Abstract: A capacitor structure includes a first comb-shaped electrode, a second comb-shaped electrode, a bottom electrode, an insulator layer, and a top electrode. The first comb-shaped electrode has a first pad and first fingers connecting to the first pad. The second comb-shaped electrode has a second pad and second fingers connecting to the first pad, wherein one of the second fingers is disposed between two adjacent first fingers. The bottom electrode includes a first portion, a second portion and a third portion which are spaced apart, wherein the first portion and the third portion are electrically coupled to the first comb-shaped electrode and the second comb-shaped electrode, respectively. The insulator layer is disposed over the bottom electrode. The top electrode is disposed over the insulator layer.

Abstract: A nanocomposite electrode and supercapacitor thereof are disclosed. The nanocomposite electrode includes a substrate, at least one binding compound, at least one carbonaceous compound, and vanadium doped spinel ferrite nanoparticles (V-SFNPs). The V-SFNPs have a formula of CoxNi1-xVyFe2-yOz, wherein x=0.1-0.9, y=0.01-0.10, and z=3-5. The substrate is at least partially coated on a first side with a mixture comprising the V-SFNPs, the at least one binding compound, and the at least one carbonaceous compound. Two of the nanocomposite electrodes are combined to form the supercapacitor.

Abstract: A nanocomposite electrode and supercapacitor thereof are disclosed. The nanocomposite electrode includes a substrate, at least one binding compound, at least one carbonaceous compound, and vanadium doped spinel ferrite nanoparticles (V-SFNPs). The V-SFNPs have a formula of CoxNi1-xVyFe2-yOz, wherein x=0.1-0.9, y=0.01-0.10, and z=3-5. The substrate is at least partially coated on a first side with a mixture comprising the V-SFNPs, the at least one binding compound, and the at least one carbonaceous compound. Two of the nanocomposite electrodes are combined to form the supercapacitor.

Abstract: A multilayer ceramic electronic component that includes: a ceramic layer that contains a Ba—Nd—Ti oxide, forsterite, barium borosilicate glass, and MnO; and an electrode in contact with the ceramic layer, wherein the ceramic layer includes a Nd uneven distribution portion where Nd is unevenly distributed at an interface where the ceramic layer is in contact with the electrode.

Abstract: A composite electronic component according to an example embodiment includes: a multilayer ceramic capacitor including a body including dielectric layers, first and second internal electrodes, and first and second external electrodes, first and second interposer connected to the first and second external electrodes, respectively. The first and second interposer respectively include first and second connection units, first and second mounting units, first and second connection vias penetrating through the first and second connection unit, respectively, and first and second mounting vias penetrating through the first and second mounting units, respectively. The first connection via and the first mounting via are disposed so as not to overlap each other based on the first direction, and the second connection via and the second mounting via are disposed so as not to overlap each other based on the first direction.

Abstract: An electronic component structure includes: a first electronic component; a second electronic component; a low melting point layer located between the first electronic component and the second electronic component and containing a first metal material having a melting point of 300° C. or lower; and a high melting point layer located between the first electronic component and the second electronic component and containing a second metal material having a melting point of 400° C. or higher. In the electronic component structure, the first electronic component and the second electronic component are connected to each other by a multilayer connection portion formed by overlapping the low melting point layer and the high melting point layer.

Abstract: An electrolytic capacitor with low ESR even in the high frequency range, and the manufacturing method thereof are provided. The solid electrolytic capacitor includes anode foil, a cathode body, and an electrolyte layer. The anode foil id formed of valve action metal, and dielectric oxide film is formed on a surface thereof. The cathode body includes cathode foil formed of valve action metal and a conductive layer formed a surface of the cathode foil. The electrolyte layer intervenes between the anode foil and the cathode foil, and includes electrolytic solution and conductive polymers. The electrolytic solution includes phosphoric acid compound having alkyl groups with the carbon number of 1 to 10.

Abstract: A tantalum capacitor including a capacitor body including a tantalum body including a tantalum wire exposed on one side and a capsule portion configured to surround the tantalum body so that an end of the tantalum wire is exposed; a first metal layer on one side of the capacitor body and a second metal layer on one side of the first metal layer; and an external electrode connected to the first metal layer, wherein the first metal layer includes Cr (chromium), Ti (titanium), an alloy thereof, or a mixture thereof, and the second metal layer includes Ni (nickel), an alloy including the same, or a mixture including the same.

Abstract: The present disclosure provides an adjustable capacitor and an electronic apparatus, and relates to the technical field of radio frequency device. The adjustable capacitor of the present disclosure includes a base substrate and at least one capacitor unit on the base substrate, each of the at least one capacitor unit includes a first plate, a second plate and a first connecting arm; the first plate and the connecting arm are on the base substrate; one end of the second plate is connected to the first connecting arm, the second plate and the first plate are opposite to each other, and a certain distance is between the second plate and the first plate.

Abstract: The present disclosure provides a core package, an aluminum electrolytic capacitor and a packaging method thereof. The core package includes a plurality of first electrode foils and second electrode foils laminated one on another, each of the first electrode foils is an anode foil or a cathode foil, and the second electrode foil is the other. Among the plurality of first electrode foils, a first conductive foil is arranged at the edge of each of the first electrode foils, a first portion of the first conductive foil is electrically coupled to the corresponding first electrode foil, and a second portion of the first conductive foil extends and protrudes relative to the corresponding first electrode foil; and the plurality of first conductive foils are connected to a first conductive foil strip through the second portion; and an oxide film is formed on a surface of the first conductive foil.

Abstract: Multilayer capacitors are provided. For example, a multilayer capacitor may include first and second terminals adjacent first and second opposing end surfaces, respectively, and a plurality of active electrode layers, each active electrode layer including a first active electrode electrically connected with the first terminal and a second active electrode electrically connected with the second terminal. The first active electrode may be spaced apart from the second active electrode in a lengthwise direction to form an active electrode end gap. The multilayer capacitor also may include a plurality of floating electrode layers, including topmost and bottommost floating electrode layers. The plurality of active electrode layers may be an odd number such that a topmost active electrode layer is disposed between the topmost floating electrode layer and a top surface and a bottommost active electrode layer is disposed between the bottommost floating electrode layer and a bottom surface.

Abstract: A multilayer ceramic electronic component includes a first extension portion including a bent portion in a cross section. The multilayer body is divided into four regions by a straight line passing through a middle portion of the multilayer body in a lamination direction and a straight line passing through a middle portion of the multilayer body in a length direction, and a region adjacent to a first main surface and a first end surface among the divided four regions is defined as a first reference region, and a regression line derived based on values of x and y with respect to the bent portion in a reference region is defined as a virtual connection line, the virtual connection line intersects an effective layer portion.

Abstract: The present disclosure provides a core package, an aluminum electrolytic capacitor and a packaging method thereof. The core package includes a plurality of first electrode foils and second electrode foils laminated one on another, each of the first electrode foils is an anode foil a cathode foil, and the second electrode foil is the other. Among the plurality of first electrode foils, a first conductive foil is arranged at the edge of each of the first electrode foils, a first portion of the first conductive foil is electrically coupled to the corresponding first electrode foil, and a second portion of the first conductive foil extends and protrudes relative to the corresponding first electrode foil; and the plurality of first conductive foils are connected to a first conductive foil strip through the second portion; and an oxide film is formed on a surface of the first conductive foil.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and an internal electrode including a conductive material, and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a Sn diffusion portion including Sn in a region connected to the external electrode, and a ratio of an average number of atoms of the Sn compared to an average number of atoms of the conductive material other than the Sn of the internal electrode included in the Sn diffusion portion is 3% or more and 50% or less.

Abstract: To provide electronic component in which bonding strength between external electrode and plating layer and bonding strength between external electrode and internal conductor can be increased. Electronic component according to present disclosure includes element body, interlayer connection conductor provided inside element body so as to extend to main surface of element body, external electrode formed on main surface of element body so as to cover interlayer connection conductor, and plating layer covering external electrode. Plating layer includes impregnation part that is impregnated into interlayer connection conductor.

Abstract: A multilayer ceramic capacitor includes: a capacitor body that includes a dielectric layer and an internal electrode layer; and an external electrode that is disposed outside the capacitor body. The internal electrode layer includes nickel (Ni) and cerium (Ce), and along a thickness direction of the internal electrode layer, the internal electrode layer comprises an upper portion, a middle portion, and a lower portion, the middle portion is referred to as a central region, and at least one of the upper portion and the lower portion having an interface between the internal electrode layer and the dielectric layer is referred to as an interface region, both the central region and the interface region of the internal electrode layer include the cerium (Ce), and the interface region includes the cerium (Ce) in a content higher than a content of cerium (Ce) in the central region.

Abstract: There is provided a capacitor (1) including a main body (10), in which a plurality of dielectric layers (13) and a plurality of electrode layers (11) are alternatively laminated, and an external electrode (20) that is connected to at least part of the main body. Before forming an external electrode by metal spraying (metallikon) on the main body, at least part of a connection surface (30) where the metal spraying is performed is scanned with a laser beam (51) so that scanning marks (55) composed of concave-convex structures (35) are formed by the laser beam on at least part of the connection surface.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, in which the body includes a capacitance formation portion and margin portions disposed on both surfaces of the capacitance formation portion in a width direction, the margin portions include a first region adjacent to the capacitance formation portion, a third region adjacent to an external surface of the margin portion, and a second region disposed between the first and third regions, and G2>G1 and G2>G3 when an average grain size of a dielectric grain included in the first region is referred to as G1, an average grain size of a dielectric grain included in the second region is referred to as G2, and an average grain size of a dielectric grain included in the third region is referred to as G3.

Abstract: A multilayer ceramic capacitor includes a multilayer body and three or more external electrodes. A first internal electrode layer includes a first counter electrode portion, a first extension portion, and a second extension portion. The first counter electrode portion includes a first central region, a first connection region connected to the first extension portion, and a second connection region connected to the second extension portion. Coverages of the first and second connection regions with respect to the dielectric layers are higher than a coverage of the first central region with respect to the dielectric layers, and coverages of the first and second extension portions with respect to the dielectric layers are higher than the coverage of the first central region with respect to the dielectric layers.

Abstract: A capacitor that includes: a capacitor element; an external electrode on an end face of the capacitor element; and a lead terminal bonded to the external electrode, wherein the external electrode has a porosity of 8% to 20%. The external electrode may be a metallikon electrode. The external electrode may also contain an alloy of zinc and aluminum.