Abstract: One embodiment of the present invention includes applying a first value to a bit line, boosting word lines associated with the bit line and a common selection line to create a first condition based on the first value, and cutting off a boundary non-volatile storage element associated with the common selection line to maintain the first condition for a particular non-volatile storage element associated with the bit line and common selection line. A second value is applied to the bit line and at least a subset of the word lines are boosted to create a second condition for a different non-volatile storage element associated with the bit line and common selection line. The second condition is based on the second value. The first condition and the second condition overlap in time. Both non-volatile storage elements are programmed concurrently, based on their associated conditions.

Abstract: A precharge voltage supply circuit and a semiconductor device using the same are disclosed. The semiconductor device includes a first comparator for comparing a precharge voltage with a first reference voltage having a first voltage level and outputting a first compare signal as a result of the comparison, a second comparator for comparing the precharge voltage with a second reference voltage having a second voltage level and outputting a second compare signal as a result of the comparison, a decoder configured to receive and decode the first compare signal and the second compare signal and output a plurality of control signals as a result of the decoding, and a precharge voltage supply circuit configured to receive the plurality of control signals and supply the precharge voltage.

Abstract: A memory cell with a logic bit has a first one-time-programmable (“OTP”) memory element providing a first OTP memory element output and a second OTP memory element providing a second OTP memory element output. A logic operator coupled to the first OTP memory element output and to the second OTP memory element output and provides a binary memory output of the memory cell. In a particular embodiment, the first OTP memory element is a different type of OTP memory than the second OTP memory element.

Abstract: An advanced multi-bit magnetic random access memory device and a method for writing to the advanced multi-bit magnetic random access memory device. The magnetic memory includes one or more pair-cells. A pair-cell is two memory cells. Each memory cell has a magnetic multilayer structure. The structure includes a magnetically changeable ferromagnetic layer, a ferromagnetic reference layer having a non-changeable magnetization state, and a corresponding spacer layer separating the ferromagnetic layers. The memory cells are arranged such that an effective remnant magnetization of each of the cells is non-parallel from the cells' long-axis. This allows for more than one-bit to be stored as well as for efficient writing and reduced power consumption.

Abstract: A semiconductor memory device includes a first clock input unit for generating a first clock signal based on a signal at an intersection of a system clock signal and an inverted system clock signal; a second input unit for generating a second clock signal based on a signal at an intersection of the system clock signal and a reference signal; a third input unit for generating a third clock signal based on a signal at an intersection of the inverted system clock signal and the reference signal; a delay unit for generating a delay clock signal by delaying the first clock signal in response to a delay control signal; and a clock delay control unit for generating the delay control signal in response to a phase difference between the second clock signal and the delay clock signal or a phase difference between the third clock signal and the delay clock signal.

Abstract: A flash memory device programs cells in each row in a manner that minimizes the number of programming pulses that must be applied to the cells during programming. The flash memory device includes a pseudo pass circuit that determines the number of data errors in each of a plurality of subsets of data that has been programmed in the row. The size of each subset corresponds to the number of read data bits coupled from the memory device, which are simultaneously applied to error checking and correcting circuitry. During iterative programming of a row of cells, the pseudo pass circuit indicates a pseudo pass condition to terminate further programming of the row if none of the subsets of data have a number of data errors that exceeds the number of data errors that can be corrected by the error checking and correcting circuitry.

Abstract: A flash memory device includes an array having memory cells arranged in rows and columns. A high voltage generator is configured to supply a high voltage to the array during a programming operation. Write buffers corresponding to selected memory cells drive the selected memory cells with a program voltage or a program-inhibition voltage in response to input data. Each write buffer consumes a dummy cell current when input data is program-inhibited data. A current-voltage conversion circuit connected to the write buffers through a common sensing line supplies a current to the write buffers as the dummy cell current through the common sensing line and outputs a voltage proportional to the current, supplied to the write buffers. A current sink circuit discharges a current from an output of the high voltage generator in response to a voltage output from the current-voltage conversion circuit.

Abstract: A hybrid solid-state memory system is provided for storing data. The solid-state memory system comprises a volatile solid-state memory, a non-volatile solid-state memory, and a memory controller. Further, a method is provided for storing data in the solid-state memory system. The method comprises the following steps. A write command is received by the memory controller. Write data is stored in the volatile memory in response to the write command. Data is transferred from the volatile memory to the non-volatile memory in response to a data transfer request.

Abstract: Disclosed herein are a NAND flash memory device and a method of forming a well of the NAND flash memory device. Triple wells of a NAND flash memory device are formed within a cell region in plural. A cell block including flash memory cells is formed on the triple wells. Accordingly, during an erase operation of a flash memory device, a stress time for non-selected blocks can be reduced and erase disturbance can be also prevented, through the plurality of the wells. Further, capacitance between the triple P wells and the triple N well is reduced since triple P wells are divided. Therefore, well bias charging and discharging time can be reduced and an overall erase time budget can be thus reduced.

Abstract: A semiconductor memory device includes: a memory array; an internal address supplying unit configured to produce a first internal address in response to an external address; a first fuse unit configured to includes fuses and anti-fuses integrated; an address switching circuit configured to produce a second internal address on the basis of the first internal address; and a decoder circuit configured to select a memory cell of the memory array in response to the second internal address. The internal address supplying unit is configured to be capable of fixing a specific address bit in the first internal address. The second internal address includes: fuse independent address bits produced from address bits which is not the specific address bit in the first internal address, independently of a state of the first fuse unit, and a fuse dependent address bit having a value corresponding to the state of the first fuse unit and a vale of the specific address bit.

Abstract: There is provided a semiconductor memory device which offers enhanced speed in burst mode. The semiconductor memory device has a burst mode for serially reading multiple bits of data in a fixed order in synchronization with both edges of a clock. Multiple memory blocks are geometrically arranged correspondingly to the multiple bits. An address selection circuit selects a memory cell from the memory blocks. Data read from the memory blocks is parallel transmitted to an output circuit. The output circuit first outputs data from a memory block to which data is transmitted fastest among the multiple memory blocks. The output circuit serially outputs data in the fixed order in synchronization with both edges of the clock.

Abstract: A writing dynamic power control circuit is disclosed, which comprises a BL and its complementary BLB, at least one memory cell coupled to both the BL and BLB, a first NMOS transistor having a source, a drain and a gate coupled to the BL, the Vss and a first data signal, respectively, a second NMOS transistor having a source, a drain and a gate coupled to the BLB, the Vss and a second data signal, respectively, wherein the second data signal is complementary to the first data signal, a first PMOS transistor having a source, a drain and a gate coupled to a high voltage power supply (CVDD) node, the BLB and the BL, respectively, and a second PMOS transistor having a source, a drain and a gate coupled to the CVDD node, the BL and the BLB, respectively.

Abstract: Shifts in the apparent charge stored on a floating gate of a non-volatile memory cell can occur because of coupling of an electric field based on the charge stored in adjacent floating gates. The shift in apparent charge can lead to erroneous readings by raising the apparent threshold voltage, and consequently, lowering the sensed conduction current of a memory cell. The read process for a selected memory cell takes into account the state of one or more adjacent memory cells. If an adjacent memory cell is in one or more of a predetermined set of programmed states, a compensation current can be provided to increase the apparent conduction current of the selected memory cell. An initialization voltage is provided to the bit line of the programmed adjacent memory cell to induce a compensation current between the bit line of the programmed adjacent memory cell and the bit line of the selected memory cell.

Abstract: A shielding circuit for preventing a sense current of a target cell from the influence of a source current of first adjacent cell includes a pre-discharge device, first and second biasing units, first and second voltage pull-down units, and a connection units. The pre-discharge device is for setting the voltage of the sense node to a negative voltage. The first and second biasing units are for biasing the source voltage of the target and the first adjacent cell equal to a biasing voltage, respectively. The first and second voltage pull-down units are for pulling down the source voltage of the target and the first adjacent cell closing to a ground level, respectively. The connection unit is for receiving and outputting the sense current passing through the first biasing unit to the sense node.

Abstract: A method and system for providing and utilizing a magnetic memory are described. The magnetic memory includes a plurality of magnetic storage cells. Each magnetic storage cell includes magnetic element(s) programmable due to spin transfer when a write current is passed through the magnetic element(s) and selection device(s). The method and system include driving a first current in proximity to but not through the magnetic element(s) of a portion of the magnetic storage cells. The first current generates a magnetic field. The method and system also include driving a second current through the magnetic element(s) of the portion of the magnetic storage cells. The first and second currents are preferably both driven through bit line(s) coupled with the magnetic element(s). The first and second currents are turned on at a start time. The second current and the magnetic field are sufficient to program the magnetic element(s).

Abstract: A nonvolatile ferroelectric perpendicular electrode cell comprises a ferroelectric capacitor and a serial PN diode switch. The ferroelectric capacitor includes a word line perpendicular electrode as a first electrode and a storage perpendicular electrode as a second electrode apart at a predetermined interval from the word line perpendicular electrode to have a column type, where a ferroelectric material is filled in a space where the first electrode are separated from the second electrode. The serial PN diode switch, which is connected between a bit line and the ferroelectric capacitor, selectively switches a current direction between the bit line and the ferroelectric capacitor depending on voltage change between the bit line and the ferroelectric capacitor.

Abstract: A semiconductor storage device floats the gate of a conventional transistor between two capacitors to store a logic state which can be utilized to store the condition of a circuit such as a latching type circuit such as a flip-flop or register prior to a power down operation to save power. The gate and first terminals of the two capacitors preferably share the same conductive line such as a polysilicon segment. A second transistor and a second set of capacitors store the complementary state of the logic state so that complementary signals are provided for detecting the stored logic state. After the time for power down has ended, the state of the semiconductor storage device made up of the two transistors and four capacitors is sensed, and the detected logic state is loaded back into the latching type circuit.

Abstract: A semiconductor integrated circuit device includes: a plurality of memories and a judgement circuit. Each of plurality of memories is configured to include a Built-in Self Test (BIST) circuit that examines a possibility of repairing a defect and outputs a repair possibility signal indicating the possibility. The judgement circuit is configured to judge whether or not all of the plurality of memories can be repaired based on a plurality of the repair possibility signals. Each of the plurality of the repair possibility signals is outputted from one of the plurality of memories.

Abstract: Systems and methods in accordance with various embodiments can provide for reduced program disturb in non-volatile semiconductor memory. In one embodiment, select memory cells such as those connected to a last word line of a NAND string are programmed using one or more program verify levels or voltages that are different than a corresponding level used to program other cells or word lines. One exemplary embodiment includes using a lower threshold voltage verify level for select physical states when programming the last word line to be programmed for a string during a program operation. Another embodiment includes applying a lower program voltage to program memory cells of the last word line to select physical states. Additional read levels are established for reading the states programmed using lower verify levels in some exemplary implementations.

Abstract: A DRAM refresh period adjustment technique based on the retention time of one or more unused memory cell(s) having characteristics very similar to the characteristics of the memory cell(s) with the shortest retention time used in the DRAM array. In a particular implementation of the technique of the present invention, the refresh period of a DRAM array is adjusted through the use of one or more of the DRAM bits that fail to meet the retention time requirement and have, therefore, been replaced by redundant DRAM bits. These replaced bits are then used to indicate the refresh period for the DRAM is the maximum it can be for the DRAM under then current operating conditions.