Abstract: A semiconductor memory device includes a plurality of memory banks, a data pin for inputting and outputting data, and input/output buffers connected to the data pin. Each of the memory banks has a plurality of memory cells for storing the data. The data pin is enabled and disabled by a pin selection signal. The data pin performs a normal data input/output operation when the pin selection signal is enabled and a termination resistor connected to the data pin is off when the pin selection signal is disabled. The input/output buffers make a termination resistor connected to the data pin off when the pin selection signal is disabled.

Abstract: A sense amplifier power supply circuit includes an overdriving unit configured to apply a first voltage to a sense amplifier in response to a first enable signal, a sense amplifier driving unit configured to apply a second voltage to the sense amplifier in response to a second enable signal, and a switching unit configured to selectively apply the first voltage or the second voltage to the sense amplifier in response to the first enable signal and the second enable signal.

Abstract: Some embodiments are directed to circuits comprising first and second PLLs. The first PLL generates a first clock signal based on a reference clock signal. The second PLL generates a second clock signal based on the reference clock signal and is synchronized with the first clock signal.

Abstract: A semiconductor storage device according to the present invention comprises a plurality of memory cells each provided with an access transistor in which a source is connected to a bit line and a gate is connected to a word line and a capacitor in which a storage electrode is connected to a drain of the access transistor, the plurality of memory cells being placed in a matrix shape in column and row directions, a sense amplifier circuit connected to the source of the access transistor via the bit line, a bit-line precharge voltage generating circuit for generating a bit-line precharge voltage lower than a sense amplifier supply voltage to be supplied to the sense amplifier circuit and supplying the generated bit-line precharge voltage to the bit line, and a cell plate voltage generating circuit for generating a cell plate voltage set to be lower than the bit-line precharge voltage and supplying the generated cell plate voltage to a plate electrode of the capacitor.

Abstract: An integrated circuit and methods for laying out the integrated circuit are provided. The integrated circuit includes a first and a second transistor. The first transistor includes a first active region comprising a first source and a first drain; and a first gate electrode over the first active region. The second transistor includes a second active region comprising a second source and a second drain; and a second gate electrode over the second active region and connected to the first gate electrode, wherein the first source and the second source are electrically connected, and the first drain and the second drain are electrically connected.

Abstract: Disclosed is a semiconductor memory including ferroelectric capacitors. Memory cells each including a ferroelectric capacitor and an insulted-gate-type cell transistor are connected to a corresponding one of bit lines. Insulated-gate-type separating transistors are connected between multiple bit-line selecting transistors and multiple sense amplifiers, respectively. When the separating transistors are turned on, data retained in the sense amplifiers are capable of being written to the memory cells during the same time period substantially.

Abstract: An output data strobe signal generating method and a memory system that includes a plurality of semiconductor memory devices, and a memory controller for controlling the semiconductor memory devices, wherein the memory controller provides a command signal and a chip selecting signal to the semiconductor memory devices. One or more of the semiconductor memory devices may detect a read command and a dummy read command in response to the command signal and the chip selecting signal and generate one or more preamble signals based on a calculated preamble cycle number.

Abstract: A semiconductor device includes sectors having memory cells connected to local word lines, decoders selecting the sectors, and a circuit generating, in erasing of a selected sector, a control signal that causes a corresponding one of the decoders associated with the selected sector to be temporarily unselected. Each of the sectors includes a pull-up transistor that is driven by a corresponding one of the decoders via a corresponding one of global word lines connecting the sectors and drives one of the local word lines, and the pull-up transistor is kept OFF by the control signal.

Abstract: A semiconductor device that includes a memory cell having a junction field effect transistor (JFET) used to form a content addressable memory (CAM) cell is disclosed. The JFET may include a data storage region disposed between a first and second insulating region. The data storage region provides a first threshold voltage to the JFET when storing a first data value and provides a second threshold voltage to the JFET when storing a second data value. The memory cell is a dynamic random access memory (DRAM) cell and can be used to form a CAM cell. The CAM cell may be a ternary CAM cell formed with as few as two JFETs.

Abstract: A system, method and apparatus for clock and power fault detection for a memory module is provided. In one embodiment, a system is provided. The system includes a voltage detection circuit and a clock detection circuit. The system further includes a controller coupled to the voltage detection circuit and the clock detection circuit. The system also includes a memory control state machine coupled to the controller. The system includes volatile memory coupled to the memory control state machine. The system further includes a battery and battery regulation circuitry coupled to the controller and the memory control state machine. The battery, battery regulation circuitry, volatile memory, memory control state machine, controller, clock detection circuit and voltage detection circuit are all collectively included in a unitary memory module.

Abstract: A current-mode sense amplifier comprises a first current mirror, a second current mirror and an amplifying circuit. The first current mirror outputs a cell current to a memory cell and duplicates the cell current to generate a mirrored cell current. The second current mirror outputs a reference current to the reference cell and duplicates the reference current to generate a mirrored reference current. The amplifying circuit comprises a first switch, second switch, third switch and fourth switch. The first switch has first and second terminals for respectively receiving the mirrored cell and reference currents. The second and third switches have first terminals respectively coupled to the first and second terminals of the first switch, and control terminals respectively coupled to the second and first terminals of the first switch. The fourth switch is connected to second terminals of the second and third switches.

Abstract: Provided are a complementary nonvolatile memory device, methods of operating and manufacturing the same, a logic device and semiconductor device having the same, and a reading circuit for the same. The complementary nonvolatile memory device includes a first nonvolatile memory and a second nonvolatile memory which are sequentially stacked and have a complementary relationship. The first and second nonvolatile memories are arranged so that upper surfaces thereof are contiguous.

Abstract: Memory die are provided with programmable chip enable circuitry to allow particular memory die to be disabled after packaging and/or programmable chip address circuitry to allow particular memory die to be readdressed after being packaged. In a multi-chip memory package, a memory die that fails package-level testing can be disabled and isolated from the memory package by a programmable circuit that overrides the master chip enable signal received from the controller or host device. To provide a continuous address range, one or more of the non-defective memory die can be readdressed using another programmable circuit that replaces the unique chip address provided by the pad bonding. Memory chips can also be also be readdressed after packaging independently of detecting a failed memory die.

Abstract: A memory element which has high affinity with a conventional semiconductor process, which has a switching function of completely interrupting electric conduction paths by in a mechanical manner, and in which nonvolatile information recording is enabled is realized. An electromechanical memory which is formed on a substrate, which is formed by interposing a memory cell by electrodes, and which has a movable electrode that is a beam stretched in the air via a post portion is realized. According to the configuration, a nonvolatile memory can be realized by a simple structure, and it is possible to realize a high-performance electromechanical memory which is conventionally difficult to be realized, and in which the power consumption is low and the cost is low, and an electric apparatus using it.

Abstract: A nonvolatile ferroelectric memory device includes a plurality of memory cells connected serially between a bit line and a sensing line, a first switching unit configured to selectively connect the memory cells to the bit line in response to a first selecting signal, and a second switching unit configured to selectively connect the memory cells to the sensing line in response to a second selecting signal. The first switching unit and the second switching unit have the same structure as that of the memory cell.

Abstract: If memory cell blocks are laid out in a conventional manner to create a memory chip with a capacity of an odd power of 2 by using memory cells whose aspect ratio is 1:2, the chip will take a 1:1 shape and become difficult to enclose in a package of a 1:2 shape. In addition, such conventional layout of memory cell blocks to form the 1:2 shape causes the area of a peripheral circuit region to be limited by the memory blocks, pads to be arranged collectively in the central section of the chip, and wiring to become dense during the enclosure of the chip in the package. In this invention, therefore, four memory blocks, BANK0, BANK1, BANK2, BANK3, BANK3, are constructed into an L shape and then these memory blocks are properly combined and arranged to construct a chip of nearly a 1:2 shape in terms of aspect ratio.

Abstract: The present invention provides a storage device including a first electrode, a plurality of second electrodes arranged opposite the first electrode across a gap, and a particle which is selectively placed in one of the gaps between the first electrode and the second electrodes and which is movable between the first electrode and the second electrode and between the adjacent second electrodes. A stored state is determined utilizing the presence of the particle.

Abstract: Systems and methods involve the use of a flash memory device having multiple flash memory cells. A first interface is adapted to receive power for selectively programming each flash memory cell. A second interface is adapted to receive power supplied to logic level circuitry to perform the selection of flash memory cells to be supplied with power from the first input during a write operation.

Abstract: A semiconductor memory device may include a memory cell array and at least one fuse box. The memory cell array may include a plurality of sub-array blocks, and a fuse box may include a plurality of fuse groups, each group corresponding to a sub-array block. Each fuse group may have a plurality of fuses, wherein the fuses are intermittently arranged such that fuses of the same fuse group are not adjacent to each other. Each fuse group may further include a master fuse and a fuse mode determining circuit for determining a fuse-on-mode or a fuse-off-mode for the repair operation of a sub-array block. Consequently, during a repair operation using a conventional laser having a relatively large beam spot, the designated fuse of one fuse group as well as adjacent fuses of a different group may be cut without hindering the repair operation of the sub-array block.

Abstract: The present invention relates to a nonvolatile semiconductor memory, and more specifically relates to a nonvolatile semiconductor memory with increased program throughput. The present invention provides a nonvolatile semiconductor memory device with a plurality of block source lines corresponding to the memory blocks, arranged in parallel to the word lines, a plurality of global source lines arranged in perpendicular to the block source lines; and a plurality of switches for selectively connecting corresponding ones of the block source lines and the global source lines.