Patents Examined by Daniel H Lee
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Patent number: 11905441Abstract: Apparatuses, methods, and systems are disclosed for an adhesive including an activated portion and an unactivated portion. The adhesive is interposed between and binds the first substrate to a second substrate. The unactivated portion includes moisture, and the activated portion is activated to adhere in response to the removal of moisture. Similarly, the unactivated portion of the adhesive may be activated in response to the removal of moisture, removal of air, applying radiation, heating, and/or catalyzing a functional group.Type: GrantFiled: August 17, 2021Date of Patent: February 20, 2024Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Bouziane Yebka, Tin-Lup Wong, Philip J. Jakes
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Patent number: 11879079Abstract: The invention relates to a film adhesive for bonding at least two joint partners, containing an adhesive for an adhesive connection of the joint partners and a flat textile support material. The adhesive is applied onto the flat textile support material in the form of a film, and the flat textile support material has at least one first section which adjoins at least one second section of the support material. The support material of the first section has a modified material and/or is chemically and/or geometrically modified compared to the support material of the second section such that after curing the adhesive, the adhesive connection has a mechanical property in the region of the first section relating to an elongation at break or fracture toughness which differs from the mechanical property of the adhesive connection in the region of the second section.Type: GrantFiled: June 19, 2018Date of Patent: January 23, 2024Assignee: DEUTSCHES ZENTRUM FUR LUFT—UND RAUMGAHRT E.V.Inventor: Lennert Heilmann
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Patent number: 11873259Abstract: The present invention relates to a system and method for the production of gypsum board using starch pellets. In accordance with the present disclosure, the starch necessary for board formation is provided in the form of starch pellets. These pellets are mixed with a gypsum slurry in a mixer. The pellets are initially insoluble and do not dissolve. However, during subsequent drying stages, the pellets become soluble and dissolve into the gypsum phase. This both provides the desired starch component and also results in the formation of voids within the set gypsum.Type: GrantFiled: January 14, 2020Date of Patent: January 16, 2024Assignee: CertainTeed Gypsum, Inc.Inventors: John W. College, Shane Libunao, Mark Harris
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Patent number: 11802224Abstract: The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.Type: GrantFiled: March 22, 2022Date of Patent: October 31, 2023Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Aya Adachi, Yudai Ogata, Noriyuki Uchida, Yoshito Arai
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Patent number: 11787988Abstract: A two-component solventless adhesive composition is disclosed. The composition comprises an isocyanate component comprising an isocyanate prepolymer that is the reaction product of a polyisocyanate and an isocyanate reactive component comprising at least 40 wt % of a polyester polyol, based upon the dry weight of the isocyanate reactive component, a polyol component having an average functionality between 2.5 and 4.5 and an average molecular weight between 250 and 1,000, and comprising at least 30 wt % of a polyether polyol, based upon the dry weight of the polyol component, and an adhesion promoter. A method for forming laminates comprising the disclosed adhesive compositions is also disclosed.Type: GrantFiled: May 22, 2017Date of Patent: October 17, 2023Assignee: Dow Global Technologies LLCInventor: Rui Xie
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Patent number: 11773305Abstract: A silicone pressure sensitive adhesive is prepared by curing a radical reaction curable composition. The silicone pressure sensitive adhesive adheres to various silicone elastomers and is useful in preparation of components of flexible display devices.Type: GrantFiled: April 27, 2021Date of Patent: October 3, 2023Assignee: Dow Silicones CorporationInventors: Qing Cao, Yan Zhou, Bochi Xu
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Patent number: 11773296Abstract: A method for curing an adhesive composition includes: arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend that contains, at least at its surface, a first light-to-heat conversion material that generates heat by absorbing laser light of the first wavelength; and curing the adhesive composition by irradiating the adhesive composition and the first adherend with laser light of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure is manufactured by bonding the adhesive composition to the first adherend by using the method for curing an adhesive composition.Type: GrantFiled: February 16, 2018Date of Patent: October 3, 2023Assignee: OMRON CorporationInventors: Takekazu Komori, Daisuke Sato, Kyoji Kitamura, Yosuke Tatsuno, Yuki Hoga
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Patent number: 11767444Abstract: A plastisol formulation configured for use in coating substrates and a method for applying the formulation. The inventive formulation has exceptional flexibility over a wide range of temperatures. It is comprised of polyvinyl chloride, a plasticizer, a stabilizer, preferably a pigment, and a UV inhibitor/light stabilizer. The formulation is applied to a substrate and then cured by exposing it to an elevated temperature.Type: GrantFiled: February 13, 2020Date of Patent: September 26, 2023Inventors: Jon H. Brasher, James Woodham, Christopher Campbell, Stuart Christmas
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Patent number: 11758704Abstract: A panel for a shielding cabin having a base plate made of a non-magnetic material and at least one sheet layer made of a soft magnetic material is provided. The base plate is stuck to at least one sheet layer by a viscoelastic adhesive. The adhesive has a glass transition temperature of ?80° C. to ?60° C.Type: GrantFiled: June 11, 2019Date of Patent: September 12, 2023Assignee: VACUUMSCHMELZE GMBH & CO. KGInventors: Gerd Rauscher, Markus Hein, Maximilian Staab, Niklas Volbers
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Patent number: 11754752Abstract: A photochromic polyurethane laminate wherein the photochromic polyurethane layer of the laminate has been crosslinked with an isocyanate-active prepolymer using a crosslinking agent. The crosslinking agent is formulated to have at least three functional groups that are reactive with functional groups of the polyurethane or of the isocyanate-active prepolymer. A method of making the photochromic polyurethane laminate includes steps of causing the crosslinking.Type: GrantFiled: November 1, 2021Date of Patent: September 12, 2023Assignee: HOYA Optical Labs of America, Inc.Inventors: Hannah Vu, Hideyo Sugimura, Ping Fan, Hao Vu
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Patent number: 11746265Abstract: A solvent-based two-component adhesive composition is disclosed. The adhesive composition comprises an isocyanate component and a polyol component. One or both of the isocyanate component and polyol component comprises at least one butylene oxide-based polyol. The at least one butylene oxide-based polyol can be selected from the group consisting of a polybutylene oxide polyols, polybutylene oxide-propylene oxide copolymer polyols, polybutylene oxide-polyethylene oxide copolymer polyols, and combinations of two or more thereof. A method for forming a laminate is also disclosed. The method comprises forming an adhesive composition, the composition comprising at least one polyol comprising at least one butylene oxide-based polyol, applying a layer of the adhesive composition to a surface of a film, bringing the layer into contact with a surface of another film to form a laminate, and curing the adhesive composition. A laminate formed by this method is also disclosed.Type: GrantFiled: May 22, 2017Date of Patent: September 5, 2023Assignee: The Dow Chemical CompanyInventors: Mikhail Y. Gelfer, Rui Xie, Jonathan Barrus
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Patent number: 11749300Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.Type: GrantFiled: October 23, 2019Date of Patent: September 5, 2023Assignee: Seagate Technology LLCInventors: Zubair Ahmed Khan, Dat Quach, Andrew Habermas, Joel William Hoehn
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Patent number: 11732158Abstract: The present invention provides fast fixturing two part adhesive compositions which include a first part containing a (meth)acrylic component and a cure system for an epoxy resin component of the second part and a second part containing an epoxy resin component and a cure accelerator for the (meth)acrylic component of the first part.Type: GrantFiled: October 14, 2019Date of Patent: August 22, 2023Assignee: Henkel AG & Co. KGaAInventors: Lynnette Hurlburt, Andrew D. Messana, Kevin J. Welch
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Patent number: 11725120Abstract: The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.Type: GrantFiled: October 30, 2019Date of Patent: August 15, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chen-Ming Kuo, Jing Ruei Lu, Pei-Haw Tsao
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Patent number: 11690419Abstract: Disclosed is a preparation technology for an artificial eyelash with a naturally arc-shaped stem, which automatically presses and sticks artificial eyelash by providing a transmission mechanism for transmitting a double-sided adhesive tape, a limiting mechanism for storing the artificial eyelash, a pressing mechanism for pressing the double-sided adhesive tape to the limiting mechanism to stick the artificial eyelash and a control mechanism; automatically synthesizes the artificial eyelash by providing a feeding roller assembly, a distributing roller assembly, a synthesis extrusion roller assembly, a recycling roller assembly and a collecting roller; and automatically glues and shears the artificial eyelash by eyelash thread rollers, front limiting rollers, glue injection mechanisms, rear limiting rollers, drying mechanisms and finished product rollers symmetrically arranged on two sides of a multi-layer eyelash sticker.Type: GrantFiled: August 3, 2022Date of Patent: July 4, 2023Inventor: Xiaoyan Zhang
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Patent number: 11680193Abstract: Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.Type: GrantFiled: March 23, 2018Date of Patent: June 20, 2023Assignees: CEMEDINE CO., LTD., MAZDA MOTOR CORPORATIONInventors: Daisuke Makino, Atsuhiko Suzuki, Yusuke Murachi, Motoyasu Asakawa, Katsuya Himuro, Kenichi Yamamoto
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Patent number: 11674060Abstract: Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.Type: GrantFiled: September 24, 2020Date of Patent: June 13, 2023Assignee: Oatey Co.Inventors: Amrit Parhar, Willie Perez
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Patent number: 11661532Abstract: Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.Type: GrantFiled: June 7, 2016Date of Patent: May 30, 2023Assignee: Avery Dennison CorporationInventors: Josh M. Bogner, Dong-Tsai Hseih
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Patent number: 11649379Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.Type: GrantFiled: September 14, 2021Date of Patent: May 16, 2023Assignee: NITTO DENKO CORPORATIONInventors: Akiko Yoshida, Kenichi Okada, Koji Akazawa
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Patent number: 11641920Abstract: A light-curable artificial nail is disclosed having an adhesive section including a light-curable composition in a semi-cured state. The light-curable composition is configured to transition from the semi-cured state to a cured state based on exposure to at least one wavelength of electromagnetic radiation. The light-curable artificial nail includes a strengthening section disposed above the adhesive section and a polish section disposed above the adhesive section.Type: GrantFiled: April 12, 2022Date of Patent: May 9, 2023Assignee: Brilliance of Beauty, Inc.Inventor: Sahara Lotti