Abstract: A method and apparatus for trimming a reference cell in a semiconductor memory device are provided. The method includes generating an internal bias current capable of being trimmed, and trimming the reference cell based on the internal bias current. The semiconductor memory device includes a reference cell in which a reference cell current flows between a drain and a source based on a bias voltage, an internal bias current generator configured to generate an internal bias current capable of being trimmed, and a trimming circuit configured to trim the reference cell based on the internal bias current.

Abstract: A read-and-write assembly is described. The read-and-write assembly includes one or more coils and magnetizable pillars. The magnetizable pillar has a flask shape and a neck wrapped in the coil.

Abstract: A first timing control unit controls an active timing of a first control signal to output a first driving control signal. A first data input/output unit transmits write data from a data input/output buffer to a global input/output line or transmits read data from the global input/output line to the data input/output buffer, in response to the first driving control signal. A second timing control unit controls an active timing of a second control signal to output a second driving control signal. A second data input/output unit transmits the write data from the global input/output line to a local input/output line or transmits the read data from the local input/output line to the global input/output line, in response to the second driving control signal.

Abstract: A bit-line voltage generator is provided. The bit-line voltage generator includes a discharge enhanced bias source and a switch unit.

Abstract: Proposed is a highly reliable storage apparatus with fast access speed and low power consumption, as well as a controller and control method for controlling such a storage apparatus. This storage apparatus is equipped with a flash memory that provides a storage extent for storing data, a disk-shaped memory device with more data write cycles than the flash memory, and a cache memory with faster access speed than the flash memory. Data provided from a host system is stored in the cache memory, this data is read from the cache memory at a prescribed timing, data read from the cache memory is stored in the disk-shaped memory device, and, when a prescribed condition is satisfied, this data is read from the disk-shaped memory device, and the data read from the disk-shaped memory device is stored in the flash memory.

Abstract: A semiconductor integrated circuit includes: a memory cell array including a plurality of SRAM memory cells; a characteristic measuring circuit including a plurality of transistor circuits connected in parallel; and a first terminal. The plurality of transistor circuits each include a first transistor configured in the same manner as one of transistors included in one of the SRAM memory cells. The first transistor is connected so as to control current between the first terminal and a node at a reference potential according to a voltage supplied to a gate of the first transistor.

Abstract: A semiconductor memory device includes first and second column selection signal lines, first bit lines being and second bit lines. The first bit lines are associated with the first column selection signal line. The second bit lines are associated with the second column lines. At least one of the first bit lines is positioned between two of the second bit lines.

Abstract: A Static Random Access Memory (SRAM) cell having a source-biasing mechanism for leakage reduction. In standby mode, the cell's wordline is deselected and a source-biasing potential is provided to the cell. In read mode, the wordline is selected and responsive thereto, the source-biasing potential provided to the cell is deactivated. Upon completion of reading, the source-biasing potential is re-activated.

Abstract: Embodiments of the invention generally provide an apparatus and technique for sharing an internally generated voltage between devices of a multi-chip package (MCP). The internally generated voltage may be shared via a conductive structure that electrically couples the devices and carries the internally generated voltage.

Abstract: Disclosed is a semiconductor memory device, in which the refresh period of a fail cell or cells is set so as to be shorter than that of the normal cells, comprises a control circuit for exercising control in such a manner that, if, when refreshing the cell of a first address, generated responsive to a refresh command, with an input control signal being of a first value, a second address, differing as to the value of a predetermined bit from the first address, is determined to correspond to a fail cell, based on the information ore-programmed in a refresh redundant ROM, the cell of the second address is refreshed, and also in such a manner that, if, with the input control signal of a second value, the second address, differing as to the value of a predetermined bit from the first address, is determined to correspond to a fail cell, based on the predetermined information, only the cell of the second address is refreshed, without refreshing the cell of the first address, generated responsive to the refresh comma

Abstract: Disclosed is a data input circuit of a synchronous memory device for detecting and amplifying data, and transferring the amplified data for storage, which including: a write strobe signal converter for receiving a write strobe signal, dividing the received write strobe signal, and outputting control signals of predetermined bits, the control signals being synchronized with rising and falling edges of the divided signal; and a latch unit for latching data corresponding to the bits by means of the control signals, and outputting the data for the detection and amplification of the data. The data input circuit may include a first delay unit for delaying the data in order to match setup-hold time, a second delay unit for performing delay for adjusting the data outputted from the latch unit, and a third delay unit for performing delay for adjusting the write strobe signal outputted from the latch unit.

Abstract: A semiconductor memory device and an arrangement method thereof are disclosed. The semiconductor memory device comprises column selecting signal lines and global data IO signal lines arranged on the same layer in the same direction above a memory cell array; word lines and first local data IO signal lines arranged on a different layer from the column selecting signal lines above the memory cell array, in a perpendicular direction to the column selecting signal lines; and second local data IO signal lines arranged on a different layer from the column selecting signal lines and the word lines above the memory cell array, in the same direction as the first local data IO signal lines.

Abstract: There is provided a semiconductor storage device including a substrate area, a first and a second isolation area, a first well area where the first transistor is placed, a second well area where the second transistor to output a first voltage to bring the first transistor into non-conduction is placed, and a third well area where the third transistor to output a second voltage to bring the first transistor into conduction is placed. The second and third well areas and the second isolation area are formed between two of the first well area, the second isolation area is formed between the second well area and one of the first well area, and the third well area is formed between the second well area and another one of the first well area.

Abstract: In a current reference generator device, a voltage reference generator stage generates a reference voltage (Vref) and an active element output stage receives the reference voltage (Vref) and outputs a reference current (Iref) as a function of the reference voltage (Vref). A control stage is operatively coupled to the voltage reference generator stage and to the active element output stage and controls a first trimmable parameter (m) associated to the voltage reference generator stage and a second trimmable parameter associated to the active element output stage, so as to compensate for changes in a value of the reference current (Iref) due to manufacturing process deviations.

Abstract: One or more embodiments of the present disclosure provide methods, devices, and systems for operating non-volatile multilevel memory cells. One method embodiment includes programming a memory cell to one of a number of different threshold voltage (Vt) levels, each level corresponding to a program state. The method includes programming a reference cell to a Vt level at least as great as an uppermost Vt level of the number of different Vt levels, performing a read operation on the reference cell, and determining a number of read reference voltages used to determine a particular program state of the memory cell based on the read operation performed on the reference cell.

Abstract: The present invention is a multi-phase method, circuit and system for programming non-volatile memory (“NVM”) cells in an NVM array. The present invention may include a controller to determine when, during a first programming phase, one or more NVM cells of a first set of cells reaches or exceeds a first intermediate voltage, and to cause a charge pump circuit to apply to a terminal of the one or more cells in the first set second phase programming pulses to induce relatively greater threshold voltage changes in cells having less stored charge than in cells having relatively more stored charge.

Abstract: The disclosure generally relates to a method and apparatus for decreasing the frequency of refreshing a memory cell in communication with a word line and a bit line. A method according to one embodiment includes: providing a DRAM circuit having a memory cell, a sense amplifier including a pre-charge circuit connected to a first voltage source and a back-to-back inverter including a first NMOS transistor having a source, a second NMOS transistor having a source, a first PMOS transistor having a source and a second PMOS transistor having a source; maintaining the voltage of the sources of the first and second PMOS transistors at a first voltage during normal operation; and raising the voltage of the sources of the first and second PMOS transistors from the first voltage to a second voltage during a refresh operation.

Abstract: A method and apparatus are provided for sensing in low voltage DRAM memory cells. A method according to one embodiment includes: providing a DRAM circuit having a memory cell, a sense amplifier including a pre-charge circuit connected to a first voltage source and a back-to-back inverter including a first and second NMOS transistor, each having a source and a first and second PMOS transistor, each having a source. The method further includes the steps of maintaining the voltage of the sources of the first and second NMOS transistors at a first voltage during normal operation and lowering the voltage of the sources of the first and second NMOS transistors from the first voltage to a second voltage during a read operation.

Abstract: A semiconductor memory device performs a refresh operation sequentially for a word line selected based on a row address when receiving a refresh request, and comprises: a memory cell array divided into M banks; a refresh counter for sequentially outputting a count value corresponding to the word line to be refreshed in response to the refresh request; and a row address converter for supplying row addresses different from one anther in at lest two banks among the M banks by converting the count value. In the semiconductor memory device, a predetermined number of selected word lines are refreshed at the same time in the banks in accordance with different patterns from one another, and the maximum value of the total number of the selected word lines refreshed at the same time for all the M banks is controlled to be lower than 2M.

Abstract: A method of operating an electronic device includes storing a first plurality of bits of digital information in a memory using a first number of memory cells in parallel. The first plurality of bits of digital information are for operating the device when operating parameters are not within a nominal range. The method also includes storing a second plurality of bits of digital information in the memory using a second number of memory cells in parallel. The second plurality of bits of digital information are for operating the device when operating parameters are within a nominal range.