Patents Examined by David E Lotter
  • Patent number: 11128037
    Abstract: A radome (10) for vehicles defining a proximal side and a distal side, comprising a base layer (1) formed of a radio transmissive resin, the base layer (1) defining a proximal face and a distal face; a decoration layer (2) applied to the proximal face of the base layer (1), the decoration layer (2) comprising a metalloid or a metalloid alloy; characterized in that the radome (10) also comprises an anti-reflective coating (4) placed proximal with respect to the decoration layer (2). The anti-reflection layer will eliminate the high reflecting disturbances introduced by the top coat, which will significantly improve radome aesthetics.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: September 21, 2021
    Assignee: Zanini Auto Grup, S.A.
    Inventors: Augusto Mayer Pujadas, Jerson Jair Peralta, Josep Maria Armengol Rocaspana
  • Patent number: 11114744
    Abstract: An electronic device is provided. The electronic device includes a foldable housing including, a hinge structure, a first housing structure including a first surface, a second surface, and a first side member, wherein the first side member encloses at least a portion of a space between the first surface and the second surface and includes a first conductive portion, a first non-conductive portion, and a second conductive portion, and a second housing structure including a third surface, a fourth surface, and a second side member, a printed circuit board, at least one wireless communication circuit including a first electrical path and a second electrical path, a first variable element including a first terminal, a second terminal, and a third terminal, and a second variable element including a fourth terminal, a fifth terminal, and a sixth terminal.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: September 7, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungkoo Park, Hyungjoo Lee, Shinho Yoon, Himchan Yun, Soonho Hwang, Jaebong Chun
  • Patent number: 11108160
    Abstract: An antenna module of a wireless communication system is provided. The antenna module includes a radiator comprising a top face to which a radio wave is radiated, a dielectric material disposed on a bottom face of the radiator, the bottom face of the radiator being opposite to the top face of the radiator, a feeding unit disposed on a bottom face of the dielectric material, the feeding unit being configured to supply an electric signal to the radiator through the dielectric material, and a support unit disposed on the bottom face of the dielectric material, the support unit comprising a metallic material.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: August 31, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoongeon Kim, Seungtae Ko, Hyunjin Kim, Jungmin Park, Junsig Kum, Youngju Lee
  • Patent number: 11101546
    Abstract: The present disclosure discloses an electronic device having a first slot disposed along a side surface of the electronic device; and a first metal portion disposed on the side surface corresponding to the first slot being used as a radiator of a first antenna of the electronic device.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: August 24, 2021
    Assignee: LENOVO (BEIJING) CO., LTD.
    Inventor: Shichao Li
  • Patent number: 11095034
    Abstract: The antenna in the embodiments provided includes: a first-layer antenna, a second-layer antenna, a first probe, a second probe, a first connector, and a second connector. An annular microstrip patch is attached to each of main bodies of the first-layer antenna and the second-layer antenna. The annular microstrip patch attached to the first-layer antenna is provided with a first feeding network and a second feeding network therein. The first-layer antenna is connected to the first probe and the second probe by using the first feeding network and the second feeding network respectively. The first-layer antenna is connected to the first connector and the second connector. A position of the first connector corresponds to a position where the first probe is connected to the first-layer antenna. A position of the second connector corresponds to a position where the second probe is connected to the first-layer antenna.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: August 17, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Huaizhi Zhang, Sunjie Wang, Daniele Inserra, Guangjun Wen
  • Patent number: 11081800
    Abstract: The present disclosure relates to a dual-polarized antenna comprising a dipole radiator, a resonant cavity radiator and a reflector. The resonant cavity radiator is arranged below the reflector and radiates through a slot in the reflector, and the dipole radiator is arranged above the reflector, with a signal line and/or a carrier of the dipole radiator extending through the slot.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: August 3, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Andreas Vollmer, Maximilian Goettl, Dan Fleancu
  • Patent number: 11081804
    Abstract: A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: August 3, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryuken Mizunuma, Shinichiro Banba, Michiharu Yokoyama, Hideki Ueda, Hideaki Yamada, Noboru Morioka
  • Patent number: 11069633
    Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 20, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
  • Patent number: 11063364
    Abstract: An antenna module of a wireless communication system is provided. The antenna module includes a radiator comprising a top face to which a radio wave is radiated, a dielectric material disposed on a bottom face of the radiator, the bottom face of the radiator being opposite to the top face of the radiator, a feeding unit disposed on a bottom face of the dielectric material, the feeding unit being configured to supply an electric signal to the radiator through the dielectric material, and a support unit disposed on the bottom face of the dielectric material, the support unit comprising a metallic material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: July 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoongeon Kim, Seungtae Ko, Hyunjin Kim, Jungmin Park, Junsig Kum, Youngju Lee
  • Patent number: 11056777
    Abstract: The present invention provides a millimeter wave LTCC filter including system ground layers, metallized vias, perturbation grounding posts, first and second probes, two adjacent layers of the system ground layers define one closed resonant cavity, each closed resonant cavity is provided with a plurality of metallized vias, the metallized vias of different closed resonant cavities form concentric hole structures, the perturbation grounding posts include first perturbation grounding posts penetrating a second closed resonant cavity and second perturbation grounding posts penetrating a third closed resonant cavity, the first perturbation grounding posts respectively face right to the second perturbation grounding posts, one end of the first probe is inserted into the first closed resonant cavity and electrically connected with the first system ground layer, and the second probe is arranged symmetrically with the first probe and inserted into the fourth closed resonant cavity and electrically connected with the s
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: July 6, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventor: Jianchun Mai
  • Patent number: 11056764
    Abstract: A phased array antenna panel includes a first plurality of antennas, a first radio frequency (RF) front end chip, a second plurality of antennas, a second RF front end chip, and a combiner RF chip. The first and second RE front end chips receive respective first and second input signals from the first and second pluralities of antennas, and produce respective first and second output signals based on the respective first and second input signals. The combiner RF chip can receive the first and second output signals and produce a power combined output signal that is a combination of powers of the first and second output signals. Alternatively, a power combiner can receive the first and second output signals and produce a power combined output signal, and the combiner RF chip can receive the power combined output signal.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: July 6, 2021
    Assignee: SILICON VALLEY BANK
    Inventors: Ahmadreza Rofougaran, Seunghwan Yoon, Alfred Grau Besoli, Farid Shirinfar, Sam Gharavi, Michael Boers, Maryam Rofougaran
  • Patent number: 11031702
    Abstract: A phased array antenna structure includes a carrier, a radiative layer and a circuit layer both disposed on the carrier, and a phase switch. The radiative layer includes two radiating portions. The circuit layer includes a phased antenna and a transmission circuit. The phased antenna including two end portions respectively connected to the two radiating portions. The transmission circuit includes a feeding end and an externally connecting end that is arranged adjacent to the phased antenna. The phase switch is connected to the externally connecting end of the transmission circuit, and the phase switch is configured to selectively connect only one of the two end portions of the phased antenna.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: June 8, 2021
    Assignee: AUDEN TECHNO CORP.
    Inventor: Chi-Ming Chiang
  • Patent number: 11024974
    Abstract: Methods and systems are provided for implementing and utilizing dual-polarized planar ultra-wideband antennas. An example planar antenna may include a substrate, a monopole conductor located on a first side of the substrate, a first ground conductor located on a second side of the substrate, and a second ground conductor located on the first side of the substrate. The monopole conductor may be connected to a first signal feeding line, the first ground conductor may be connected through a ground connector to ground potential, the first ground conductor may be connected to a second signal feeding line and, and the second ground conductor may be connected to ground potential located on the first side of the substrate. The planar antenna may be configured to form multiple sub-antennae during active operations. The planar antenna may also be configured to form a ring-antenna during operations.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: June 1, 2021
    Inventor: Nima Jamaly
  • Patent number: 11018409
    Abstract: A phased array antenna panel includes a first plurality of antennas, a first radio frequency (RF) front end chip, a second plurality of antennas, a second RF front end chip, and a combiner RF chip. The first and second RE front end chips receive respective first and second input signals from the first and second pluralities of antennas, and produce respective first and second output signals based on the respective first and second input signals. The combiner RF chip can receive the first and second output signals and produce a power combined output signal that is a combination of powers of the first and second output signals. Alternatively, a power combiner can receive the first and second output signals and produce a power combined output signal, and the combiner RF chip can receive the power combined output signal.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: May 25, 2021
    Assignee: SILICON VALLEY BANK
    Inventors: Ahmadreza Rofougaran, Seunghwan Yoon, Alfred Grau Besoli, Farid Shirinfar, Sam Gharavi, Michael Boers, Maryam Rofougaran
  • Patent number: 11012047
    Abstract: The invention relates to the antenna technology used generally for providing a communication in the mines, in particular to the small resonant re-tunable antennas intended for providing an induction communication too. The technical effect is a possibility to adjust smoothly an operation frequency of the antenna within the wide radio wave range and, as a consequence, a possibility to compensate an effect of the outer objects having a capacity and switch the antenna to the other transceiving frequency channels.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: May 18, 2021
    Assignee: DEZEGA HOLDING UKRAINE, LLC
    Inventor: Dmitriy Vitalyevich Fedosov
  • Patent number: 11005183
    Abstract: An antenna module of a wireless communication system is provided. The antenna module includes a radiator comprising a top face to which a radio wave is radiated, a dielectric material disposed on a bottom face of the radiator, the bottom face of the radiator being opposite to the top face of the radiator, a feeding unit disposed on a bottom face of the dielectric material, the feeding unit being configured to supply an electric signal to the radiator through the dielectric material, and a support unit disposed on the bottom face of the dielectric material, the support unit comprising a metallic material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: May 11, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoongeon Kim, Seungtae Ko, Hyunjin Kim, Jungmin Park, Junsig Kum, Youngju Lee
  • Patent number: 10998618
    Abstract: Coaxial helix antennas in accordance with embodiments of the invention are disclosed. In one embodiment, a coaxial helix antenna includes an inner element having an inner element radius and an inner element length and an outer element having an outer element radius and an outer element length, wherein the outer element radius is greater than the inner element radius, wherein the inner element is driven by a first conductor, wherein the outer element is driven by a second conductor, and wherein the outer element is disposed outside of the inner element such that a portion of the inner element extends beyond the outer element and includes an inner radiating element.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: May 4, 2021
    Assignee: CalAmp Wireless Networks Corporation
    Inventor: Orest Fedan
  • Patent number: 10992058
    Abstract: Systems and methods relating to patch antennas. A patch antenna has a substrate, a resonant metal plate at one side of the substrate, and a ground plane at the other opposite side of the substrate. Two feed pins are used to couple the antenna to other circuitry. The feed pins pass through the substrate and holes in at the ground plane. The feed pins are physically disconnected from both the resonant metal plate and the ground plane. The feed pins are capacitively coupled to the resonant metal plate to provide an electronic connection between other circuitry and the patch antenna.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: April 27, 2021
    Assignee: Tallysman Wireless Inc.
    Inventors: Gyles Panther, Rony E. Amaya, James Stuart Wight
  • Patent number: 10992054
    Abstract: The embodiments of this disclosure disclose an array antenna system. The array antenna system includes M antenna radiation units, a strip line feed system, a strip line ground plane, and a strip line cavity; the strip line feed system includes a phase shift circuit and N first printed circuit boards PCBs configured to implement a power allocation function and/or a phase compensation function; the phase shift circuit is located in the strip line cavity. P first PCBs are located on an outer surface of the strip line cavity; all or some of the M antenna radiation units are connected to signal planes of the N first PCBs, and the signal planes of the N first PCBs are in a radio frequency connection to the phase shift circuit by using probes; and ground planes of the N first PCBs are in a radio frequency connection to the strip line ground plane.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: April 27, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Weihong Xiao, He Cui, Kunpeng Wang
  • Patent number: 10978777
    Abstract: A system such as a vehicle may have windows. A window may have a structural window layer formed from one or more glass layers. A conductive coating such as an infrared-light blocking coating or other optical filter layer may be formed on the window. The conductive coating may include one or more silver layers or other conductive material. Unpatterned portions of the conductive coating are conductive along orthogonal dimensions. A region of the conductive coating may have parallel line-shaped openings that render the coating conductive in only a single dimension while enhancing radio transparency. Another region of the conductive coating may have a two-dimensional pattern of openings such as a mesh-shaped opening formed from intersecting straight and/or curved lines. In this region, the coating is locally rendered insulating and radio-frequency transparent. Antennas and ohmic heating elements may be formed in the coating.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: April 13, 2021
    Assignee: Apple Inc.
    Inventors: Yi Jiang, Jiangfeng Wu, Siwen Yong, Lijun Zhang, Mattia Pascolini, James R. Wilson, Martin Melcher