Patents Examined by Daniel H Lee
  • Patent number: 11905441
    Abstract: Apparatuses, methods, and systems are disclosed for an adhesive including an activated portion and an unactivated portion. The adhesive is interposed between and binds the first substrate to a second substrate. The unactivated portion includes moisture, and the activated portion is activated to adhere in response to the removal of moisture. Similarly, the unactivated portion of the adhesive may be activated in response to the removal of moisture, removal of air, applying radiation, heating, and/or catalyzing a functional group.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: February 20, 2024
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Bouziane Yebka, Tin-Lup Wong, Philip J. Jakes
  • Patent number: 11879079
    Abstract: The invention relates to a film adhesive for bonding at least two joint partners, containing an adhesive for an adhesive connection of the joint partners and a flat textile support material. The adhesive is applied onto the flat textile support material in the form of a film, and the flat textile support material has at least one first section which adjoins at least one second section of the support material. The support material of the first section has a modified material and/or is chemically and/or geometrically modified compared to the support material of the second section such that after curing the adhesive, the adhesive connection has a mechanical property in the region of the first section relating to an elongation at break or fracture toughness which differs from the mechanical property of the adhesive connection in the region of the second section.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: January 23, 2024
    Assignee: DEUTSCHES ZENTRUM FUR LUFT—UND RAUMGAHRT E.V.
    Inventor: Lennert Heilmann
  • Patent number: 11873259
    Abstract: The present invention relates to a system and method for the production of gypsum board using starch pellets. In accordance with the present disclosure, the starch necessary for board formation is provided in the form of starch pellets. These pellets are mixed with a gypsum slurry in a mixer. The pellets are initially insoluble and do not dissolve. However, during subsequent drying stages, the pellets become soluble and dissolve into the gypsum phase. This both provides the desired starch component and also results in the formation of voids within the set gypsum.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: January 16, 2024
    Assignee: CertainTeed Gypsum, Inc.
    Inventors: John W. College, Shane Libunao, Mark Harris
  • Patent number: 11802224
    Abstract: The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: October 31, 2023
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Aya Adachi, Yudai Ogata, Noriyuki Uchida, Yoshito Arai
  • Patent number: 11787988
    Abstract: A two-component solventless adhesive composition is disclosed. The composition comprises an isocyanate component comprising an isocyanate prepolymer that is the reaction product of a polyisocyanate and an isocyanate reactive component comprising at least 40 wt % of a polyester polyol, based upon the dry weight of the isocyanate reactive component, a polyol component having an average functionality between 2.5 and 4.5 and an average molecular weight between 250 and 1,000, and comprising at least 30 wt % of a polyether polyol, based upon the dry weight of the polyol component, and an adhesion promoter. A method for forming laminates comprising the disclosed adhesive compositions is also disclosed.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: October 17, 2023
    Assignee: Dow Global Technologies LLC
    Inventor: Rui Xie
  • Patent number: 11773305
    Abstract: A silicone pressure sensitive adhesive is prepared by curing a radical reaction curable composition. The silicone pressure sensitive adhesive adheres to various silicone elastomers and is useful in preparation of components of flexible display devices.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: October 3, 2023
    Assignee: Dow Silicones Corporation
    Inventors: Qing Cao, Yan Zhou, Bochi Xu
  • Patent number: 11773296
    Abstract: A method for curing an adhesive composition includes: arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend that contains, at least at its surface, a first light-to-heat conversion material that generates heat by absorbing laser light of the first wavelength; and curing the adhesive composition by irradiating the adhesive composition and the first adherend with laser light of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure is manufactured by bonding the adhesive composition to the first adherend by using the method for curing an adhesive composition.
    Type: Grant
    Filed: February 16, 2018
    Date of Patent: October 3, 2023
    Assignee: OMRON Corporation
    Inventors: Takekazu Komori, Daisuke Sato, Kyoji Kitamura, Yosuke Tatsuno, Yuki Hoga
  • Patent number: 11767444
    Abstract: A plastisol formulation configured for use in coating substrates and a method for applying the formulation. The inventive formulation has exceptional flexibility over a wide range of temperatures. It is comprised of polyvinyl chloride, a plasticizer, a stabilizer, preferably a pigment, and a UV inhibitor/light stabilizer. The formulation is applied to a substrate and then cured by exposing it to an elevated temperature.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: September 26, 2023
    Inventors: Jon H. Brasher, James Woodham, Christopher Campbell, Stuart Christmas
  • Patent number: 11758704
    Abstract: A panel for a shielding cabin having a base plate made of a non-magnetic material and at least one sheet layer made of a soft magnetic material is provided. The base plate is stuck to at least one sheet layer by a viscoelastic adhesive. The adhesive has a glass transition temperature of ?80° C. to ?60° C.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: September 12, 2023
    Assignee: VACUUMSCHMELZE GMBH & CO. KG
    Inventors: Gerd Rauscher, Markus Hein, Maximilian Staab, Niklas Volbers
  • Patent number: 11754752
    Abstract: A photochromic polyurethane laminate wherein the photochromic polyurethane layer of the laminate has been crosslinked with an isocyanate-active prepolymer using a crosslinking agent. The crosslinking agent is formulated to have at least three functional groups that are reactive with functional groups of the polyurethane or of the isocyanate-active prepolymer. A method of making the photochromic polyurethane laminate includes steps of causing the crosslinking.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: September 12, 2023
    Assignee: HOYA Optical Labs of America, Inc.
    Inventors: Hannah Vu, Hideyo Sugimura, Ping Fan, Hao Vu
  • Patent number: 11746265
    Abstract: A solvent-based two-component adhesive composition is disclosed. The adhesive composition comprises an isocyanate component and a polyol component. One or both of the isocyanate component and polyol component comprises at least one butylene oxide-based polyol. The at least one butylene oxide-based polyol can be selected from the group consisting of a polybutylene oxide polyols, polybutylene oxide-propylene oxide copolymer polyols, polybutylene oxide-polyethylene oxide copolymer polyols, and combinations of two or more thereof. A method for forming a laminate is also disclosed. The method comprises forming an adhesive composition, the composition comprising at least one polyol comprising at least one butylene oxide-based polyol, applying a layer of the adhesive composition to a surface of a film, bringing the layer into contact with a surface of another film to form a laminate, and curing the adhesive composition. A laminate formed by this method is also disclosed.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: September 5, 2023
    Assignee: The Dow Chemical Company
    Inventors: Mikhail Y. Gelfer, Rui Xie, Jonathan Barrus
  • Patent number: 11749300
    Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: September 5, 2023
    Assignee: Seagate Technology LLC
    Inventors: Zubair Ahmed Khan, Dat Quach, Andrew Habermas, Joel William Hoehn
  • Patent number: 11732158
    Abstract: The present invention provides fast fixturing two part adhesive compositions which include a first part containing a (meth)acrylic component and a cure system for an epoxy resin component of the second part and a second part containing an epoxy resin component and a cure accelerator for the (meth)acrylic component of the first part.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: August 22, 2023
    Assignee: Henkel AG & Co. KGaA
    Inventors: Lynnette Hurlburt, Andrew D. Messana, Kevin J. Welch
  • Patent number: 11725120
    Abstract: The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: August 15, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen-Ming Kuo, Jing Ruei Lu, Pei-Haw Tsao
  • Patent number: 11690419
    Abstract: Disclosed is a preparation technology for an artificial eyelash with a naturally arc-shaped stem, which automatically presses and sticks artificial eyelash by providing a transmission mechanism for transmitting a double-sided adhesive tape, a limiting mechanism for storing the artificial eyelash, a pressing mechanism for pressing the double-sided adhesive tape to the limiting mechanism to stick the artificial eyelash and a control mechanism; automatically synthesizes the artificial eyelash by providing a feeding roller assembly, a distributing roller assembly, a synthesis extrusion roller assembly, a recycling roller assembly and a collecting roller; and automatically glues and shears the artificial eyelash by eyelash thread rollers, front limiting rollers, glue injection mechanisms, rear limiting rollers, drying mechanisms and finished product rollers symmetrically arranged on two sides of a multi-layer eyelash sticker.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: July 4, 2023
    Inventor: Xiaoyan Zhang
  • Patent number: 11680193
    Abstract: Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: June 20, 2023
    Assignees: CEMEDINE CO., LTD., MAZDA MOTOR CORPORATION
    Inventors: Daisuke Makino, Atsuhiko Suzuki, Yusuke Murachi, Motoyasu Asakawa, Katsuya Himuro, Kenichi Yamamoto
  • Patent number: 11674060
    Abstract: Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: June 13, 2023
    Assignee: Oatey Co.
    Inventors: Amrit Parhar, Willie Perez
  • Patent number: 11661532
    Abstract: Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: May 30, 2023
    Assignee: Avery Dennison Corporation
    Inventors: Josh M. Bogner, Dong-Tsai Hseih
  • Patent number: 11649379
    Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: May 16, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Akiko Yoshida, Kenichi Okada, Koji Akazawa
  • Patent number: 11641920
    Abstract: A light-curable artificial nail is disclosed having an adhesive section including a light-curable composition in a semi-cured state. The light-curable composition is configured to transition from the semi-cured state to a cured state based on exposure to at least one wavelength of electromagnetic radiation. The light-curable artificial nail includes a strengthening section disposed above the adhesive section and a polish section disposed above the adhesive section.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: May 9, 2023
    Assignee: Brilliance of Beauty, Inc.
    Inventor: Sahara Lotti