Abstract: A method and apparatus for detecting copper (Cu) contamination on the backside of a wafer (120) begins by providing the wafer (120). The wafer (120) is rotated about a rotational axis via a motor/computer controlled wafer stage (118). In addition to rotation of the wafer (120), motor/computer control of a monochromator (116) is used to raster scan an X-ray beam (114b) across a surface of the rotating wafer (120). A plurality of X-ray detectors (122) are arrayed in one or more rows in close proximity to the scanned surface of the semiconductor wafer (120). The detectors (122), detect X-ray fluorescence emission from the surface of the wafer (120) whereby copper contamination of the wafer (120) can be determined in an accurate and time efficient manner which enables contamination detection in-line with normal wafer processing.

Abstract: The invention discloses a method for forming solder (114) on a substrate (112). The method includes forming a decal (110) with a plurality of solder regions (113). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder regions (113) on the decal (110) to the substrate (112).

Abstract: Die attach methods are provided. These methods include (a) providing a supply of die attach adhesive, (b) applying a portion of the die attach adhesive to a transfer member, and (c) contacting the lead frame paddle with the transfer member to print a layer of adhesive onto the lead frame paddle. Integrated circuit (IC) devices are also provided.