Abstract: A microstrip antenna array including: a thin substrate; two or more microstrip radiating patches placed on a first side of the substrate, each radiating patch including: an input port; a radiating patch width (WRP) extending in a longitudinal direction; a radiating patch length (LRP) extending in a transverse direction, wherein the transverse direction is perpendicular to the longitudinal direction, and wherein the longitudinal and transverse directions are in the plane of the radiating patch; a radiating patch transverse axis (TRP) along the midpoint of the radiating patch width; and a radiating patch longitudinal axis along the midpoint of the radiating patch length, wherein the two or more radiating patches are spaced in the longitudinal direction such that the radiating patch longitudinal axis of each radiating patch is aligned along a common longitudinal axis (C); and one or more parasitic patches placed on the first side of the substrate.

Abstract: A structure includes: a first conductor that extends in a second direction; a second conductor that faces the first conductor in a first direction and that extends along the second direction; a third conductor configured to capacitively connect the first conductor and the second conductor; a fourth conductor that is electrically connected to the first conductor and the second conductor, and that extends along a first plane; and a first resist layer that covers the fourth conductor. The fourth conductor includes a plurality of first areas exposed to outside via a plurality of through holes of the first resist layer. Each of the first conductor and the second conductor includes one or more second areas. The first resist layer extends on the first conductor and the second conductor to cover the fourth conductor, excluding the second areas. The first areas and the second areas are arranged along the first plane.

Abstract: The invention relates to a high-frequency-transparent component comprising: a main body (2) and a coating (3) consisting of metal-doped Al2O3 sputtered thereon, and to a method for producing said component.

Abstract: An antenna positioner provided on a deployable vehicle. The antenna positioner includes a base and a frame having a plurality of plates oriented at an angle relative to one another. Each plate may include a low band antenna and a high band antenna. The base is located inside a chamber of the deployable vehicle. The frame is movable relative to the base between a collapsed position, where the entire frame is positioned within the chamber, and an extended position wherein at least a portion of the frame extends outwardly through an opening in the deployable vehicle's exterior wall. The frame is pivotally engaged with the base and a gearing mechanism pivots the frame between the collapsed position and the extended position to arrange the antennas at a desired orientation relative to the deployable vehicle's exterior wall so as to maximize the antenna's near-vertical Field of View (FoV).

Abstract: One example method includes transmitting a test signal through the transmit channel n, where the test signal is radiated by a service antenna element n corresponding to the transmit channel n and is received by a calibration antenna element in the phased array antenna. N coupling signals received by N calibration antenna elements coupled to the service antenna element n can then be obtained. Delay weighting can then be performed on the N coupling signals based on relative positions of the service antenna element n and each of the N calibration antenna elements to obtain N calibration signals. The N calibration signals can then be combined into the calibration signal corresponding to the transmit channel n. Calibration signals corresponding to all transmit channels in the phased array antenna can then be obtained. At least one of amplitudes or phases of the transmit channels can then be compensated for.

Abstract: Multi-sided antenna modules employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related antenna module fabrication methods. The multi-sided antenna module includes an integrated circuit (IC) die(s) disposed on a first side of the package substrate. The multi-sided antenna module further includes first and second substrate antenna layers disposed on respective first and second sides of the package substrate. The first substrate antenna layer includes a first antenna(s) disposed on the first side of the package substrate adjacent to the IC die(s). The second substrate antenna layer includes a second antenna(s) disposed on the second side of the package substrate opposite of the first side of the package substrate. In this manner, the multi-sided antenna module, including antennas on multiple sides of the package substrate, provides antenna coverage that extends from both sides of the package substrate to provide multiple directions of coverage.

Abstract: Disclosed herein is a coil component that includes a substrate, a coil pattern formed on one surface of the substrate, and a magnetic layer comprising a composite material obtained by dispersing magnetic particles in resin and formed on the one surface of the substrate so as to cover the coil pattern. The coil pattern has a flat shape in which a thickness thereof is smaller than a radial width. Each of the magnetic particles has a flat shape in which a thickness thereof in a direction perpendicular to the one surface of the substrate is smaller than a diameter in a direction parallel to the one surface of the substrate. Some of the magnetic particles exist within a height range of the coil pattern with respect to the one surface of the substrate.

Abstract: An antenna assembly includes one or more dielectrics having a first surface and a second surface opposite from the first surface. An antenna layer includes one or more antenna elements disposed on the first surface of the one or more dielectrics. A stripline feed network is disposed on or within the one or more dielectrics. One or more cavities are formed in the one or more dielectrics. The one or more cavities are disposed below the one more antenna elements.

Abstract: A keyboard module includes a housing, an antenna circuit board, a supporting bracket, an antenna, and a plurality of key caps. The housing includes a bottom wall and a side wall. The antenna circuit board is disposed above the bottom wall. The supporting bracket is disposed above the antenna circuit board, and a gap is formed between an edge of the supporting bracket and the side wall. The supporting bracket includes a notch recessed into the edge, and the notch faces the side wall. The antenna is disposed in the gap, extends into the notch, and is connected to the antenna circuit board. These key caps are disposed above the supporting bracket.

Abstract: Disclosed is a dual-band very low frequency antenna, which comprises positive and negative electrodes, silicon substrates, piezoelectric material units, stress-electromagnetic conversion material units and an insulator. The piezoelectric material units are arranged between the positive and negative electrodes; the stress-electromagnetic conversion material units and the silicon substrates are respectively arranged at both ends of the positive and negative electrodes. The positive and negative electrodes are used for driving the piezoelectric material units; the piezoelectric material units are used for generating flutter and conducting the flutter to the stress-electromagnetic conversion material units; the stress-electromagnetic conversion material units are used for converting vibration waves generated by flutter into electromagnetic wave radiation.

Abstract: Embodiments of a wireless communications antenna of a wearable electronic device, and method of its use are described herein. An apparatus can comprise a housing having top and bottom portions, a printed circuit board (PCB), a metal frame, and a band. The top portion of the housing can include an antenna element, which can be conductively coupled to the PCB. The metal frame can have a first coupler and a second coupler. The PCB can be disposed between, and not conductively coupled to, the housing and the metal frame. The band can have first and second end portions, which can be conductively coupled to the frame when removably coupled to the first coupler and second coupler, respectively. The antenna element, the metal frame, and the first and second end portions of the band can collectively define an antenna having an antenna profile when the antenna is operational.

Abstract: A slot antenna and a communication device including the slot antenna are provided. The slot antenna includes: a dielectric layer having a first surface and a second surface opposite to each other, a radiation layer on the first surface of the dielectric layer and having a plurality of slots therein, and a first shielding layer on the second surface of the dielectric layer and electrically connected to the radiation layer.

Abstract: A radio frequency coupling structure comprising (1) a substrate that forms a top side of a waveguide, (2) a first conductive layer disposed on a bottom side of the substrate, (3) a second conductive layer incorporated within the substrate, (4) a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate, and/or (5) a ring slot formed around the through via in the first conductive layer. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A light fixture includes a housing containing a light engine, and a wireless baffle module. The wireless baffle module includes a baffle coupled to the housing and used for focusing light emitted from the light engine. The wireless baffle module further includes a wireless printed circuit board assembly coupled to an antenna. The wireless printed circuit board assembly receives and processes wireless signals from the antenna, and sends control signals to the light engine based on the wireless signals. The wireless baffle module may be coupled to a lighting system with an existing non-wireless module, or be used to replace a wireless baffle module with the same or different wireless protocol.

Abstract: To implement an antenna device capable of further reducing an influence of proximity to a metal and feeding power to an antenna element in a more suitable manner. An antenna device includes: a substantially-flat-plate-shaped dielectric substrate; a metal base plate arranged on a first surface of the dielectric substrate; substantially-flat-plate-shaped first and second antenna elements arranged on a second surface of the dielectric substrate that is opposite to the first surface and on an opposite side of the dielectric substrate from the metal base plate so that a slit is formed; a first feeding pin that feeds power to the first antenna element; and a second feeding pin that feeds power to the second antenna element, in which a phase difference between feeding signals supplied to the first and second feeding pins, respectively, is approximately 180 degrees.

Abstract: An antenna array system and a method for making the antenna system. The system includes at least two antenna elements serving as transmitter elements, and at least two antenna elements serving as receiver elements. Each of the transmitter antenna and receiver antenna elements include a pair of curved arms, wherein a first arm in the pair of curved arms is configured to be connected from a signal trace of the antenna system. The second arm in the pair of curved arms is configured to be connected to a ground plane.

Abstract: Disclosed herein is an antenna device that includes a filter layer, an antenna layer, a divider layer, and ground patterns. The antenna layer has first and second radiation conductors and first and second ground pillars that surround the first and second radiation conductors, respectively. Each of the first and second ground patterns has a first area that overlaps a first space surrounded by the first ground pillars, a second area that overlaps a second space surrounded by the plurality of second ground pillars, and a third area that connects the first and second areas. A width of the third area in a width direction perpendicular to an arrangement direction of the first and second areas is smaller than a width of each of the first and second areas in the width direction.

Abstract: A waveguide structure includes a dielectric layer, a plurality of circuit layers, a plurality of insulation layers, and a conductor connection layer. The dielectric layer has an opening. The circuit layers are disposed on the dielectric layer. The insulation layers and the circuit layers are alternately stacked. The conductor connection layer covers an outer wall of the opening in a direction perpendicular to the circuit layers and connects at least two circuit layers on two opposite sides of the opening. At least the conductor connection layer and a part of the circuit layers define an air cavity for transmitting signals at a position corresponding to the opening.

Abstract: A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies.

Abstract: The disclosure provides an antenna structure including a ground plane, a first coupling antenna and a reference antenna. The first coupling antenna includes a first excitation source connected to the ground plane. The first excitation source is configured to excite a first resonant mode, and the first coupling antenna forms a first zero current area on the ground plane in response to the first resonant mode. The reference antenna includes a second excitation source connected to the ground plane. The second excitation source is configured to excite a second resonant mode, and the reference antenna forms a second zero current area on the ground plane in response to the second resonant mode. The first excitation source is located in the second zero current area, and the second excitation source is located in the first zero current area.