Abstract: Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.
Type:
Grant
Filed:
March 23, 2018
Date of Patent:
June 20, 2023
Assignees:
CEMEDINE CO., LTD., MAZDA MOTOR CORPORATION
Abstract: Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.
Abstract: Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.
Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.
Type:
Grant
Filed:
September 14, 2021
Date of Patent:
May 16, 2023
Assignee:
NITTO DENKO CORPORATION
Inventors:
Akiko Yoshida, Kenichi Okada, Koji Akazawa
Abstract: A light-curable artificial nail is disclosed having an adhesive section including a light-curable composition in a semi-cured state. The light-curable composition is configured to transition from the semi-cured state to a cured state based on exposure to at least one wavelength of electromagnetic radiation. The light-curable artificial nail includes a strengthening section disposed above the adhesive section and a polish section disposed above the adhesive section.
Abstract: Embodiments provide methods of assembling an apparel product. The methods include applying a composition to a portion of a major component of the apparel product or a portion of a minor component of the apparel product. The portion of the minor component is coupled with the portion of the major component via the composition. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with an adhesive. The composition is converted to the adhesive to form the apparel product. The adhesive includes a material having a boronate ester bond.
Type:
Grant
Filed:
June 30, 2022
Date of Patent:
April 25, 2023
Inventors:
Caglar Remzi Becer, Daniel John Mackinnon, Yongqiang Li
Abstract: Epoxy adhesives are made using core-shell rubbers and small amounts if any of other elastomeric materials. The epoxy adhesives contain a mixture of latent curing agents and/or high levels of calcium oxide. The adhesives exhibit excellent bonding properties even when an open or closed bead is exposed to humid air for prolonged periods before the epoxy adhesive is cured.
Abstract: A sealant material for sealing joints between male and female mating parts comprising: (a) an elongate flexible thread suitable for wrapping around at least one of the parts, and (b) a joint sealing composition comprising an anaerobically curable composition in solid form, the flexible thread being coated with the anaerobically curable composition. This provides a reactive composition on the thread for sealing joints.
Type:
Grant
Filed:
April 17, 2019
Date of Patent:
April 4, 2023
Assignee:
Henkel AG & Co. KGaA
Inventors:
Deirdre Ledwith, Laura Vaissaud, Michael Doherty, James Houlihan, Brendan Kneafsey
Abstract: A polymer composition includes at least one poly(aryl ether ketone) (PAEK) component and at least one low molecular weight aromatic compound. A polymer metal junction including the polymer composition and a method of making a polymer metal junction are also described.
Type:
Grant
Filed:
August 1, 2017
Date of Patent:
February 28, 2023
Assignee:
SOLVAY SPECIALTY POLYMERS, LLC
Inventors:
Mohammad Jamal El-Hibri, Chantal Louis, David B. Thomas
Abstract: A business form comprises a first portion and a second portion adhesively secured to the first portion via a control bond adhesive. The control bond adhesive is a mixture comprising: between about 1 kg and 2 kg of a flexible adhesive; between about 1 kg and 2 kg of water; between about 12 g and 16 g gypsum, and between about 13 g and 23 g fumed silica.
Type:
Grant
Filed:
May 30, 2019
Date of Patent:
February 21, 2023
Assignee:
Rekon, LLC
Inventors:
Roger Davis, Gina Staudinger, Jesse Crum
Abstract: Adhesive hot-melt formulations with a main polymeric component, of at least one isotactic metallocene butene-1 polymer composition, that has a low viscosity, and that has a bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps. Moreover, said hot-melts include less than 5% by weight of at least one viscosity modifier that is not solid at room temperature. Such unusually low level of said additives, surprisingly allows to attain substantially improved levels both of high adhesiveness and cohesion. The adhesive hot-melt formulations include less than 5% by weight of a polyethylene wax or of a blend of polyethylene waxes, that characterized by a highly linear/non-branched structure and by an exceptionally low Polydispersity Index. The presence of such peculiar polyethylene waxes, that are partially incompatible with the butene-1 polymer composition, allows to use the disclosed hot-melt formulations even in the presence of fibrous or perforated substrates.
Abstract: The present invention is directed to ceiling panels formed from a porous scrim that is coupled to an acoustical substrate using a scrim attachment system that includes an adhesive.
Type:
Grant
Filed:
July 3, 2019
Date of Patent:
January 10, 2023
Assignee:
AWI Licensing LLC
Inventors:
Anthony L. Wiker, Peter J. Oleske, Lida Lu
Abstract: The present disclosure is directed to a formulations of cements and methods for bonding dissimilar materials. The formulations and methods can bond a Non-polyvinyl chloride (PVC) containing first polyolefin that is amorphous or has low crystallinity to a second material that is a rigid material or a hard PVC. The methods and formulations can work by co-dissolution at an interface, or activation of a one of the materials prior to bonding.
Abstract: Disclosed is a building board construction that provides enhanced acoustical properties. In one possible embodiment, the board is a gypsum board with opposing facing sheets and an intermediate set gypsum core. An opened celled polymeric sheet is formed within the gypsum core and gives the resulting board enhanced sound absorption. In an alternative embodiment, individual pieces of polymeric foam are used in stead of the polymeric sheet. Also disclosed are various manufacturing methods whereby boards with enhanced acoustical properties can be formed in an continuous process. The various components of the present disclosure, and the manner in which they interrelate, are described in greater detail hereinafter.
Type:
Grant
Filed:
August 4, 2020
Date of Patent:
December 27, 2022
Assignee:
CertainTeed Gypsum, Inc.
Inventors:
Christopher K. Athari, Thomas J. Garvey, Pamela Shinkoda
Abstract: To provide a double-sided pressure-sensitive adhesive sheet having high flexing resistance that does not suffer flexure and exfoliation in a flexing test that is closer to the actual use environment. A double-sided pressure-sensitive adhesive sheet having no substrate, containing a pressure-sensitive adhesive composition containing a (meth)acrylate ester (co)polymer (A), and having a glass transition temperature (Tg) defined by a Tan ? peak temperature of dynamic viscoelasticity in a range of ?50° C. to ?20° C., a storage elastic modulus G? at a frequency of 1 Hz and a temperature 100° C. in a range of 2.0×103 to 3.0×104 Pa, and a thickness of 10 ?m or more and 150 ?m or less.
Abstract: The present invention relates to a reactive hot melt adhesive composition, a polyurethane prepolymer composition, and cured reaction product thereof having a high mechanical strength and an excellent bonding strength as well as a better reworkability. In particular, the present invention relates to a reactive hot melt adhesive composition comprising: 10% to 24% by weight of a polyisocyanate, 40% to 73% by weight of a first polyol having a number average molecular weight larger than 1,500 g/mol, 1% to 25% by weight of a (meth)acrylate polymer having a number average molecular weight of 20,000 to 80,000 g/mol, and 1% to 15% by weight of a diluent, in which the weight percentages are based on the total weight of all components of the composition.
Abstract: A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.
Abstract: The present invention has been made in an effort to provide an adhesive coating composition capable of adhering (fastening) a non-oriented electrical steel sheet without using a conventional fastening method such as welding, clamping, or interlocking, a non-oriented electrical steel sheet stack to which the same is applied, and a manufacturing method thereof. According to an exemplary embodiment of the present invention, an adhesive coating composition includes: 40 to 99 wt % of a first component containing a water-soluble resin; and 1 to 60 wt % of a second component containing a composite metal phosphate.
Type:
Grant
Filed:
December 22, 2017
Date of Patent:
November 22, 2022
Assignee:
POSCO
Inventors:
Jung-Woo Kim, Bongwoo Ha, Changhoon Choi, Taeyoung No, Heon-Jo Choi, Won-Seog Bong
Abstract: The present invention relates to an adhesive tape and to a method for jacketing an elongated item, more particularly cable sets. The adhesive tape must cure within the operational dictates for further processing, e.g. within 6 min, and after curing must exhibit the required dimensional stability properties. However, the adhesive compositions must not cure during storage itself, since otherwise they can no longer be used. Nor may the curing temperatures be too high, since otherwise the lead insulation, which is often made of PVC, may suffer damage.
Type:
Grant
Filed:
February 7, 2020
Date of Patent:
October 11, 2022
Assignee:
TESA SE
Inventors:
Kerstin Klingeberg, Heike Simonis, Lars Gulbrandsen, Marco Kupsky, Patrick Kerep
Abstract: Provided are adhesive compositions that include an acrylate component and a charcoal component. The adhesive compositions are useful for adhering articles, for example, lashes or lash extensions to surfaces such as skin.