states to isolate individual drives for ground fault identification testing and selectively identify individual drives as suspected ground fault locations.

Abstract: A production method of a gas cell includes: forming a coating layer on a surface of a plate material; assembling a plurality of the plate materials having the coating layer formed thereon so as to form a cell surrounded by the surface having the coating layer formed thereon; and filling the formed cell with an alkali metal gas.

Abstract: There is provided a probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies. The probe card includes a printed circuit board on which a plurality of pads are formed; a block plate having a plurality of grooves and attached to the printed circuit board; a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; and a plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips.

Abstract: An electric-field sensor is provided that includes a voltage-controlled capacitor and generator circuitry. The voltage-controlled capacitor is influenceable by an electric field created by a target located a distance from the solid-state electric-field sensor. The generator circuitry is configured to generate a modulated voltage for driving the voltage-controlled capacitor to produce a modulated capacitance as the voltage-controlled capacitor is influenced by the electric field to enable measurement of the electric field. In this regard, the voltage-controlled capacitor and generator circuitry are configured such that, in operation, an electric field of the target causes a change in the modulated capacitance and a current flow through the voltage-controlled capacitor. An electric potential of the target, then, is measurable as a function of the change in magnitude of the current flow through the voltage-controlled capacitor.

Abstract: A power supply device supplying power to a device via a power line is provided, where the power supply device includes a first voltage generation unit configured to generate and supply a first direct voltage to the power line, a second voltage generation unit configured to generate and supply a second direct voltage lower than the first direct voltage to the power line, a measurement unit configured to measure a voltage of the power line, a control unit configured to control supply of the first direct voltage with the first voltage generation unit after starting supply of the second direct voltage with the second voltage generation unit, and a determination unit configured to determine a state of the power supply device based on the measured voltage and a first threshold value after starting the supply of the second direct voltage.

Abstract: A test system with rotational test arms for testing semiconductor components includes a transport device, a first test socket, a second test socket, a first test arm, and a second test arm. The first test socket and the second test socket are electrically connected to different test signals respectively and correspond to the first test arm and the second test arm. The first test arm and the second test arm test arms operate rotationally to carry and place the semiconductor components to the transport device, the first test socket and the second test socket, so the test time is improved.

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.

Abstract: A detection circuit for a relative error voltage, including: a first current mirror, a second current mirror, a third current mirror, a current sink and resistors R1, R2 and R3. A voltage signal to be detected V1 accesses the first current mirror via the resistor R2, and a voltage signal to be detected V2 accesses the second current mirror via the resistor R3; a mirrored-end of the first current mirror is connected to the current sink, and a mirroring-end thereof is connected to a mirrored-end of the third current mirror; a mirrored-end of the second current mirror is connected to the current sink, and a mirroring-end thereof is connected to a mirroring-end of the third current mirror; the current sink is grounded via the resistor R1; and the third current mirror converts double-ended currents of the first and the second current mirrors to single-ended currents to output as voltage signals.

Abstract: A current sensor includes a first current path including a first flat-shaped portion, and a first magnetoelectric conversion element arranged on the first current path and configured to detect magnetism generated when a current to be measured flows through the first current path, wherein the current sensor measures the current to be measured of a device to which the first current path is connected, a first conductive convex portion is provided, in the first current path, in a direction in which the current to be measured flows, and the first magnetoelectric conversion element is arranged at a position on the first current path, at which a magnetic flux density due to the current to be measured of a minimum frequency used in the device and a magnetic flux density due to the current to be measured of a maximum frequency used in the device substantially coincide with each other.

Abstract: An apparatus is disclosed for monitoring brushes, such as slipring or commutator brushes, on electrical machines. At least one electronic sensor is configured to be arranged in or on a brush apparatus of an electrical machine. This sensor is measuring the brush position at high speed and high resolution, and characterized in that it receives a brush position signal from the brushes in a contact-less fashion. Data is collected by a central unit which sends the data to a server computer. Client computers can consult data, and real time monitor the status of the machine.

Abstract: A method of calibrating a passive intermodulation (PIM) measurement device configured to transmit radio frequency (RF) signals and receive PIM signals using a directional antenna includes arranging the PIM measurement device connected to the directional antenna so that the directional antenna is configured to transmit an RF signal having a substantially unobstructed boresight axis, transmitting the RF signal, and obtaining a PIM measurement using the PIM measurement device. The PIM measurement device can then be calibrated based on the obtained PIM measurement.

Abstract: A semiconductor circuit includes a test control unit configured to generate a driving activation signal and a sensing activation signal in response to a command and an address; a pad; a driver configured to drive the pad to a predetermined level in response to activation of the driving activation signal; and a sensing unit configured to compare a voltage level of the pad with a reference voltage in response to activation of the sensing activation signal, and output a sensing signal.

Abstract: A capacitive parametric zero crossing detection circuit has a nonlinear voltage controlled capacitive device coupled to an input voltage to convert a zero crossing current pulse into zero crossing voltage signal.

Abstract: A circuit including a first switch receiving an input reference voltage, a second switch receiving an input testing voltage, the first switch and the second switch are electrically connected in parallel. The circuit further includes a first capacitor electrically connected in series with the first switch and the second switch. The circuit further includes a feedback stage comprising a feedback inverter electrically connected in parallel with a feedback switch, where the feedback stage is electrically connected in series with the first capacitor. The circuit further includes a first inverter electrically connected in series to the feedback stage, and a third switch electrically connected in series with the first inverter. The circuit further includes a second inverter electrically connected in parallel to a third inverter, the second inverter and the third inverter are electrically connected in series to the third switch, and the third inverter outputs a first output signal.

Abstract: A convex testing stack useful in association with a thermal control unit (TCU) that may be used to maintain a set point temperature for testing of a convex IC device under test (DUT) is configured to preserve the convex shape of the DUT.

Abstract: A coaxial connector including a connector main body is formed of an upper housing and a lower housing. An outer conductor includes a circular cylinder portion surrounding the periphery of a hole of the connector main body and configured to be inserted into an outer conductor of a mating coaxial connector. A main body portion is provided on the connector main body, and a fixation portion that is extended from the main body portion so as to sandwich the connector main body along with the main body portion. A fixed terminal is anchored to the connector main body. A movable terminal includes a fixation portion anchored to the connector main body, and a plate spring that extends from the fixation portion toward the fixed terminal and overlaps with the fixation portion at tip ends of the plate spring.