Abstract: A capacitor structure includes a first electrode, a second electrode, a dielectric layer between the first electrode and the second electrode, a first oxygen donor layer between the dielectric layer and the first electrode, a second oxygen donor layer between the dielectric layer and the second electrode, a first conductive layer between the first oxygen donor layer and the dielectric layer, and a second conductive layer between the second oxygen donor layer and the dielectric layer. An oxygen concentration of the first oxygen donor layer increases. An oxygen concentration of the second oxygen donor layer increases. A metal atom of the first electrode and a metal atom of the second electrode are different from a metal atom of the first oxygen donor layer and different from a metal atom of the second oxygen donor layer.

Abstract: A solid electrolytic capacitor including: an anode plate having a porous layer on at least one main surface thereof; a dielectric layer on the porous layer; a cathode layer on the dielectric layer, the cathode layer including a solid electrolyte layer on the surface of the dielectric layer, and a conductor layer on a surface of the solid electrolyte layer, and the solid electrolyte layer including a first solid electrolyte layer in a region including an inside of pores of the dielectric layer, and a second solid electrolyte layer covering the first solid electrolyte layer; a mask layer made of an insulating material and located in a region surrounding the cathode layer at a peripheral edge of the porous layer; and a columnar layer made of an insulating material and located at a distance from the mask layer in a region surrounded by the cathode layer in the porous layer.

Abstract: Dielectric layers include outer dielectric layers and inner dielectric layers. The outer dielectric layers are located between a first principal surface and an internal electrode layer located closest to the first principal surface in a thickness direction and between a second principal surface and an internal electrode layer located closest to the second principal surface in the thickness direction. The inner dielectric layers are located between internal electrode layers adjacent to each other in the thickness direction. In an element body portion, side margin portions, which are located in a width direction between a first side surface and a plurality of internal electrode layers and between a second side surface and a plurality of internal electrode layers, have a higher Mn content than the inner dielectric layers.

Abstract: An integrated passive device (IPD) comprises a first and second stacked capacitors, each including a conductive substrate having a front side and a back side, a front dielectric layer on the front side of the conductive substrate, a back dielectric layer on the back side of the conductive substrate, a front conductive polymer layer on the front dielectric layer, and a back conductive polymer layer on the back dielectric layer. The IPD may comprise a first metal contact electrically connected to one or both of the conductive substrates of the first and second capacitors and a second metal contact electrically isolated from the first metal contact and electrically connected to the front and back conductive polymer layers of the first and second capacitors. The IPD may comprise a passthrough electrical connection between front and back outer surfaces of the IPD.

Abstract: A multilayer ceramic capacitor may include a ceramic body, a plurality of first internal electrodes and a plurality of second internal electrodes disposed inside the ceramic body, first and second external electrodes disposed respectively on first and second opposing surfaces of the ceramic body, the first and second external electrodes respectively including first and second electrode layers disposed on the first and second surfaces and electrically connected respectively to the plurality of first and second internal electrodes, first and second conductive carbon layers disposed respectively on the first and second electrode layers, and first and second metal layers disposed on a fifth surface of the ceramic body, connecting the first and second surfaces, and in contact respectively with the first and second conductive carbon layers between the first surface and the fifth surface, and between the second surface and the fifth surface.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with the plurality of dielectric layers in a first direction, and an external electrode disposed on the body. One of the plurality of internal electrodes includes Ni and In. In the one of the plurality of internal electrodes, among points 10 nm away from an interface with one of the plurality of dielectric layers, a ratio of points at which a molar ratio of In/(Ni+In) is 0.002 or more is 70% or more, and among central points in the first direction, a ratio of points at which the molar ratio of In/(Ni+In) is 0.002 or more is 35% or less.

Abstract: A multilayer ceramic electronic device includes an element body including a dielectric layer and an electrode layer laminated. The dielectric layer contains a main component represented by ABO3. The dielectric layer contains above 0 mol and less than 0.050 mol Mn oxide in terms of MnO; 1.00 mol or more and 2.50 mol or less Mg oxide in terms of MgO; 0.50 mol or more and 1.50 mol or less R oxide in terms of R2O3, where R includes at least one of Y, Dy, Ho, Yb, Lu, Gd, and Tb; and 0.05 mol or more and 0.45 mol or less Zr oxide in terms of ZrO2, with respect to 100 mol of the main component and further contains Si. The dielectric layer has a Zr/Mn ratio of 5.0 or more and 12.5 or less and a Zr/Si ratio of 0.40 or more and 0.80 or less in atomic ratio.

Abstract: Compositions and methods for creating in situ capacitors, micro-capacitors, battery like applications, and chipless memory chips are provided. The methods and compositions all comprise the use of magnetically-alignable particles. In various applications herein the particles may be nonconductive, in another aspect, the particles are conductive. The functional capacitors entail the ferromagnetic particles and a dielectric material or a non-conductive coating.

Abstract: A power capacitor includes a body that defines an interior space; and at least one capacitive device in the interior space. The capacitive device includes a first electrode; and a second electrode separated from the second electrode. The power capacitor also includes a dielectric nanofluid in the interior space and between the first electrode and the second electrode, the dielectric nanofluid including: a base dielectric fluid; and nanoparticles dispersed in the base dielectric fluid.

Abstract: A capacitor module that includes: a case having a bottom surface and a side surface extending from the bottom surface to define an opening that faces the bottom surface, and the side surface including a through hole; one or more of capacitors in the case; a capacitor connection bus bar connected to an electrode of the one or more capacitors; a terminal bus bar extending through the through hole, and includes a first end inside the case and a second end outside the case, the first end being connected to the capacitor connection bus bar; and a sealing resin filled in the case, wherein the capacitor connection bus bar includes a connector, and at least a part of the connector is inclined in a direction from the opening toward the bottom surface of the case and connected to the first end of the terminal bus bar.

Abstract: In a multilayer ceramic capacitor, a relationship of a length in a width direction of a main surface horizontal portion to a length in the width direction of external electrodes is about 0.26 or more and about 0.56 or less, a relationship of a length in a lamination direction of a lateral surface horizontal portion to a length in a lamination direction of each of the external electrodes is about 0.26 or more and about 0.56 or less, a relationship of a length in a length direction of the main surface horizontal portion to a length in a length direction of each of the external electrodes is about 0.26 or more and about 0.56 or less, and a relationship of a length of the lateral surface horizontal portion to a length in a length direction of each of the external electrodes is about 0.26 or more ?0.56.

Abstract: A capacitor includes a first electrode, a second electrode, and a dielectric. The dielectric is disposed between the first electrode and the second electrode. The dielectric includes an oxide having a composition represented by Hf1-x-ySixGayOz. This composition satisfies requirements 0.01?x, 0.05?y?0.11, and 0.09?x+y?0.15.

Abstract: A multilayer ceramic capacitor may include a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed outside the capacitor body, where the dielectric layer may include a plurality of dielectric grains and a grain boundary located between the dielectric grains adjacent to each other, where the dielectric grain may include a barium titanate-based main component including barium (Ba) and titanium (Ti), where the grain boundary includes silicon (Si), dysprosium (Dy), and terbium (Tb), and where silicon (Si), dysprosium (Dy), and terbium (Tb) are included in the grain boundary in content order of terbium (Tb)<dysprosium (Dy)<silicon (Si).

Abstract: A miniaturized capacitor having built-in conductive leads includes a substrate, a main capacitor body, a plurality of conductive members and a plurality of conductive leads. The main capacitor body, disposed on the substrate, includes a capacitor unit and a packaging structure wrapping the capacitor unit. Each of the plurality of conductive members penetrates through the substrate, each of the plurality of conductive leads penetrates through the packaging structure, and the capacitor unit is connected with the plurality of conductive members via the plurality of conductive leads.

Abstract: A capacitor for an implantable medical device has a housing. The housing has a first outer side and a second outer side facing away from the first outer side. The two outer sides are connected to one another via a lateral outer side of the housing running in a circumferential direction of the housing. The lateral outer side has a straight first portion and an arcuate second portion. The first portion has two end regions, which are connected to one another via a middle region of the first portion. The end regions are each connected to the second portion. The capacitor has an electrical terminal arranged on the middle region of the first portion of the lateral outer side, which electrical terminal has two contact surfaces for electrically contacting the capacitor. A capacitor assembly and an implantable medical device are formed with the above describe capacitor.

Abstract: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and an exterior body. The anode lead frame includes a first buried part that is a part of the anode lead frame and is buried in the exterior body. The cathode lead frame includes a second buried part that is a part of the cathode lead frame and is buried in the exterior body. A plurality of recesses are formed on a surface of at least one of the first buried part or the second buried part. The plurality of recesses include a plurality of first recesses formed on a surface of the first buried part. The solid electrolytic capacitor further includes an insulating film disposed to cover at least one selected from the group consisting of at least a part of the anode part and at least one of the plurality of first recesses.

Abstract: A multilayer capacitor includes a capacitor body including a first internal electrode and a second internal electrode stacked with a dielectric layer interposed therebetween, the capacitor body having a first surface and a second surface opposite each other and a third surface extending between the first and second surfaces; and an external electrode including a connection portion disposed at the third surface, and a band portion extending from the connection portion to the first surface and the second surface. The external electrode includes a base electrode in contact with the capacitor body, and a conductive resin layer disposed to cover the base electrode at least partially. A thickness of the conductive resin layer at an end part of the base electrode on the first surface and a thickness of the conductive resin layer at an end part of the base electrode on the second surface are different from each other.

Abstract: A brazing structure for a vacuum container is provided. The vacuum container includes: a fixed conductor on which a fixed electrode is supported; a movable conductor on which a movable electrode is supported; a flange pipe which is bonded to the movable conductor coaxially with the fixed electrode and the movable electrode; and a ceramic pipe which is provided coaxially therewith. One end of the ceramic pipe is bonded to the fixed conductor by brazing, with a linking flange pipe therebetween, and the other end thereof is bonded to the flange pipe by brazing, with a linking flange pipe therebetween. The linking flange pipe includes a bonding portion that is bonded to the ceramic pipe by active metal brazing using an AgCuTi-based, AgCuInTi-based, or AgCuSnTi-based metal.

Abstract: A solid electrolytic capacitor element includes an anode body; a dielectric layer formed on a surface of the anode body; a solid electrolyte layer that covers at least a portion of the dielectric layer; and a carbon layer that covers at least a portion of the solid electrolyte layer and contains carbon particles. The carbon layer shows a D/G ratio of 1.5 or less, the D/G ratio being a ratio of an intensity of a D band relative to an intensity of a G band in a Raman spectrum of the carbon layer.

Abstract: A capacitor structure includes a first comb-shaped electrode, a second comb-shaped electrode, a bottom electrode, an insulator layer, and a top electrode. The first comb-shaped electrode has a first pad and first fingers connecting to the first pad. The second comb-shaped electrode has a second pad and second fingers connecting to the first pad, wherein one of the second fingers is disposed between two adjacent first fingers. The bottom electrode includes a first portion, a second portion and a third portion which are spaced apart, wherein the first portion and the third portion are electrically coupled to the first comb-shaped electrode and the second comb-shaped electrode, respectively. The insulator layer is disposed over the bottom electrode. The top electrode is disposed over the insulator layer.