Patents Examined by Daniel H Lee
  • Patent number: 11111417
    Abstract: The present invention relates to adhesive formulations for bonding materials, comprising 40 to 80 wt.-% of an epoxy monomer, and 15 to 30 wt.-% of an oxetane monomer, and 0.1 to 10 wt.-% of an adhesion promotor, and 0.1 to 5 wt.-% of a sensitizer, and 1 to 10 wt.-% of a radiation and temperature activable photoinitiator or a mixture of a photoinitiator and a thermal initiator. Further, the present invention relates to a method for bonding at least two parts of which one is at least an inert material, comprising the steps applying to one part an adhesive formulation as described, placing another part to be bond on the one part, exposing the parts to UV light radiation and heat treating of the part.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: September 7, 2021
    Assignee: SICPA HOLDING SA
    Inventor: Davide Ciampini
  • Patent number: 11097525
    Abstract: A system and method for laminating filter media can include applying an adhesive to a layer of the filter media and curing the adhesive. A multilayer filter assembly can include a first and a second layer laminated together using an inorganic adhesive.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: August 24, 2021
    Assignee: Molekule, Inc.
    Inventors: Jaspreet S. Dhau, Avtar Singh, David Goslin
  • Patent number: 11091677
    Abstract: The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: August 17, 2021
    Assignee: Henkel AG & Co. KGaA
    Inventors: Uwe Franken, Karin Jonscher
  • Patent number: 11091672
    Abstract: The present application relates to a method for manufacturing a pressure-sensitive adhesive film. In an embodiment, a method for manufacturing a pressure-sensitive adhesive film having a pressure-sensitive adhesive layer and a base layer includes applying a pressure-sensitive adhesive composition on at least one side of a base layer, where the pressure-sensitive adhesive composition comprises an isocyanate compound, a metal compound and an acrylic polymer; and drying the pressure-sensitive adhesive composition at a temperature of 100° C. or higher to form a pressure-sensitive adhesive layer on the base layer.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: August 17, 2021
    Inventors: Hui Je Lee, Byung Su Park, Yoon Kyung Kwon
  • Patent number: 11084960
    Abstract: An object of the present invention is to provide a composite material including an epoxide resin, having an improved strength. The object can be solved by a curable epoxide composition comprising an epoxide compound; a carbon fiber; a curing agent; and phosphite ester or phosphate ester. According to the present invention, a strength of the curable epoxide composition comprising a carbon fiber can be improved.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: August 10, 2021
    Assignee: T&K TOKA CO., LTD.
    Inventors: Akinobu Saito, Shuichi Watanabe, Takakuni Kawano, Shuichi Matakawa
  • Patent number: 11078389
    Abstract: In the present invention, a solvent-based (SB) adhesive for the purpose of closing or sealing the open end of a bag, such as a plastic trash bag, liner or like, is coated to the exterior or interior surface of said bag and creates a neat, tight functional seal to said bag when twist activated.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: August 3, 2021
    Assignee: Sun Chemical Corporation
    Inventors: Paul Kurtz, Philippe Schottland, Russell Schwartz, Kohei Nakane
  • Patent number: 11078729
    Abstract: A method is provided for manufacturing a segment of a drill string, such as a tubular tool, from a plurality of layers. The method includes arranging a plurality of layers based on a selected length of the segment. Each of the plurality of layers includes an aperture that is received over an alignment feature that restricts movement of the plurality of layers to two or fewer degrees of freedom. A joining process is performed to join the plurality of layers, which may include at least one replacement layer.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: August 3, 2021
    Assignee: HALLIBURTON ENERGY SERVICES, INC.
    Inventors: Alston Jun Ngai Wong, Jia Ming Kew, Doren Hui Ping Ho, Guan Yee Chan
  • Patent number: 11060002
    Abstract: A new hot-melt adhesive formulations having improved processability and that are easily processable even with processes at high speed and in particular with Spraying or Fiberization processes. Said hot-melt adhesive formulations comprise, as their main polymer component, at least one isotactic metallocene butene-1 polymer composition, that has a low viscosity, and that has a substantially bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps, where the first polymer (polymer A) of said compositionally bimodal polymer composition is an isotactic butene-1 homopolymer or an isotactic butene-1 copolymer with another olefin, while the second polymer (polymer B) is an isotactic copolymer of butene-1, with another olefin, with a chemical composition obviously different from A, qualitatively and/or quantitatively; said hot-melts further comprising a viscosity modifier that is not solid at room temperature.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: July 13, 2021
    Assignee: SAVARE' I.C. S.r.l.
    Inventors: Italo Corzani, Biagio Savare′
  • Patent number: 11034869
    Abstract: Epoxy adhesives include a latent curing agent, a reactive toughener having capped isocyanate groups, and certain urea compounds. The toughener is made by chain extending and capping a mixture of isocyanate-terminated prepolymers. The prepolymers include an isocyanate-terminated polyether and an isocyanate-terminated diene polymer. The adhesives have excellent wash-off resistance and excellent ability to adhere to oily substrates.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: June 15, 2021
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
    Inventors: Andreas Lutz, Daniel Schneider, Jeannine Flueckiger
  • Patent number: 11015093
    Abstract: A two-component solventless adhesive composition is disclosed, the composition comprising an isocyanate component comprising an isocyanate prepolymer that is the reaction product of reactants comprising at least one polyisocyanate, at least one polyester polyol, at least one polyether polyol, and at least one polyol comprising a hydroxyl and COOH acid functionality. The adhesive composition further comprises a polyol component comprising at least one polyester polyol, at least one polyether polyol, or a combination thereof. A method for forming a laminate using the adhesive composition and a laminate itself are also disclosed. The method comprises forming a solventless adhesive composition, applying a layer of the adhesive composition to a surface of a film, bringing the layer into contact with a surface of another film to form a laminate, and curing the adhesive composition. A laminate made according to the method is further disclosed.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: May 25, 2021
    Assignees: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: Chenyan Bai, Qiang Lu
  • Patent number: 11015091
    Abstract: A description is given of the use of a one-component laminating adhesive for composite film lamination, and also of a method for composite film lamination. The laminating adhesive comprises an aqueous polymer dispersion preparable by radical emulsion polymerization of monomers comprising (a) at least 60 wt %, based on the total amount of monomers, of at least one monomer selected from the group consisting of C1 to C20 alkyl acrylates, C1 to C20 alkyl methacrylates, vinyl esters of carboxylic acids comprising up to 20 carbon atoms, vinylaromatics having up to 20 carbon atoms, vinyl halides, vinyl ethers of alcohols comprising 1 to 10 carbon atoms, aliphatic hydrocarbons having 2 to 8 carbon atoms and one or two double bonds, and mixtures of these monomers, and (b) at least 0.1 wt %, based on the total amount of monomers, of at least one monomer having at least one acid group, and (c) 0.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: May 25, 2021
    Assignee: BASF SE
    Inventors: Karl-Heinz Schumacher, Christine Tonhauser, Christoph Kiener, Peter Preishuber-Pfluegl, Andrea Kuntz
  • Patent number: 11015034
    Abstract: The present teachings contemplate a method comprising coating an polymeric material with a composition including a dicarbonyl compound and having a viscosity of from about 50 cps to about 500 cps, wherein the coating initiates either: (i) spontaneous polymerization (e.g., in less than about one minute) at room temperature of the composition without the addition of an initiator; or (ii) polymerization at room temperature at a selected later time with or without the addition of an initiator; and wherein the composition adheres or facilitates adhesion of the polymeric material to a substrate.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: May 25, 2021
    Assignee: Zephyros, Inc.
    Inventors: Yuan Lu, Kenneth Mazich, Kevin Hicks, Austin O'Connor, Michael Czaplicki
  • Patent number: 11014347
    Abstract: Disclosed herein are improved methods for bonding textiles using an adhesive composition.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: May 25, 2021
    Assignee: Bemis Associates, Inc.
    Inventors: Richard A. Brown, Jared M. Ide, Daryl R. Johnson, Stephen A. Topper
  • Patent number: 10968374
    Abstract: A two-part curable urethane adhesive composition of the present technology comprises: a main agent containing a urethane prepolymer (A), an isocyanate group-containing polyisocyanate (B), and isocyanate silane (C); and a curing agent containing a compound having at least two active hydrogen groups per molecule (D) and an aromatic compound (E) represented by Formula (1) below, where n is an integer of 1 to 5, and X represents a hydrogen atom, a hydroxy group, or an alkoxy group having from 1 to 12 carbons.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: April 6, 2021
    Inventors: Megumi Abe, Yuichi Matsuki
  • Patent number: 10961415
    Abstract: Laminates of polymeric films and solvent-based polyurethane adhesive formulations for preparing them are provided. The adhesive formulations include a hydroxyl-terminated polyester that forms crystalline polyester domains after reaction with an appropriate polyisocyanate, but prior to completion of cure. The result is an adhesive layer that substantially enhances the oxygen barrier properties of the adhesive and, therefore, of the laminate as a whole, while offering desirable convenience of application even at relatively low temperatures. The laminates may also exhibit desirable retention of barrier properties following flex-cracking.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: March 30, 2021
    Assignees: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: Daniele Vinci, Mai Chen, Thomas Udhayasingh, Thorsten Schmidt
  • Patent number: 10961418
    Abstract: The present invention relates to the use of block copolymers produced from OH-functionalized polyolefins and polyesters in adhesives or sealants and to adhesives or sealants containing said block co-polymers.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: March 30, 2021
    Assignee: Evonik Operations GmbH
    Inventors: Nicolai Kolb, Gabriele Brenner, Patrick Glöckner, Bernhard Schleimer
  • Patent number: 10950481
    Abstract: A method for manufacturing a thin substrate uses a temporary adhesive film for substrate processing for temporarily adhesion of a substrate to a support on a surface of the substrate opposite to a surface to be processed, the temporary adhesive film for substrate processing containing a siloxane bond-containing polymer having a weight average molecular weight of 3,000 to 500,000 in an amount of 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass; and includes: (a) laminating the temporary adhesive film for substrate processing onto the support and/or the surface of the substrate opposite to the surface to be processed; (b) bonding thereof under reduced pressure; (c) processing the substrate by grinding or polishing; (d) treating the substrate with acid or base; (e) other processing; (f) separating the processed substrate from the support; and (g) cleaning the substrate.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: March 16, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masahito Tanabe, Michihiro Sugo
  • Patent number: 10934378
    Abstract: A reactive resin includes a vinyl ester resin as a base resin and an oligomeric itaconic acid ester as a reactive diluent.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: March 2, 2021
    Assignee: HILTI AKTIENGESELLSCHAFT
    Inventors: Jens Bunzen, Thomas Bürgel, Beate Gnass, Klaus Jaehnichen, Brigitte Voit
  • Patent number: 10899950
    Abstract: A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A having on average more than one epoxide group per molecule; b) at least one latent hardener for epoxy resins; and c) at least one carboxylic acid selected from substituted or unsubstituted succinic acid and substituted or unsubstituted phthalic acid, wherein the epoxy resin adhesive contains 1.7 to 15 mmol of the at least one carboxylic acid per 100 g of epoxy resin adhesive, and the epoxy resin adhesive has a viscosity of more than 10 000 Pas at 25° C.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: January 26, 2021
    Assignee: SIKA TECHNOLOGY AG
    Inventor: John Hanley
  • Patent number: 10883027
    Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of ?1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: January 5, 2021
    Assignee: MEC COMPANY LTD.
    Inventors: Itsuro Tomatsu, Kosuke Kumazaki, Yasutaka Amitani, Yuko Shibanuma, Ikuyo Katayama