Abstract: A capacitor module that includes: a case having a bottom surface and a side surface extending from the bottom surface to define an opening that faces the bottom surface, and the side surface including a through hole; one or more of capacitors in the case; a capacitor connection bus bar connected to an electrode of the one or more capacitors; a terminal bus bar extending through the through hole, and includes a first end inside the case and a second end outside the case, the first end being connected to the capacitor connection bus bar; and a sealing resin filled in the case, wherein the capacitor connection bus bar includes a connector, and at least a part of the connector is inclined in a direction from the opening toward the bottom surface of the case and connected to the first end of the terminal bus bar.

Abstract: In a multilayer ceramic capacitor, a relationship of a length in a width direction of a main surface horizontal portion to a length in the width direction of external electrodes is about 0.26 or more and about 0.56 or less, a relationship of a length in a lamination direction of a lateral surface horizontal portion to a length in a lamination direction of each of the external electrodes is about 0.26 or more and about 0.56 or less, a relationship of a length in a length direction of the main surface horizontal portion to a length in a length direction of each of the external electrodes is about 0.26 or more and about 0.56 or less, and a relationship of a length of the lateral surface horizontal portion to a length in a length direction of each of the external electrodes is about 0.26 or more ?0.56.

Abstract: A capacitor includes a first electrode, a second electrode, and a dielectric. The dielectric is disposed between the first electrode and the second electrode. The dielectric includes an oxide having a composition represented by Hf1-x-ySixGayOz. This composition satisfies requirements 0.01?x, 0.05?y?0.11, and 0.09?x+y?0.15.

Abstract: A multilayer ceramic capacitor may include a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed outside the capacitor body, where the dielectric layer may include a plurality of dielectric grains and a grain boundary located between the dielectric grains adjacent to each other, where the dielectric grain may include a barium titanate-based main component including barium (Ba) and titanium (Ti), where the grain boundary includes silicon (Si), dysprosium (Dy), and terbium (Tb), and where silicon (Si), dysprosium (Dy), and terbium (Tb) are included in the grain boundary in content order of terbium (Tb)<dysprosium (Dy)<silicon (Si).

Abstract: A miniaturized capacitor having built-in conductive leads includes a substrate, a main capacitor body, a plurality of conductive members and a plurality of conductive leads. The main capacitor body, disposed on the substrate, includes a capacitor unit and a packaging structure wrapping the capacitor unit. Each of the plurality of conductive members penetrates through the substrate, each of the plurality of conductive leads penetrates through the packaging structure, and the capacitor unit is connected with the plurality of conductive members via the plurality of conductive leads.

Abstract: A capacitor for an implantable medical device has a housing. The housing has a first outer side and a second outer side facing away from the first outer side. The two outer sides are connected to one another via a lateral outer side of the housing running in a circumferential direction of the housing. The lateral outer side has a straight first portion and an arcuate second portion. The first portion has two end regions, which are connected to one another via a middle region of the first portion. The end regions are each connected to the second portion. The capacitor has an electrical terminal arranged on the middle region of the first portion of the lateral outer side, which electrical terminal has two contact surfaces for electrically contacting the capacitor. A capacitor assembly and an implantable medical device are formed with the above describe capacitor.

Abstract: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and an exterior body. The anode lead frame includes a first buried part that is a part of the anode lead frame and is buried in the exterior body. The cathode lead frame includes a second buried part that is a part of the cathode lead frame and is buried in the exterior body. A plurality of recesses are formed on a surface of at least one of the first buried part or the second buried part. The plurality of recesses include a plurality of first recesses formed on a surface of the first buried part. The solid electrolytic capacitor further includes an insulating film disposed to cover at least one selected from the group consisting of at least a part of the anode part and at least one of the plurality of first recesses.

Abstract: A multilayer capacitor includes a capacitor body including a first internal electrode and a second internal electrode stacked with a dielectric layer interposed therebetween, the capacitor body having a first surface and a second surface opposite each other and a third surface extending between the first and second surfaces; and an external electrode including a connection portion disposed at the third surface, and a band portion extending from the connection portion to the first surface and the second surface. The external electrode includes a base electrode in contact with the capacitor body, and a conductive resin layer disposed to cover the base electrode at least partially. A thickness of the conductive resin layer at an end part of the base electrode on the first surface and a thickness of the conductive resin layer at an end part of the base electrode on the second surface are different from each other.

Abstract: A brazing structure for a vacuum container is provided. The vacuum container includes: a fixed conductor on which a fixed electrode is supported; a movable conductor on which a movable electrode is supported; a flange pipe which is bonded to the movable conductor coaxially with the fixed electrode and the movable electrode; and a ceramic pipe which is provided coaxially therewith. One end of the ceramic pipe is bonded to the fixed conductor by brazing, with a linking flange pipe therebetween, and the other end thereof is bonded to the flange pipe by brazing, with a linking flange pipe therebetween. The linking flange pipe includes a bonding portion that is bonded to the ceramic pipe by active metal brazing using an AgCuTi-based, AgCuInTi-based, or AgCuSnTi-based metal.

Abstract: A solid electrolytic capacitor element includes an anode body; a dielectric layer formed on a surface of the anode body; a solid electrolyte layer that covers at least a portion of the dielectric layer; and a carbon layer that covers at least a portion of the solid electrolyte layer and contains carbon particles. The carbon layer shows a D/G ratio of 1.5 or less, the D/G ratio being a ratio of an intensity of a D band relative to an intensity of a G band in a Raman spectrum of the carbon layer.

Abstract: A capacitor structure includes a first comb-shaped electrode, a second comb-shaped electrode, a bottom electrode, an insulator layer, and a top electrode. The first comb-shaped electrode has a first pad and first fingers connecting to the first pad. The second comb-shaped electrode has a second pad and second fingers connecting to the first pad, wherein one of the second fingers is disposed between two adjacent first fingers. The bottom electrode includes a first portion, a second portion and a third portion which are spaced apart, wherein the first portion and the third portion are electrically coupled to the first comb-shaped electrode and the second comb-shaped electrode, respectively. The insulator layer is disposed over the bottom electrode. The top electrode is disposed over the insulator layer.

Abstract: A nanocomposite electrode and supercapacitor thereof are disclosed. The nanocomposite electrode includes a substrate, at least one binding compound, at least one carbonaceous compound, and vanadium doped spinel ferrite nanoparticles (V-SFNPs). The V-SFNPs have a formula of CoxNi1-xVyFe2-yOz, wherein x=0.1-0.9, y=0.01-0.10, and z=3-5. The substrate is at least partially coated on a first side with a mixture comprising the V-SFNPs, the at least one binding compound, and the at least one carbonaceous compound. Two of the nanocomposite electrodes are combined to form the supercapacitor.

Abstract: A nanocomposite electrode and supercapacitor thereof are disclosed. The nanocomposite electrode includes a substrate, at least one binding compound, at least one carbonaceous compound, and vanadium doped spinel ferrite nanoparticles (V-SFNPs). The V-SFNPs have a formula of CoxNi1-xVyFe2-yOz, wherein x=0.1-0.9, y=0.01-0.10, and z=3-5. The substrate is at least partially coated on a first side with a mixture comprising the V-SFNPs, the at least one binding compound, and the at least one carbonaceous compound. Two of the nanocomposite electrodes are combined to form the supercapacitor.

Abstract: A multilayer ceramic electronic component that includes: a ceramic layer that contains a Ba—Nd—Ti oxide, forsterite, barium borosilicate glass, and MnO; and an electrode in contact with the ceramic layer, wherein the ceramic layer includes a Nd uneven distribution portion where Nd is unevenly distributed at an interface where the ceramic layer is in contact with the electrode.

Abstract: A composite electronic component according to an example embodiment includes: a multilayer ceramic capacitor including a body including dielectric layers, first and second internal electrodes, and first and second external electrodes, first and second interposer connected to the first and second external electrodes, respectively. The first and second interposer respectively include first and second connection units, first and second mounting units, first and second connection vias penetrating through the first and second connection unit, respectively, and first and second mounting vias penetrating through the first and second mounting units, respectively. The first connection via and the first mounting via are disposed so as not to overlap each other based on the first direction, and the second connection via and the second mounting via are disposed so as not to overlap each other based on the first direction.

Abstract: An electronic component structure includes: a first electronic component; a second electronic component; a low melting point layer located between the first electronic component and the second electronic component and containing a first metal material having a melting point of 300° C. or lower; and a high melting point layer located between the first electronic component and the second electronic component and containing a second metal material having a melting point of 400° C. or higher. In the electronic component structure, the first electronic component and the second electronic component are connected to each other by a multilayer connection portion formed by overlapping the low melting point layer and the high melting point layer.

Abstract: An electrolytic capacitor with low ESR even in the high frequency range, and the manufacturing method thereof are provided. The solid electrolytic capacitor includes anode foil, a cathode body, and an electrolyte layer. The anode foil id formed of valve action metal, and dielectric oxide film is formed on a surface thereof. The cathode body includes cathode foil formed of valve action metal and a conductive layer formed a surface of the cathode foil. The electrolyte layer intervenes between the anode foil and the cathode foil, and includes electrolytic solution and conductive polymers. The electrolytic solution includes phosphoric acid compound having alkyl groups with the carbon number of 1 to 10.

Abstract: A tantalum capacitor including a capacitor body including a tantalum body including a tantalum wire exposed on one side and a capsule portion configured to surround the tantalum body so that an end of the tantalum wire is exposed; a first metal layer on one side of the capacitor body and a second metal layer on one side of the first metal layer; and an external electrode connected to the first metal layer, wherein the first metal layer includes Cr (chromium), Ti (titanium), an alloy thereof, or a mixture thereof, and the second metal layer includes Ni (nickel), an alloy including the same, or a mixture including the same.

Abstract: The present disclosure provides an adjustable capacitor and an electronic apparatus, and relates to the technical field of radio frequency device. The adjustable capacitor of the present disclosure includes a base substrate and at least one capacitor unit on the base substrate, each of the at least one capacitor unit includes a first plate, a second plate and a first connecting arm; the first plate and the connecting arm are on the base substrate; one end of the second plate is connected to the first connecting arm, the second plate and the first plate are opposite to each other, and a certain distance is between the second plate and the first plate.

Abstract: The present disclosure provides a core package, an aluminum electrolytic capacitor and a packaging method thereof. The core package includes a plurality of first electrode foils and second electrode foils laminated one on another, each of the first electrode foils is an anode foil or a cathode foil, and the second electrode foil is the other. Among the plurality of first electrode foils, a first conductive foil is arranged at the edge of each of the first electrode foils, a first portion of the first conductive foil is electrically coupled to the corresponding first electrode foil, and a second portion of the first conductive foil extends and protrudes relative to the corresponding first electrode foil; and the plurality of first conductive foils are connected to a first conductive foil strip through the second portion; and an oxide film is formed on a surface of the first conductive foil.