Abstract: A movable device and a block-type millimeter wave array antenna module thereof are provided. The block-type millimeter wave array antenna module includes an antenna carrying substrate, an antenna signal transmitting group, an antenna signal receiving group, and a dummy antenna group. The antenna carrying substrate includes a plurality of block-shaped carrier bodies that are divided into a plurality of first, second, third, and fourth antenna carrier blocks. The antenna signal transmitting group includes a plurality of signal transmitting antenna structures respectively carried by the first antenna carrier blocks. The antenna signal receiving group includes a plurality of signal receiving antenna structures respectively carried by the second antenna carrier blocks. The dummy antenna group includes a plurality of first dummy antenna structures respectively carried by the third antenna carrier blocks, and a plurality of second dummy antenna structures respectively carried by the fourth antenna carrier blocks.

Abstract: An array antenna is proved. The array antenna provides multi-polarization by arranging multiple ports at adjacent positions. Specifically, the array antenna includes a first substrate having a first thickness and a rectangular shape, a second substrate disposed to be in contact with the bottom surface of the first substrate and having a second thickness and a rectangular shape, a ground surface shared by the first substrate and the second substrate, and first ports and second ports disposed to penetrate the ground surface.

Abstract: A phased array antenna panel includes a first plurality of antennas, a first radio frequency (RF) front end chip, a second plurality of antennas, a second RF front end chip, and a combiner RF chip. The first and second RE front end chips receive respective first and second input signals from the first and second pluralities of antennas, and produce respective first and second output signals based on the respective first and second input signals. The combiner RE chip can receive the first and second output signals and produce a power combined output signal that is a combination of powers of the first and second output signals. Alternatively, a power combiner can receive the first and second output signals and produce a power combined output signal, and the combiner RF chip can receive the power combined output signal.

Abstract: Disclosed is an electronic device having a space formed between front and rear surfaces thereof, the electronic device comprising: a first cover arranged on the front surface; a second cover arranged on the rear surface; a frame surrounding the first cover and the second cover; and a multilayered circuit board coupled to the second cover so as to constitute the housing of the electronic device, wherein the multilayered circuit board may comprises an insulated metal layer having a surface coupled to the second cover and a substrate-structured antenna device having a surface coupled to the insulated metal layer.

Abstract: A substrate that includes at least one dielectric layer, a plurality of interconnects, and a curved antenna coupled to a surface of the substrate. The curved antenna is curved relative to the surface of the substrate such that at least part of the curved antenna is offset from the surface of the substrate. The substrate includes a first antenna dielectric layer coupled to the surface of the substrate, an antenna ground interconnect coupled to the first antenna dielectric layer, and a second antenna dielectric layer coupled to the antenna ground interconnect. The antenna ground interconnect configured to be coupled to ground. The curved antenna is coupled to the second antenna dielectric layer.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

Abstract: In one embodiment of the present disclosure, an antenna assembly includes a plurality of layers defining an antenna assembly including a plurality of PCB layers and a plurality of non-PCB layers, the antenna assembly having a top surface and a bottom surface, and adhesive coupling between the PCB layers and the non-PCB layers.

Abstract: An ultra-wideband monopole antenna for 5G application is disclosed comprising a first quarter wavelength conductor and a second quarter wavelength conductor, for transmitting and/or receiving electromagnetic waves. A flat portion of the first quarter wavelength conductor and a flat portion of the second quarter wavelength conductor are preferably arranged and located perpendicular and intersecting to each other. Two curved wings of the first quarter wavelength conductor and two curved wings of the second quarter wavelength conductor are preferably arranged and located concentrically and having a same center. The first and second quarter wavelength conductors are joined to deliver ultra wideband frequency in the range of 600-960 MHz and 1710-6000 MHz.

Abstract: A wireless communication device for transmitting/receiving a high-frequency signal having a predetermined communication frequency. The wireless communication device includes an antenna pattern having an inductance component, an RFIC element connected electrically to the antenna pattern and a capacitive coupling portion capacitively coupling specific confronting regions facing each other of the antenna pattern at multiple points on the antenna pattern, to make up an LC parallel resonant circuit.

Abstract: Methods and systems are provided for implementing and utilizing dual-polarized planar ultra-wideband antennas. An example planar antenna may include a substrate, a monopole conductor, a first ground conductor, and a second ground conductor. The monopole conductor may be connected to a first signal feeding line. The first ground conductor may be connected through a ground connector to ground potential. The first ground conductor may be further connected to a second signal feeding line. The second ground conductor may connected to ground potential located on a particular side of the substrate. The planar antenna may be configured to transmit and receive radiation in two mutually cross-polarized modes.

Abstract: An antenna array includes a printed circuit board including printed circuit board elements circumferentially disposed at locations on a surface of the printed circuit board. The printed circuit board elements are disposed in opposing pairs at diametrically opposite locations and include a first member and a second member. The first member intersects the second member which is curved. The antenna array can be an ultra-ultra wide band (UUWB) wavelength scaled array (WSA) tightly coupled dipole array (TCDA) active electronically scanned array (AESA) aperture.

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

Abstract: An electromagnetic wave transmission structure adapted to cause convergence of an electromagnetic wave includes a substrate and a transmission unit provided on the substrate and including an annular metal plate. The annular metal plate has a weighted average inner radius and a weighted average outer radius each related to the wavelength of the electromagnetic wave, the distance between the electromagnetic wave transmission structure and a focal point defined as the point of convergence of the electromagnetic wave, and the distance between the source of the electromagnetic wave and the focal point. The plural inner and outer radii of the annular metal plate have the same trend of variation. Each inner or outer radius corresponds to a weight related to the reference included angle formed between the inner or outer radius and a reference axis.

Abstract: A folded antenna includes: a substrate including a dielectric base material and a ground disposed on a first surface of the dielectric base material; and an antenna element including a bent portion bent in a direction perpendicular to the substrate, and a folded portion further bent in a direction parallel to the substrate from the bent portion and capacitively coupled to the ground via the dielectric base material. An impedance of the folded antenna is adjusted by adjusting an area of the folded portion by changing a width dimension of the folded portion without changing a height dimension of the bent portion.

Abstract: A laser direct structure (LDS) antenna assembly is provided. The LDS antenna assembly includes a carrier having a first portion formed from a first resin and a second portion formed from a second resin that is different than the first resin. The LDS antenna assembly further includes an LDS antenna disposed on the carrier. The LDS antenna assembly includes a component coupled to the LDS antenna via a connection point positioned on a surface of the first portion of the carrier such that the component is in electrical communication with the LDS antenna via the connection point.

Abstract: A sensor device includes a housing, a substrate positioned within the housing, at least one radiative antenna element positioned upon a first surface of the substrate, and a processing section positioned in a stacked arrangement with the substrate, opposite a second surface of the substrate. The substrate includes at least one interruption configured to allow light entering the housing to pass through the substrate from the first surface through the second surface. The antenna elements(s) is positioned upon the substrate so as to avoid the interruption(s). The processing section includes light-responsive circuitry and is configured such that the circuitry is positioned so as to receive light entering the housing through the at least one aperture. The substrate may be generally circular, substantially rigid, have a substantially certain radius between about three-fourths inch and about four inches, and have a substantially certain thickness between about 0.05 inches and about one-half inch.

Abstract: A communication device is made with a metallic frame having an interior mounting surface for receiving one or more functional components. The metallic frame includes a first frame member having a first portion extending uninterrupted across one lateral side of the metallic frame. The first portion provides structural support to the communication device. A T-shaped slot antenna is formed in a second portion of the first frame member adjacent to the first portion. The T-shaped slot antenna has first and second arms separated at a gap and partially encompassing a slot. The second portion of the first frame member enables radio frequency communication by at least one of the functional components via the T-shaped slot antenna of the communication device.

Abstract: A communication device is made with a metallic frame having an interior mounting surface for receiving one or more functional components. The metallic frame includes a first frame member having a first portion extending uninterrupted across one lateral side of the metallic frame. The first portion provides structural support to the communication device. A T-shaped slot antenna is formed in a second portion of the first frame member adjacent to the first portion. The T-shaped slot antenna has first and second arms separated at a gap and partially encompassing a slot. The second portion of the first frame member enables radio frequency communication by at least one of the functional components via the T-shaped slot antenna of the communication device.

Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, an upper electrode layer disposed on the dielectric layer and including a radiation pattern, a lower electrode layer disposed on the dielectric layer, and a bending connection portion integrally connected to the upper electrode layer and the lower electrode layer on the dielectric layer. An interconnection of a ground layer is implemented with high reliability by the bending connection portion.

Abstract: An antenna board includes a first base board unit including a first insulating layer having a first receiving groove; a first antenna board unit disposed in the first receiving groove, including a second insulating layer and a third insulating layer disposed on the second insulating layer, and further including at least one of a first patch pattern disposed on the second insulating layer and covered by the third insulating layer and a second patch pattern disposed on the third insulating layer; and a first encapsulant covering at least a portion of the first antenna board unit and filling at least a portion of the first receiving groove, wherein a dielectric constant of the second insulating layer is different from a dielectric constant of the third insulating layer.