Patents Examined by D. A. Tone
  • Patent number: 5159155
    Abstract: Water is prevented from entering an electric connection box by providing an additional cover with a drain port out of register with drain ports on a normally-provided bottom cover. Baffles between the drain ports on the bottom cover and the drain port on the additional cover provide additional protection.
    Type: Grant
    Filed: August 7, 1990
    Date of Patent: October 27, 1992
    Assignee: Yazaki Corporation
    Inventor: Masahiko Nishihara
  • Patent number: 5147980
    Abstract: A junction box for flush mounting around a swimming pool, to connect electrical fixtures of the swimming pool, comprises a one piece plastic housing having a side wall defining an inner cylindrical chamber having an upper opening and a bottom wall. A pair of downwardly extending projections each carry an axial bore for leading wires into the chamber. A pair of blocks at diametrically opposed positions in the chamber carry a brass grounding bar to which bonding wires may be connected using screws. A potting compound substantially fills the chamber before the chamber is closed by a threaded lid which, when seated on the housing, lies flush with the deck of a swimming pool.
    Type: Grant
    Filed: February 19, 1991
    Date of Patent: September 15, 1992
    Inventor: Robert A. Ferguson, Jr.
  • Patent number: 5138521
    Abstract: This electronic component assembly includes: a body construction comprising a planar base portion, a fin provided as projecting from the planar base portion of the body construction, and a heat generating element fixedly attached to the planar base portion of the body construction. Thereby, very good heat dissipation is made available for the heat generating element, since no intermediate heat dissipating plate is used.
    Type: Grant
    Filed: April 6, 1990
    Date of Patent: August 11, 1992
    Assignee: Omron Tateisi Electronics Co.
    Inventors: Makoto Watanabe, Hiroyuki Nishi, Keiji Gemma
  • Patent number: 5077448
    Abstract: A shield member for attachment to a conventional insulative line stick as used by power linesmen and other electrical staff working on high voltage distribution lines protects the user of a line stick when closing cut-out assembly doors and engaging in similar activities. The shield member protects against the ejection of fuses or the blowing out or explosion of fuses. The shield member, in the form of a plate, clips onto the line stick, for example, by spring clip members attached to one arm of a bracket, another arm of the bracket being attached to the shield member.
    Type: Grant
    Filed: January 2, 1990
    Date of Patent: December 31, 1991
    Inventor: Philip B. Andrew
  • Patent number: 5045637
    Abstract: A magnetic shielding material is described which has a laminate structure comprising a ferromagnetic sheet having a high saturation magnetic flux density, a ferromagnetic sheet having a high magnetic permeability and a non-magnetic sheet. The high saturation magnetic flux density sheet includes a sheet of mold steel, silicon steel or an iron-cobalt alloy. The high magnetic permeability sheet includes an amorphous alloy foil or a laminate thereof. The magnetic shielding material may further have at least one foil of an electromagnetic wave-shielding material.
    Type: Grant
    Filed: July 17, 1990
    Date of Patent: September 3, 1991
    Assignee: Nippon Steel Corp.
    Inventors: Takashi Sato, Toshio Yamada, Masami Kobayashi
  • Patent number: 4983785
    Abstract: An electrical wiring box of molded insulating material is provided with bosses having screw holes for receiving a mounting screw that include two colinear portions of which a first portion proximate the front surface has an internal configuration, such as molded threads, that engage the mounting screw while permitting the mounting screw to be manually inserted therethrough without turning because of flexibility built into the boss structure. A second portion of the screw hole is of greater restriction for securely engaging the screw such as by self tapping. The flexibility of the boss is provided by a first center slot that extends from the screw hole to the boss exterior over a length substantially equal to the first portion of the screw hole. Second and third slots are located respectively on each side of the screw hole and provide projections respectively between the first and second slots and the first and third slots that flex to allow easy screw insertion through the first portion of the screw hole.
    Type: Grant
    Filed: March 2, 1989
    Date of Patent: January 8, 1991
    Assignee: Challenger Electrical Materials, Inc.
    Inventor: Earl S. Johnston
  • Patent number: 4950840
    Abstract: A flush type wall mounted coaxial connector assembly is provided for interconnection of coaxial cables. The assembly uses a recessed wall plate having at least one internal side which is at an obtuse angle to the surface and carrying a coaxial cable connector. As a result, the cable interconnection will be behind the wall surface and the extending coaxial cable will run substantially parallel to the wall surface and not intrude excessively into the room.
    Type: Grant
    Filed: September 16, 1985
    Date of Patent: August 21, 1990
    Inventor: Maurice F. Zetena
  • Patent number: 4870224
    Abstract: The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate surface. Conductive lines then couple the contacts to the peripheral edges of the substrate where one set of ends of a lead frame assembly mates with the conductors. An encapsulation technique is used to encapsulate the device, such that only the other set of ends of the lead frame assembly extends from the package. In an alternative embodiment, the integrated circuit is hermetically sealed by having a hermetic cover disposed over the integrated circuit. In a second alternative embodiment, the substrate is capable of having disposed upon it multiple integrated circuits. The present invention provides for a significant increase of lead count to die size ratio.
    Type: Grant
    Filed: July 1, 1988
    Date of Patent: September 26, 1989
    Assignee: Intel Corporation
    Inventors: William D. Smith, Richard Dennis, Nicholas Brathwaite, Richard C. Blish, II
  • Patent number: 4852250
    Abstract: Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bounding leads are placed in the opening in which the inner ends of the leads are connected together. The outer ends of the leads are aligned with the electrical conductors and bonded thereto and the inner ends of the leads are disconnected from each other. An electronic component is bonded to a bottom cover, aligned in the opening, and the inner ends of the leads are bonded to the electrical component. The bottom and a top cover are sealably connected to the body enclosing the opening and the electronic component.
    Type: Grant
    Filed: January 19, 1988
    Date of Patent: August 1, 1989
    Assignee: Microelectronics and Computer Technology Corporation
    Inventor: Daniel M. Andrews
  • Patent number: 4811170
    Abstract: A film-mounted circuit includes a support film, metallic conductor runs formed of solderable material disposed on the support film, the conductor runs each having two ends, a contact area containing solder material electroplated on one of the ends and external terminal contacts containing solder material electroplated on the other of the ends for receiving a solder connection to external wiring, and a metallic semiconductor chip having hump-like terminal contacts each having a side with a surface area soldered to a respective one of the contact areas, the terminal contacts being formed of solderable material at least at the surface area thereof, the solderable material of the surface area of the terminal contacts forming an alloy together with the solder material of the contact areas deposited by electroplating during soldering, the alloy having an alloy ratio defined by a eutectic point, the melting point temperature of which is at least 20.degree. C.
    Type: Grant
    Filed: February 21, 1986
    Date of Patent: March 7, 1989
    Assignee: Siemens Aktiengesellschaft
    Inventor: Erich Pammer
  • Patent number: 4801765
    Abstract: Disclosed is a semiconductor package with a high pin count. External contacts to the chip are provided by interdigitated leads formed from an upper and lower lead frame. The lower lead frame includes a paddle for mounting the chip. The upper lead frame initially has its leads tied together and a center portion is punched out to fit the size of the particular chip. The two lead frames are preferably coplanar in the area around the boundaries of the package encapsulant.
    Type: Grant
    Filed: January 6, 1986
    Date of Patent: January 31, 1989
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: Harold W. Moyer, Harry R. Scholz
  • Patent number: 4799128
    Abstract: A multilayer printed circuit board included a plurality of substrates bonded together in which the surface area of each substrate is divided into equal surface areas in which each area may contain the same number and lengths of lines of conductive elements, monitor holes, plated-through holes and circuit components. Connecting pads mounted within each substrate and intersected by a plated-through hole are positioned adjacent the conductive elements within the substrate and are connected to the elements by connecting segments. The circuit components mounted on a surface of the circuit board have their lead elements connected by bridge members to a monitor hole for testing purposes, said bridge member being severable to isolate the circuit components. A method for manufacturing such a multilayer printed circuit board is likewise disclosed.
    Type: Grant
    Filed: April 10, 1987
    Date of Patent: January 17, 1989
    Assignee: NCR Corporation
    Inventor: Paul T. H. Chen
  • Patent number: 4798916
    Abstract: A safety plate for electrical outlets is disclosed which includes a cover plate having a pair of openings for access to the receptacles of an outlet. A pair of slidable panels with apertures for the prongs of a plug, and are mounted to the back of the cover plate and held in place by a back plate with corresponding apertures. A spring biases the panels to misalign the panel apertures from the back plate apertures, such that there is no direct opening to the electrical contacts in the receptacles. The prongs of a plug may be used to slide a panel to align the apertures to access an outlet. A raised portion on each panel fits slidably within the cover plate opening and is flush with the prong surface, so that oversize plugs may be used with the safety plate. A gasket along the back perimeter of the cover plate seals any air leaks.
    Type: Grant
    Filed: October 19, 1987
    Date of Patent: January 17, 1989
    Inventors: Stephen M. Engel, Wallace W. Weiger
  • Patent number: 4734541
    Abstract: A radio frequency device comprising a signal processing means joined to electromagnectic transmission means, and latently susceptible, at the junction of the signal processing means and the electromagnetic transmission means, to adverse operating effects such as electromagnetic interference (EMI), and/or radio frequency leakage. At this junction is disposed a layer of a material which is blockingly effective against the adverse operating effects, and has a volumetric resistivity of from about 10.sup.-3 to about 2,000 ohm-centimeter.Also disclosed is a corresponding method of assembling a radio frequency device of such type.The invention has utility in application to devices such as impedance matching devices, impedance coupling devices, ground protection devices, radar transceivers, and signal splitters, a prefered application being to cable television junction boxes.
    Type: Grant
    Filed: January 16, 1987
    Date of Patent: March 29, 1988
    Assignee: Loctite Corporation
    Inventor: James P. Moran, Jr.
  • Patent number: 4733015
    Abstract: A plastic molded termination box assembly and a plastic molded end termination are both characterized by cavities defined by side walls tapering convergently toward one end and away from an open mouth, and separate parts defining a socket with walls directed convergently from an open mouth, the open mouths of the two parts being aligned, and an elastic grommet of a size and shape to be seated in the cavity in one part and socket in the other and to be compressed between the two parts when the parts are assembled together, the grommet having a conductor receiving opening in which a conductor is mounted. The conductor is mounted securely and the box and termination made weather tight by the compression of the grommet.
    Type: Grant
    Filed: May 5, 1986
    Date of Patent: March 22, 1988
    Assignee: Emerson Electric Co.
    Inventor: Bruce M. Barnes
  • Patent number: 4731501
    Abstract: Entrance terminal housing having walls sealed together at their junctions and defining a chamber opening. A removable cover is provided for the opening and a seal between walls and cover. In preferred arrangements, removable covers isolate terminals within the housing from other terminals and also isolate the terminals from the rest of the chamber. A fire resistant conductor sleeve is provided of flexible material and is of radially expansible and collapsible tapered tubular form for sealing around a range of numbers of conductors passing through a wall of the housing. In one construction, the sleeve has axially extending corrugations which allow for its expansion and collapse.
    Type: Grant
    Filed: November 6, 1985
    Date of Patent: March 15, 1988
    Assignee: Northern Telecom Limited
    Inventors: Gordon P. F. Clark, Richard Benoit, Zbigniew T. Karwowski
  • Patent number: 4731503
    Abstract: An electrically conducting hot melt adhesive is located at limited contact regions of a flexible circuit support, which typically carries a large scale integrated circuit (LSI) chip. A non-conducting hot melt adhesive is disposed between the limited contact regions at the non-contact regions. The resulting electrical connector can then be brought into contact with the corresponding areas of flexible or rigid circuit supports and through the application of heat and pressure, fuse the respective members so as to establish circuit paths between their limited contact regions via the electrically conducting hot melt adhesive. Heat and pressure are applied to the conducting hot melt adhesive in the same way as for an electrically non-conducting hot melt adhesive after contacting limited contact regions of another flexible circuit support or a rigid circuit support with the molten adhesive. Subsequently, the molten adhesive is left to cool so as to solidify.
    Type: Grant
    Filed: March 28, 1986
    Date of Patent: March 15, 1988
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Yoshitomo Kitanishi
  • Patent number: 4725692
    Abstract: An electronic device having a first type of external leads with a mechanical strength enhanced therefor and a second type of external leads smaller in a mechanical strength as compared with that of the first type of external leads. The mechanical strength of the first type of external leads is enhanced by making a width or a diameter of the first type of external leads larger than the width or the diameter of the second type of external leads, and the first type of external leads are disposed near edge portions or corner portions of the electronic device having a rectangular sealing means. Then the second type of external leads are disposed between the first type of external leads.
    Type: Grant
    Filed: May 22, 1986
    Date of Patent: February 16, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Ishii, Ichio Shimizu
  • Patent number: 4711974
    Abstract: An adapter fitting for connecting a corrugated flexible conduit to an electrical outlet box which includes a pair of substantially identical, semi-cylindrical cooperating fitting halves. Each fitting half carries a projecting, externally threaded neck portion, and the halves are joined by an internally threaded locking ring. A radially inwardly projecting corrugation engaging rib is provided on the inner side of each fitting half.
    Type: Grant
    Filed: April 30, 1986
    Date of Patent: December 8, 1987
    Assignee: The Carlon Company
    Inventor: Richard J. Borsh
  • Patent number: RE33256
    Abstract: A high frequency RFI/EMI shielding strip is disclosed which comprises a strip of two-layer circular knit metal mesh material, which is folded around the exterior of a resilient core element. Projecting edge margins of the conductive mesh material are gripped and clamped by a continuously extending flange structure, forming an integral part of a continuous clip element. The structure eliminates the necessity for knitting the conductive mesh material in-situ about the resilient core. Exceptional cost savings result, without compromise in shielding performance.
    Type: Grant
    Filed: September 14, 1987
    Date of Patent: July 10, 1990
    Assignee: Pawling Corporation
    Inventor: Robert B. Busby